Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2005
11/16/2005CN1696996A Flat display
11/16/2005CN1227738C Hybrid white light source comprising LED and phosphor-LED
11/16/2005CN1227725C Noise shielded multi-layer substrates and manufacture thereof
11/15/2005US6965166 Semiconductor device of chip-on-chip structure
11/15/2005US6965163 Substrate-less microelectronic package
11/15/2005US6965160 Semiconductor dice packages employing at least one redistribution layer
11/15/2005US6965154 Semiconductor device
11/15/2005US6965107 Semiconductor-based encapsulated infrared sensor and electronic device
11/15/2005US6964896 Methods of forming semiconductor logic circuitry, and semiconductor logic circuit constructions
11/15/2005US6964885 Stress resistant land grid array (LGA) module and method of forming the same
11/10/2005WO2005106978A1 Light-emitting device and method for manufacturing same
11/10/2005WO2005106954A2 Power semiconductor circuit and method for producing a power semiconductor circuit
11/10/2005WO2005106926A2 Light emitting diode component
11/10/2005WO2005076319A3 Semiconductor component comprising a semiconductor chip stack on a wiring frame and method for producing the same
11/10/2005WO2005069354A3 Advanced packaging shell for pocketable consumer electronic devices
11/10/2005WO2005043631A3 Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device
11/10/2005WO2005029185A3 Led lighting source and led lighting apparatus
11/10/2005US20050250310 Multi-layer interconnection circuit module and manufacturing method thereof
11/10/2005US20050250254 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
11/10/2005US20050250247 Method for internal electrical insulation of a substrate for a power semiconductor module
11/10/2005US20050249463 Snap-fit optical element for optical coupling between a light source and target element using surface mount technology
11/10/2005US20050249331 Solid state X-ray detector with improved spatial resolution
11/10/2005US20050248036 Multi-chip package with high-speed serial communications between semiconductor die
11/10/2005US20050248023 Circuit board with high density power semiconductors
11/10/2005US20050248021 Multi-mode integrated circuit structure
11/10/2005US20050248019 Overhang support for a stacked semiconductor device, and method of forming thereof
11/10/2005US20050248018 Multi-mode integrated circuit structure
11/10/2005US20050248017 Electronic circuit package
11/10/2005US20050248010 Semiconductor package and system module
11/10/2005US20050248009 Circuit device
11/10/2005US20050248008 Optical surface mount technology package
11/10/2005US20050247947 High density LED array
11/10/2005US20050247859 Package structure of a stack-type light-sensing element and package method thereof
11/10/2005US20050247665 Method of manufacturing an electronic parts packaging structure
11/10/2005US20050246891 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
11/10/2005DE202004011869U1 Light-emitting diode device, has e.g. pulse-width modulator for supplying current to two antiparallel-connected LEDs
11/10/2005DE102005016845A1 Leuchtdiodenarray mit einer Haftschicht Emitting diode array with an adhesive layer
11/10/2005DE102004019447A1 Vorrichtung, insbesondere intelligentes Leistungsmodul, mit planarer Verbindungstechnik Device, especially intelligent power module, with planar connection technology
11/10/2005DE102004019161A1 Verfahren und eine Vorrichtung zum Auftragen von mehrkomponentigen Auftragmassen A method and an apparatus for applying plural component coating compositions
11/10/2005DE102004018471A1 Leistungshalbleiterschaltung und Verfahren zum Herstellen einer Leistungshalbleiterschaltung Power semiconductor circuit and method for manufacturing a power semiconductor circuit
11/09/2005EP1594168A1 Solar cell panel
11/09/2005EP1594167A1 Optoelectronic receiver
11/09/2005EP1594165A2 Method of electrically insulating a substrate for a power-device
11/09/2005EP1594164A1 Integrated circuit for driving semiconductor device and power converter
11/09/2005EP1421617B1 Power electronics component
11/09/2005EP1055256B1 Led light panel severable by cutting into a plurality of operable pieces
11/09/2005CN1695286A Three-phase ac generator for vehicle
11/09/2005CN1695246A 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
11/09/2005CN1694270A Optical surface mount technology package
11/09/2005CN1694251A Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
11/09/2005CN1694250A High-frequency circuit module and radio communication apparatus
11/09/2005CN1694248A Semiconductor device and manufacturing method therefor
11/09/2005CN1693969A LED lamp unit
11/09/2005CN1693932A Snap-fit optical element for optical coupling between a light source and target element
11/09/2005CN1226905C Electronic element and its producing method
11/09/2005CN1226789C Power feed and heat dissipating device for power semiconductor devices
11/09/2005CN1226758C Capacitor module and semiconductor device using same
11/08/2005US6963166 LED lamp
11/08/2005US6963135 Semiconductor package for memory chips
11/08/2005US6963134 Semiconductor sensor with substrate having a certain electric potential
11/08/2005US6963129 Multi-chip package having a contiguous heat spreader assembly
11/08/2005US6963128 Vertically mountable and alignable semiconductor device assembly
11/08/2005US6963085 Solid-state display with improved color-mixing
11/08/2005US6962872 High density chip carrier with integrated passive devices
11/08/2005US6962867 Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof
11/08/2005US6962865 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument
11/08/2005US6961993 Method of transferring and mounting elements
11/03/2005WO2005104636A1 Electronics module and method for manufacturing the same
11/03/2005WO2005104635A1 Heat conduction from an embedded component
11/03/2005WO2005104249A1 Semiconductor chip for driving light emitting element, light emitting device and lighting equipment
11/03/2005WO2005104248A1 Semiconductor chip for driving light emitting element, light emitting device, and lighting device
11/03/2005WO2005104227A1 Stacked module systems and methods
11/03/2005WO2005103180A1 Adhesive sheet, semiconductor device and process for producing semiconductor device
11/03/2005WO2004107457A3 Led inspection lamp, cluster led, and led with stabilizing agents
11/03/2005US20050245052 Semiconductor device having a gettering layer
11/03/2005US20050243966 X-ray transmissive optical mirror apparatus
11/03/2005US20050243577 LED lamp unit
11/03/2005US20050242426 Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
11/03/2005US20050242423 Stacked module systems and methods
11/03/2005US20050242422 Semiconductor component having multiple stacked dice
11/03/2005US20050242421 Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
11/03/2005US20050242362 Card-type LED illumination source
11/03/2005US20050242355 LED arrangement
11/03/2005DE10350913B4 Leuchtdioden-Modul und Verfahren zu dessen Herstellung Light-emitting module and method of producing the
11/03/2005DE10258570B4 Leistungshalbleitermodul The power semiconductor module
11/03/2005DE102005016830A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
11/03/2005DE102005008491A1 Harzgekapselte Halbleitervorrichtung und Verfahren zu ihrer Herstellung Resin-encapsulated semiconductor device and process for their preparation
11/03/2005DE102004055815A1 Mounting plate for electronic components has cooling conduits integrated in a plate body and a fastening device for mounting components
11/03/2005DE102004047358B3 In zwei Halbleiterkörpern integrierte Schaltungsanordnung mit einem Leistungsbauelement und einer Ansteuerschaltung Integrated in two semiconductor bodies circuit arrangement having a power component and a drive circuit
11/03/2005DE102004018477A1 Semiconductor module e.g. for power converters, has first electrode between heat-sinks and second electrode between first electrode and second heat sink
11/03/2005DE102004018476A1 Leistungshalbleiteranordnung Power semiconductor device
11/02/2005EP1592124A2 Radio-frequency circuit module and radio communication apparatus
11/02/2005EP1592074A2 Light emitting diode assembly
11/02/2005EP1592063A2 Assembly in pressure contact with a power semiconductor module
11/02/2005EP1592062A1 Multi-level package for a memory module
11/02/2005EP1590994A2 Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus
11/02/2005EP1590831A2 Light emitting devices
11/02/2005EP1590830A1 Single-phase power converter module
11/02/2005EP1482567A9 Light-emitting device comprising led chip and method for manufacturing this device
11/02/2005CN1692685A Module comprising built-in electronic components
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