Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2005
12/07/2005EP1603169A2 Photovoltaic module architecture
12/07/2005EP1603163A2 Three-dimensional semiconductor device
12/07/2005EP1602133A2 Modular shade system with solar tracking panels
12/07/2005EP1478899B1 Measurement method for determining a surface profile
12/07/2005EP1425803B1 Led
12/07/2005CN2745144Y Infrared receiver
12/07/2005CN1706051A Optoelectronic hybrid integrated module and light input/output apparatus having the same as component
12/07/2005CN1706043A LED light engine for AC operation and methods of fabricating same
12/07/2005CN1705124A Semiconductor device and method of fabricating the same
12/07/2005CN1705123A Semiconductor device
12/07/2005CN1705108A 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/07/2005CN1705105A 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/07/2005CN1705104A 电路装置及其制造方法 Circuit device and manufacturing method thereof
12/06/2005US6973634 IC layouts with at least one layer that has more than one preferred interconnect direction, and method and apparatus for generating such a layout
12/06/2005US6972487 Multi chip package structure having a plurality of semiconductor chips mounted in the same package
12/06/2005US6972482 Electronic package having a folded flexible substrate and method of manufacturing the same
12/06/2005US6972481 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages
12/06/2005US6972479 Package with stacked substrates
12/06/2005US6972477 Circuit device with conductive patterns separated by insulating resin-filled grooves
12/06/2005US6972372 Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
12/01/2005WO2005115072A2 Support with solder globule elements and a method for assembly of substrates with globule contacts
12/01/2005WO2005114731A2 Double density method for wirebond interconnect
12/01/2005WO2005114730A1 Process for producing semiconductor device and semiconductor device
12/01/2005WO2005114729A1 Semiconductor device and wiring board
12/01/2005WO2005114728A1 Semiconductor device, wiring board and manufacturing method thereof
12/01/2005WO2005114726A2 Stacked module systems and methods
12/01/2005WO2005114710A1 Semiconductor product quality control method and quality control system thereof
12/01/2005WO2005018290A3 Electronic module comprising stacked components which are solidly connected to one another, and corresponding component, method, assembly means and assembly machine
12/01/2005US20050266701 Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
12/01/2005US20050266671 Manufacturing method of semiconductor device
12/01/2005US20050266670 Chip bonding process
12/01/2005US20050266617 Module with multiple power amplifiers and power sensors
12/01/2005US20050266614 Method of manufacturing semiconductor device and method of manufacturing electronic device
12/01/2005US20050266610 Manufacturing methods for semiconductor structures having stacked semiconductor devices
12/01/2005US20050264716 LED package and backlight assembly for LCD comprising the same
12/01/2005US20050264180 Substrate for organic EL display devices and organic EL display devices
12/01/2005US20050263911 Circuit device and manufacturing method thereof
12/01/2005US20050263905 Method for manufacturing circuit device
12/01/2005US20050263886 Integrated circuit package with optimized mold shape
12/01/2005US20050263881 Semiconductor device
12/01/2005US20050263880 Circuit device and manufacturing method thereof
12/01/2005US20050263872 Flex-based circuit module
12/01/2005US20050263871 Method of fabricating semiconductor device and semiconductor device
12/01/2005US20050263870 High density 3-D integrated circuit package
12/01/2005US20050263869 Semiconductor device and manufacturing process therefor
12/01/2005US20050263868 Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment
12/01/2005US20050263863 Semiconductor device and a method of manufacturing the same
12/01/2005US20050263860 Semiconductor device and method for manufacturing the same
12/01/2005US20050263809 Ferroelectric memory and method of fabricating the same
12/01/2005US20050263777 LED lamp and method of making same
12/01/2005US20050263759 Semiconductor devices and method for manufacturing the same, semiconductor device modules, circuit substrates and electronic apparatuses
12/01/2005US20050263517 Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
12/01/2005US20050263320 Circuit device and manufacturing method thereof
12/01/2005US20050263311 Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection
12/01/2005US20050263181 Photovoltaic cooling frame
12/01/2005US20050263180 Photovoltaic module architecture
12/01/2005US20050263179 Photovoltaic module architecture
12/01/2005US20050263178 Photovoltaic module architecture
12/01/2005DE102005019278A1 Light emitting diode lamp unit for liquid crystal display device, has LED chips arranged at fixed intervals in lower position of optical lens, and lower reflecting sheet arranged on bottom surface of chip
12/01/2005DE102005007355A1 Optisches Schnappeinpasselement zur optischen Kopplung zwischen einer Lichtquelle und einem Zielelement unter Verwendung von Oberflächenbefestigungstechnologie Optical Schnappeinpasselement for optical coupling between a light source and a target element using surface mount technology
12/01/2005DE102005007333A1 Multichip housing has housing substrate with two semiconductor shapes configured to be serially connected through a high speed communications protocol
12/01/2005DE102004021927A1 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul A process for the inner electrical insulation of a substrate for a power semiconductor module
12/01/2005DE102004021870A1 Optical semiconductor component for light emitting diodes (LEDs) has curved surfaces at whose foci semiconductor chips are placed
12/01/2005DE102004021862A1 Current sensor has two lead frames each having a magnetic field sensor chip that are attached to the frame opposite one another
12/01/2005DE102004021346A1 Chip mit Versorgungseinrichtung Chip supply device
12/01/2005DE102004021233A1 Leuchtdiodenanordnung LED arrangement
12/01/2005DE102004021122A1 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
12/01/2005DE102004020703A1 Manufacturing a light emitting diode group by application to a substrate plate and subsequent sub-division
12/01/2005DE10163117C5 Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen A method for producing photoconductive LED bodies in two temporally separated steps
12/01/2005DE10025563B4 Modul für die Anordnung von elektrischen lichtemittierenden Elementen,integrierbar in ein Leuchtengehäuse,und Verfahren zur Herstellung eines derartigen Moduls Module for the assembly of electrical light-emitting elements, can be integrated in a lamp housing, and method for manufacturing such a module
11/2005
11/30/2005EP1601017A1 Multilayer printed wiring board
11/30/2005EP1601016A2 Apparatus in screw pressure contact with a power semiconductor module
11/30/2005CN1703768A Forming folded-stack packaged device using progressive folding tool
11/30/2005CN1703119A Substrate for organic EL display devices and organic EL display devices
11/30/2005CN1702863A Circuit device
11/30/2005CN1702862A Packaging method for colony light-emitting diode chips and devices thereof
11/30/2005CN1702861A Semiconductor device with a plurality of ground planes
11/30/2005CN1702857A Semiconductor device and method for manufacturing the same
11/30/2005CN1702507A LED package and backlight assembly for LCD comprising the same
11/30/2005CN1702470A Probe card for probing wafers with raised contact elements
11/30/2005CN1230056C Arrangement with integrated circuit mounted on bearing means and power supply module arrangement
11/30/2005CN1229871C Micro-LED arrays with enhanced light extraction
11/30/2005CN1229863C Semiconductor device, method of manufacture thereof, circuit board, and electronic device
11/30/2005CN1229766C Image display unit and production method for image display unit
11/29/2005US6970357 Rectifier bridge assembly
11/29/2005US6969916 Substrate having built-in semiconductor apparatus and manufacturing method thereof
11/29/2005US6969914 Electronic device package
11/29/2005US6969913 Semiconductor device and manufacturing method for the same
11/29/2005US6969907 Cooling structure for multichip module
11/29/2005US6969906 Multi-chip package and method for manufacturing the same
11/29/2005US6969898 Optical semiconductor housing and method for making same
11/29/2005US6969856 Two band imaging system
11/29/2005US6969667 Electrical device and method of making
11/29/2005US6969624 Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate
11/24/2005WO2005112525A2 Apparatus, system, and method for frequency stabilized mode-locked laser
11/24/2005WO2005112137A1 Light emitting device including rgb light emitting diodes and phosphor
11/24/2005WO2005112117A2 Power semiconductor assembly
11/24/2005WO2005112114A2 Universal interconnect die
11/24/2005WO2005112100A2 Stacked module systems and methods
11/24/2005WO2005111670A1 Textured transparent film having pyramidal patterns that can be associated with photovoltaic cells
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