Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
11/2005
11/24/2005WO2004091838A3 Method of soldering or brazing articles having surfaces that are difficult to bond
11/24/2005US20050262318 System, device, and method for improved mirror mode operation of a semiconductor memory device
11/24/2005US20050260796 Circuit device, manufacturing method thereof, and sheet-like board member
11/24/2005US20050260777 Organic luminous diode, method for the production thefeof and uses thereof
11/24/2005US20050259423 Light-emitting electronic component
11/24/2005US20050258853 Semiconductor device and interposer
11/24/2005US20050258548 Capacitor-built-in-type printed wiring substrate printed wiring substrate, and capacitor
11/24/2005US20050258547 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof
11/24/2005US20050258546 Stacked dies having shared access to memory
11/24/2005US20050258545 Multiple die package with adhesive/spacer structure and insulated die surface
11/24/2005US20050258538 Double density method for wirebond interconnect
11/24/2005US20050258533 Semiconductor device mounting structure
11/24/2005US20050258531 Semiconductor device and manufacturing process thereof
11/24/2005US20050258530 Micropede stacked die component assembly
11/24/2005US20050258529 High-frequency chip packages
11/24/2005US20050258528 Method and system for stacking integrated circuits
11/24/2005US20050258527 Adhesive/spacer island structure for multiple die package
11/24/2005US20050258509 Substrate, semiconductor device, and substrate fabricating method
11/24/2005US20050258452 Semiconductor device and manufacturing method therefor
11/24/2005US20050258442 Nitride semiconductor device and method for fabricating the same
11/24/2005US20050258438 Light emitting diode apparatuses with heat pipes for thermal management
11/23/2005EP1598875A2 Nitride semiconductor device and method for fabricating the same
11/23/2005EP1598868A1 Stacked dies having shared access to memory
11/23/2005EP1598856A2 Method of manufacturing optical devices and related improvements
11/23/2005EP1597947A1 Method for manufacturing an electronic module
11/23/2005EP1597946A1 Method for manufacturing an electronic module, and an electronic module
11/23/2005EP1597776A2 Lighting module and method for the production thereof
11/23/2005EP1597762A2 Thin multiple semiconductor die package
11/23/2005EP1597757A2 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours
11/23/2005EP1597734A1 Semiconductor chip arrangement with rom
11/23/2005EP1433204B1 Device with power semiconductor components for controlling the power of high currents and use of said device
11/23/2005CN1701441A Process for producing microelectromechanical components
11/23/2005CN1700480A Solar cell module connector and method of producing solar cell module panel
11/23/2005CN1700467A Semiconductor device
11/23/2005CN1700466A Overhang support for a stacked semiconductor device, and method of forming thereof
11/23/2005CN1700465A 半导体封装装置 The semiconductor package device
11/23/2005CN1700458A Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
11/23/2005CN1700453A Structure of forming pressure contact with power semiconductor module
11/23/2005CN1700452A Semiconductor device mounting structure
11/23/2005CN1700431A Circuit device, manufacturing method thereof, and sheet-like board member
11/23/2005CN1700413A Nitride semiconductor device and method for fabricating the same
11/23/2005CN1228839C Multiple grain packaging arrangement
11/23/2005CN1228824C Method for producing semiconductor device and semiconductor device
11/22/2005US6967849 One system module for electric/electronic appliance
11/22/2005US6967843 System and method for dissipating heat from an electronic board
11/22/2005US6967411 Stackable layers containing ball grid array packages
11/22/2005US6967410 Electronic device, method of manufacturing the same, and electronic instrument
11/22/2005US6967402 Hermetically sealed semiconductor power module and large scale module comprising the same
11/22/2005US6967395 Mounting for a package containing a chip
11/22/2005US6967394 Multi-chip package
11/22/2005US6967389 Wafer with semiconductor chips mounted thereon
11/22/2005US6967354 Light emitting semiconductor package
11/22/2005US6967278 Solar cell module and roof equipped with power generating function using the same
11/22/2005US6966964 Method and apparatus for manufacturing semiconductor device
11/17/2005WO2005109552A2 Chip with a power supply device
11/17/2005WO2005109532A1 Light emitting device
11/17/2005WO2005109523A1 Optoelectronic receiver
11/17/2005WO2005109506A1 Carrier for multilayer semiconductor device and process for manufacturing multilayer semiconductor device
11/17/2005WO2005109505A1 Power semiconductor circuit
11/17/2005WO2005109504A1 Electronic circuit and method for manufacturing an electronic circuit
11/17/2005WO2005109503A2 A method of assembly and assembly thus made
11/17/2005WO2005109499A2 Semiconductor component provided with a rewiring substrate and method for the production thereof
11/17/2005WO2005109479A1 Adhesive sheet for both dicing and die bonding and semiconductor device manufacturing method using the adhesive sheet
11/17/2005WO2005017970A3 Module for epas/ehpas applications
11/17/2005US20050255722 Micro blade assembly
11/17/2005US20050255632 Method of fabricating stacked semiconductor device
11/17/2005US20050255620 Web fabrication of devices
11/17/2005US20050254745 Optoelectronic module and optoelectronic system
11/17/2005US20050254535 Apparatus, system, and method for generating phase-locked harmonic RF source from an optical pulse train
11/17/2005US20050254534 Apparatus, system, and method for frequency stabilized mode-locked laser
11/17/2005US20050254196 Surface-mountable component and method for the production thereof
11/17/2005US20050253278 Universal interconnect die
11/17/2005US20050253274 Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
11/17/2005US20050253252 Direct cooling of LEDs
11/17/2005US20050253247 Semiconductor device and manufacturing method therefor
11/17/2005US20050253236 Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
11/17/2005US20050253233 Power module and electric transportation apparatus incorporating the same
11/17/2005US20050253231 Semiconductor package with encapsulated passive component
11/17/2005US20050253229 Semiconductor device and manufacturing method of same
11/17/2005US20050253225 Wireless coupling of semiconductor dies
11/17/2005US20050253224 Stacked multi-chip package
11/17/2005US20050253158 White light emitting device
11/17/2005US20050253151 Light-emitting device having light-emitting elements
11/17/2005US20050252682 Wiring board and semiconductor package using the same
11/17/2005DE19719703C5 Leistungshalbleitermodul mit Keramiksubstrat Power semiconductor module with a ceramic substrate
11/17/2005DE102005008775A1 Lichtemittierende Vorrichtung und Beleuchtungs-Vorrichtung Light-emitting device and illumination device
11/17/2005DE102004031920B4 Mehrchippackung und Herstellungsverfahren Multi-chip package and manufacturing processes
11/17/2005DE102004019568A1 Substrate for a power semiconductor module has electronic components and connections on metal conductor on an isolation layer and recesses beneath or next to these
11/17/2005DE102004013681B3 Halbleitermodul mit einem Kopplungssubstrat und Verfahren zur Herstellung desselben The same semiconductor module with a coupling substrate and methods for making
11/16/2005EP1596440A1 Light emitting device
11/16/2005EP1596436A1 Electronic circuit and method for manufacturing an electronic circuit
11/16/2005EP1596434A1 Semiconductor device
11/16/2005EP1595287A2 Electronic component comprising a semiconductor chip and method for producing said component
11/16/2005EP0927433B1 Semiconductor device assemblies and circuits
11/16/2005CN1698202A Device for producing a bundled light flux
11/16/2005CN1698080A Plasma display device
11/16/2005CN1698077A Element transfer method and display device
11/16/2005CN1697603A Heating element radiating structure
11/16/2005CN1697208A Generation of whitelight source,whitelight luminous element and its mfg.method
11/16/2005CN1697163A Wiring board and semiconductor package using the same
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