| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 01/05/2006 | DE102005024900A1 Halbleiterbauelement Semiconductor device |
| 01/05/2006 | DE102005020972A1 Halbleiterpackung mit leitfähigen Bondhügeln und zugehöriges Herstellungsverfahren Semiconductor package with conductive bumps and manufacturing method thereof |
| 01/05/2006 | DE102004028143A1 Vorrichtung zur Digitalisierung von Filmmaterial Device for digitizing footage |
| 01/05/2006 | DE102004027788A1 Semiconductor base component for semiconductor component pile, has boundary regions of substrate surrounding chip, with elastic contact unit which is electrically connected with regions of distribution plate |
| 01/05/2006 | DE102004025773A1 Electronic structural component, has two electronic circuits directly bonded with pins and arranged on single lead frame on which two areas are designed, where one area is thermally isolated from other area by heat circumstances |
| 01/04/2006 | EP1612862A2 Photovoltaic cell, photovoltaic cell module, method of fabricating photovoltaic cell and method of repairing photovoltaic cell |
| 01/04/2006 | EP1612860A2 Interposer, method of fabricating the same, and semiconductor device using the same |
| 01/04/2006 | EP1611611A2 Methods for fabricating three-dimensional all organic interconnect structures |
| 01/04/2006 | EP1611609A1 Encapsulated power semiconductor assembly |
| 01/04/2006 | EP1438745B1 Multiple die interconnect system |
| 01/04/2006 | CN1717802A Semiconductor device having a bond pad and method for its fabrication |
| 01/04/2006 | CN1717800A Power semiconductor module |
| 01/04/2006 | CN1717795A Microelectronic packaging and components |
| 01/04/2006 | CN1716602A Stacked semiconductor memory device |
| 01/04/2006 | CN1716600A Super high brightness single tube multiple chip, super high brightness single tube monolithic chip, super high brightness single tube monolithic chip, general LED combined soft light illuminating lamp |
| 01/04/2006 | CN1716599A Three-dimensional semiconductor device provided with interchip interconnection selection means |
| 01/04/2006 | CN1716598A Stacked semiconductor device |
| 01/04/2006 | CN1716347A Backlight for display device, light source for display device, and light emitting diode used therefor |
| 01/04/2006 | CN1235286C Electronic device and method for manufacturing this device |
| 01/04/2006 | CN1235284C Insulation substrate for semi-conductor and power modular |
| 01/04/2006 | CN1235275C Semiconductor module and method for mfg. semiconductor module |
| 01/03/2006 | US6982876 Printed circuit board assembly |
| 01/03/2006 | US6982869 Folded interposer |
| 01/03/2006 | US6982742 Hand-held computers incorporating reduced area imaging devices |
| 01/03/2006 | US6982740 Reduced area imaging devices utilizing selected charge integration periods |
| 01/03/2006 | US6982489 Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween |
| 01/03/2006 | US6982488 Semiconductor package and method for fabricating the same |
| 01/03/2006 | US6982487 Wafer level package and multi-package stack |
| 01/03/2006 | US6982482 Packaging of solid state devices |
| 01/03/2006 | US6982478 Semiconductor device and method of fabricating the same |
| 01/03/2006 | US6982422 Photoelectric converter, its driving method, and system including the photoelectric converter |
| 01/03/2006 | CA2218307C Three dimensional packaging configuration for multi-chip module assembly |
| 12/29/2005 | WO2005124862A1 Semiconductor device |
| 12/29/2005 | WO2005124857A1 Semiconductor device |
| 12/29/2005 | WO2005122706A2 Method of aligning semiconductor device and semiconductor structure thereof |
| 12/29/2005 | WO2005106954A3 Power semiconductor circuit and method for producing a power semiconductor circuit |
| 12/29/2005 | WO2005060681A3 Integrated solar energy roofing construction panel |
| 12/29/2005 | US20050288392 Modular board device and high frequency module and method for producing them |
| 12/29/2005 | US20050287785 Method of stacking wafers with anisotropic conductive adhesive |
| 12/29/2005 | US20050287711 Leadframe of a leadless flip-chip package and method for manufacturing the same |
| 12/29/2005 | US20050287710 Leadless semiconductor package and method for manufacturing the same |
| 12/29/2005 | US20050287706 Electronic device package |
| 12/29/2005 | US20050287703 Multi-chip semiconductor connector assembly method |
| 12/29/2005 | US20050287701 Leadframe for a multi-chip package and method for manufacturing the same |
| 12/29/2005 | US20050287700 Leadframe with a chip pad for two-sided stacking and method for manufacturing the same |
| 12/29/2005 | US20050286334 Stacked semiconductor memory device |
| 12/29/2005 | US20050286286 Three-dimensional semiconductor device provided with interchip interconnection selection means for electrically isolating interconnections other than selected interchip interconnections |
| 12/29/2005 | US20050286264 Backlight for display device, light source for display device, and light emitting diode used therefor |
| 12/29/2005 | US20050285505 Lamp and method of producing a lamp |
| 12/29/2005 | US20050285264 High density package with wrap around interconnect |
| 12/29/2005 | US20050285263 Semiconductor device |
| 12/29/2005 | US20050285260 Bottom heat spreader |
| 12/29/2005 | US20050285254 Semiconducting device having stacked dice |
| 12/29/2005 | US20050285252 Voltage droop suppressing active interposer |
| 12/29/2005 | US20050285250 Stacked multi-chip semiconductor package improving connection reliability of stacked chips |
| 12/29/2005 | US20050285249 Multi-chip semiconductor connector assemblies |
| 12/29/2005 | US20050285248 Method and system for expanding flash storage device capacity |
| 12/29/2005 | US20050285246 Microelectronic packages and methods therefor |
| 12/29/2005 | US20050285238 Integrated transistor module and method of fabricating same |
| 12/29/2005 | US20050285214 Integrated circuit chip that supports through-chip electromagnetic communication |
| 12/29/2005 | US20050285152 Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement |
| 12/29/2005 | US20050284658 Components with posts and pads |
| 12/29/2005 | US20050284517 Photovoltaic cell, photovoltaic cell module, method of fabricating photovoltaic cell and method of repairing photovoltaic cell |
| 12/29/2005 | US20050284516 Solar laminates as laminated safety glass |
| 12/29/2005 | US20050284515 Method for construction of rigid photovoltaic modules |
| 12/29/2005 | DE202005010371U1 Screw base E27 or E14 for use in e.g. industry, is connected with base attachment on which light emitting diodes are fixed, where size of base attachment is restricted by pear-shaped glass or plastic attachment |
| 12/29/2005 | DE102004048203A1 Stackable semiconductor module for electronics packaging has electronic component with vertical opening provided with continuous metallization with layer of soldering paste to connect it to contact of another electronic component |
| 12/29/2005 | DE102004038989A1 Semiconductor module, has lower semiconductor chip electrically connected with flip chip contacts of upper semiconductor chip, and back wiring structure that stands over bond connections with external contacts of wiring substrates |
| 12/29/2005 | DE102004027489A1 Verfahren zum Anordnen von Chips eines ersten Substrats auf einem zweiten Substrat A method of disposing of chips of a first substrate on a second substrate |
| 12/29/2005 | DE102004027273A1 Halbleiterbaustein mit einer ersten und mindestens einer weiteren Halbleiterschaltung und Verfahren A semiconductor device having a first and at least a further semiconductor circuit and method |
| 12/29/2005 | DE102004027185A1 Niederinduktives Halbleiterbauelement mit Halbbrückenkonfiguration Niederinduktives semiconductor component with a half-bridge configuration |
| 12/29/2005 | DE102004027074A1 BGA (Ball Grid Array)-Gehäuse mit einer metallischen Kühlfolie BGA (Ball Grid Array) package with a metallic film cooling |
| 12/29/2005 | DE102004026061A1 Leistungshalbleitermodul und Verfahren zum Kühlen eines Leistungshalbleitermoduls The power semiconductor module and method for cooling a power semiconductor module |
| 12/29/2005 | DE102004013733A1 Halbleiterbauteil in Stapelbauweise mit einem optisch aktiven Halbleiterchip und Verfahren zu seiner Herstellung A stacked type semiconductor device with an optically active semiconductor chip, and process for its preparation |
| 12/28/2005 | EP1610383A1 Semiconductor device |
| 12/28/2005 | EP1610375A2 Contact carriers for populating substrates with spring contacts |
| 12/28/2005 | EP1610132A2 Fabricating interconnects using sacrificial substrates |
| 12/28/2005 | EP1609339A1 Method for manufacturing an electronic module and an electronic module |
| 12/28/2005 | EP1609161A2 Stand-alone organic-based passive devices |
| 12/28/2005 | EP1608908A1 Vehicle headlamp |
| 12/28/2005 | CN1713808A Power component cooling device |
| 12/28/2005 | CN1713381A Slave device, master device and stacked device |
| 12/27/2005 | US6980438 Semiconductor package with heat dissipating structure |
| 12/27/2005 | US6979909 Semiconductor device and method of manufacturing same |
| 12/27/2005 | US6979905 Semiconductor device |
| 12/27/2005 | US6979904 Integrated circuit package having reduced interconnects |
| 12/27/2005 | US6979895 Semiconductor assembly of stacked substrates and multiple semiconductor dice |
| 12/27/2005 | US6979894 Integrated chip package having intermediate substrate |
| 12/27/2005 | US6979891 Integrated circuit packaging architecture |
| 12/27/2005 | US6979873 Semiconductor device having multiple substrates |
| 12/27/2005 | US6979771 Photovoltaic module, photovoltaic module array, photovoltaic system, and method of detecting failure of photovoltaic module |
| 12/27/2005 | US6979644 Method of manufacturing electronic circuit component |
| 12/27/2005 | US6979591 Connection of integrated circuits |
| 12/27/2005 | US6979204 Pressure piece for use in a power semiconductor module |
| 12/22/2005 | WO2005122257A1 Semiconductor device incorporating capacitor and process for manufacturing same |
| 12/22/2005 | WO2005122250A2 High power mcm package with improved planarity and heat dissipation |
| 12/22/2005 | WO2005122249A2 Semiconductor device module with flip chip devices on a common lead frame |
| 12/22/2005 | WO2005121636A1 A high efficiency semiconductor energy saving lamp |
| 12/22/2005 | WO2005081314A3 Optimisation of the number of power outputs for an integrated circuit |
| 12/22/2005 | US20050282374 Method of forming a thin wafer stack for a wafer level package |