Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
12/2005
12/22/2005US20050282312 Semiconductor device and manufacturing method thereof
12/22/2005US20050282310 Encapsulation of multiple integrated circuits
12/22/2005US20050281015 Electronic circuit apparatus and method for stacking electronic circuit units
12/22/2005US20050280997 Power component cooling device
12/22/2005US20050280490 Semiconductor and electronic device with spring terminal
12/22/2005US20050280165 Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip
12/22/2005US20050280163 Semiconductor device module with flip chip devices on a common lead frame
12/22/2005US20050280161 Unmolded package for a semiconductor device
12/22/2005US20050280160 Method for manufacturing wafer level chip stack package
12/22/2005US20050280138 Ground plane for integrated circuit package
12/22/2005US20050280135 Stacking system and method
12/22/2005US20050280037 Semiconductor, electrooptic apparatus and electronic apparatus
12/22/2005US20050280036 Semiconductor product having a first and at least one further semiconductor circuit and method
12/22/2005US20050280007 Image sensor with optical guard ring and fabrication method thereof
12/22/2005DE102004025609A1 Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul Assembly screw in pressure contact with a power semiconductor module
12/21/2005EP1608016A2 Capacitor-built-in-type wiring substrate, printed wiring substrate, and capacitor
12/21/2005EP1608015A2 Semiconductor device capsule
12/21/2005CN1711636A Components, methods and assemblies for multi-chip packages
12/21/2005CN1233045C Luminescent device
12/20/2005US6978068 Snap-fit optical element for optical coupling between a light source and target element using surface mount technology
12/20/2005US6977440 Stacked packages
12/20/2005US6977439 Semiconductor chip stack structure
12/20/2005US6977433 Multi function package
12/20/2005US6977431 semiconductor die, die pad, and inner lead portions are embedded in a hardened plastic encapsulant; can be electrically coupled; printed circuit boards; increased functionality
12/20/2005US6977430 Transistor module
12/20/2005US6977211 Selective consolidation processes for electrically connecting contacts of semiconductor device components
12/20/2005US6977190 Semiconductor device and method for production thereof
12/15/2005WO2005119776A1 Semiconductor device having three-dimensional stack structure and method for manufacturing the same
12/15/2005WO2005119769A1 Method for construction of rigid photovoltaic modules
12/15/2005WO2005119767A1 Integrated circuit package with optimized mold shape
12/15/2005WO2005091392B1 Micro-reflectors on a substrate for high-density led array
12/15/2005WO2005081315A3 Semiconductor component comprising a stack of semiconductor chips and method for producing the same
12/15/2005WO2005027222A3 Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
12/15/2005US20050278677 Novel test structure for automatic dynamic negative-bias temperature instability testing
12/15/2005US20050278675 General purpose delay logic
12/15/2005US20050277227 Chip scale package with open substrate
12/15/2005US20050276546 Bidirectional emitting and receiving module
12/15/2005US20050276052 Led illumination system
12/15/2005US20050275116 Reconstructed semiconductor wafers
12/15/2005US20050275113 Embedded integrated circuit packaging structure
12/15/2005US20050275112 High power MCM package with improved planarity and heat dissipation
12/15/2005US20050275088 Circuit module and method for manufacturing the same
12/15/2005US20050275080 Multi-chip module package structure
12/15/2005US20050275061 Semiconductor device having inductor
12/15/2005US20050274973 LED lamp
12/15/2005US20050274408 Photovoltaic module architecture
12/15/2005DE202005012643U1 Flashing, yellow-light-emitting diode lights used as tram direction indicators, are cooled by heat dissipation to circuit boards and supports
12/15/2005DE102005020695A1 Radiation emitting device with variable spectral properties, superimposes beams from luminescent dyes with different absorption spectra excited by LEDs with different emission spectra
12/15/2005DE102004063824A1 Leuchtdioden-Baugruppe Light-emitting diode module
12/15/2005DE102004025279A1 Träger mit Lotkugelelementen und ein Verfahren zum Bestücken von Substraten mit Kugelkontakten Carrier with solder ball elements and a method for loading substrates with ball contacts
12/15/2005DE10101078B4 Halbleitervorrichtung für den Anschluß elektrischer Leistung A semiconductor device for the connection of electrical power
12/15/2005CA2567389A1 Method for construction of rigid photovoltaic modules
12/14/2005EP1605508A2 Surface-mount chip-scale package
12/14/2005EP1604400A2 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
12/14/2005EP1603694A2 Electrical bus with associated porous metal heat sink and method of manufacturing same
12/14/2005CN1708840A Three-dimensional device fabrication method
12/14/2005CN1707793A Semiconductor device having inductor
12/14/2005CN1707792A Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
12/14/2005CN1231980C Luminous device
12/14/2005CN1231965C 半导体器件 Semiconductor devices
12/13/2005US6975516 Component built-in module and method for producing the same
12/13/2005US6975200 Microconverter and laminated magnetic-core inductor
12/13/2005US6975038 Chip scale pin array
12/13/2005US6975027 Multi-chip electronic package and cooling system
12/13/2005US6975025 Semiconductor chip package and method of manufacturing same
12/13/2005US6975016 Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof
12/13/2005US6974711 Method of manufacturing a display panel
12/13/2005US6973715 Method of forming a multichip module having chips on two sides
12/08/2005WO2005117146A1 Photoelectric conversion element array, its integrated device, their packaging structure, and optical information processor
12/08/2005WO2005117142A1 Aerodynamic cooling frame for photovoltaic panel
12/08/2005WO2005117141A1 Terminal box for solar cell module
12/08/2005WO2005117117A1 Method and system for stacking integrated circuits
12/08/2005WO2005117116A1 Semiconductor device
12/08/2005WO2005117111A2 Adhesive/spacer island structure for multiple die package
12/08/2005WO2005117107A2 Power semiconductor module and method for cooling a power semiconductor module
12/08/2005WO2005117092A2 Stacked semiconductor package having adhesive/spacer structure and insulation
12/08/2005WO2005062382A3 Light emitting diode based illumination assembly
12/08/2005US20050272399 Radio-frequency circuit module and radio communication apparatus
12/08/2005US20050272252 Circuit device
12/08/2005US20050272226 Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the same
12/08/2005US20050271330 Three-dimensional mounted assembly and optical transmission device
12/08/2005US20050271185 Apparatus, system, and method for optical pulse gain enhancement for high-finesse external cavity
12/08/2005US20050270750 Electronic substrate for a three-dimensional electronic module
12/08/2005US20050270715 Snubber module and power conversion device
12/08/2005US20050269732 Support plate for semiconductor components
12/08/2005US20050269698 Semiconductor device having adhesion increasing film and method of fabricating the same
12/08/2005US20050269695 Surface-mount chip-scale package
12/08/2005US20050269692 Stacked semiconductor package having adhesive/spacer structure and insulation
12/08/2005US20050269690 Ball grid array housing having a cooling foil
12/08/2005US20050269686 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
12/08/2005US20050269682 Carrier for stacked type semiconductor device and method of fabricating the same
12/08/2005US20050269681 Component built-in module and method for producing the same
12/08/2005US20050269680 System-in-package (SIP) structure and fabrication thereof
12/08/2005US20050269676 Adhesive/spacer island structure for stacking over wire bonded die
12/08/2005US20050269665 Three dimensional integrated circuits
12/08/2005US20050269128 Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
12/08/2005US20050268962 Flexible Photovoltaic cells, systems and methods
12/08/2005US20050268958 Solar cell module connector and method of producing solar cell module panel
12/08/2005US20050268957 Power source device
12/08/2005DE102004022884A1 Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring substrate and methods for preparing
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