| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 01/19/2006 | US20060012032 Electronic device with semiconductor chip including a radiofrequency power module |
| 01/19/2006 | US20060012031 Heat dissipation device for integrated circuits |
| 01/19/2006 | US20060012017 Semiconductor device and method of manufacturing the same |
| 01/19/2006 | US20060012016 High-frequency power semiconductor module with a hollow housing and method for the production thereof |
| 01/19/2006 | US20060011848 X-ray inspection system and method |
| 01/19/2006 | DE19921684B4 Beleuchtungselement mit Halbleiterchips Lighting element with semiconductor chips |
| 01/19/2006 | DE102004031685A1 Housing for an optoelectronic component has central heat dissipating element with central thermal contact region surrounded by ring of chip mounting surfaces |
| 01/19/2006 | DE102004031623A1 Power semiconductor module with connections to control circuit, has casing with spring-loaded contact making external connection and having an internal bonding surface |
| 01/19/2006 | DE102004030813A1 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 01/19/2006 | DE102004030411A1 Solarmodul als Verbundsicherheitsglas Solar module as laminated safety glass |
| 01/19/2006 | DE10021595B4 Anordnung zur Auswahl der Konfiguration integrierter Halbleiterschaltungen Means for selecting the configuration of semiconductor integrated circuits |
| 01/18/2006 | EP1617714A1 Electronic circuit assembly, device comprising such assembly and method for fabricating such device |
| 01/18/2006 | EP1617487A2 Solar module as a safety glass |
| 01/18/2006 | EP1617486A1 Selfluminous device |
| 01/18/2006 | EP1617474A1 Memory module and manufacturing method thereof |
| 01/18/2006 | EP1617473A1 Electronic device comprising an ESD device |
| 01/18/2006 | EP1616350A2 Semiconductor multipackage module including processor and memory package assemblies |
| 01/18/2006 | EP1029346A4 Vertical interconnect process for silicon segments with thermally conductive epoxy preform |
| 01/18/2006 | CN2752960Y Power unit applying with large power semiconductor device |
| 01/18/2006 | CN1723559A Integrated circuit for driving semiconductor device and power converter |
| 01/18/2006 | CN1723556A Semiconductor package having semiconductor constructing body and method of manufacturing the same |
| 01/18/2006 | CN1722919A Luminescence unit, luminescence device with luminescence unit, and method for manufacturing luminescence cell |
| 01/18/2006 | CN1722483A Lens-attached light-emitting element |
| 01/18/2006 | CN1722474A Photovoltaic cell, photovoltaic cell module, method of fabricating photovoltaic cell and method of repairing photovoltaic cell |
| 01/18/2006 | CN1722431A Engine control circuit device |
| 01/18/2006 | CN1722430A Circuit module and method for manufacturing the same |
| 01/18/2006 | CN1722414A Semiconductor device and method of manufacturing the same |
| 01/18/2006 | CN1722412A Package circuit board and package including a package circuit board and method thereof |
| 01/18/2006 | CN1722398A Method for arraying chip of first lining to second lining |
| 01/18/2006 | CN1237629C Optoelectronic component and method for the production thereof, module and device comprising a module of this type |
| 01/18/2006 | CN1237610C Method for producing plate shape body and semiconductor device |
| 01/17/2006 | US6987670 Dual power module power system architecture |
| 01/17/2006 | US6987412 Sense amplifying latch with low swing feedback |
| 01/17/2006 | US6987325 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element |
| 01/17/2006 | US6987307 Stand-alone organic-based passive devices |
| 01/17/2006 | US6987223 Heat sink for silicon thermopile |
| 01/17/2006 | US6987031 Multiple chip semiconductor package and method of fabricating same |
| 01/12/2006 | WO2006003563A2 Light emitting diode module |
| 01/12/2006 | WO2006003126A1 Electronic module arrangement and corresponding production method |
| 01/12/2006 | WO2005112114A3 Universal interconnect die |
| 01/12/2006 | WO2005081316A3 Semiconductor component comprising an interposer substrate and method for the production thereof |
| 01/12/2006 | US20060008974 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/12/2006 | US20060008949 Electronic package having a folded flexible substrate and method of manufacturing the same |
| 01/12/2006 | US20060008946 Castellation wafer level packaging of integrated circuit chips |
| 01/12/2006 | US20060008945 Integrated circuit stacking system and method |
| 01/12/2006 | US20060008944 Substrate having built-in semiconductor apparatus and manufacturing method thereof |
| 01/12/2006 | US20060008579 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device |
| 01/12/2006 | US20060007553 Device for producing a bundled light flux |
| 01/12/2006 | US20060006932 Break-before-make sensing for drivers |
| 01/12/2006 | US20060006766 Wedge shaped uniform energy megasonic transducer |
| 01/12/2006 | US20060006553 Electronic device package |
| 01/12/2006 | US20060006534 Microelectronic devices and methods for packaging microelectronic devices |
| 01/12/2006 | US20060006521 Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages |
| 01/12/2006 | US20060006520 Semiconductor component and system having back side and circuit side contacts |
| 01/12/2006 | US20060006519 Castellation wafer level packaging of integrated circuit chips |
| 01/12/2006 | US20060006518 Semiconductor component having stacked, encapsulated dice and method of fabrication |
| 01/12/2006 | US20060006405 Surface mountable light emitting diode assemblies packaged for high temperature operation |
| 01/12/2006 | DE19930308B4 Multichipmodul mit Silicium-Trägersubstrat Multi-chip module with silicon base substrate |
| 01/12/2006 | DE102005030080A1 Hochdichte Packung mit Wrap-Around-Verbindung High density package with wrap-around connection |
| 01/12/2006 | DE102004028989A1 Elektronische Schaltungsvorrichtung und Verfahren zum Stapeln von elektronischen Schaltungseinheiten An electronic circuit device and method of stacking the electronic circuit units |
| 01/12/2006 | DE102004019567B3 Securing electronic components to substrate by subjecting the electronic component, supporting film and paste-like layer to pressure and connecting the substrate and the component by sintering |
| 01/12/2006 | DE10013189B4 Substrat für ein Leistungsmodul Substrate for a power module |
| 01/11/2006 | EP1615268A2 Submount substrate for mounting a light emitting device and method of fabricating the same |
| 01/11/2006 | EP1615267A1 Metal-base circuit board and its manufacturing method |
| 01/11/2006 | EP1615264A2 Method of manufacturing an electronic parts packaging structure |
| 01/11/2006 | EP1614299A1 2d/3d data projector |
| 01/11/2006 | EP1614184A1 Integrated passive devices fabricated utilizing multi-layer, organic laminates |
| 01/11/2006 | EP1614158A2 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components |
| 01/11/2006 | EP1470743B1 Power module |
| 01/11/2006 | CN1720608A Composite leadframe LED package and method of making the same |
| 01/11/2006 | CN1719628A Air tight high-heat conducting chip packaging assembly |
| 01/11/2006 | CN1236544C Power inverter |
| 01/11/2006 | CN1236491C Semiconductor device having flat electrode and protruding electrode directly contact with it |
| 01/10/2006 | US6985364 Voltage converter module |
| 01/10/2006 | US6984934 Micro-lens arrays for display intensity enhancement |
| 01/10/2006 | US6984927 Display unit |
| 01/10/2006 | US6984890 Chip-scale package |
| 01/10/2006 | US6984889 Semiconductor device |
| 01/10/2006 | US6984885 Semiconductor device having densely stacked semiconductor chips |
| 01/10/2006 | US6984884 Electric power semiconductor device |
| 01/10/2006 | US6984883 Semiconductor power module |
| 01/10/2006 | US6984882 Semiconductor device with reduced wiring paths between an array of semiconductor chip parts |
| 01/10/2006 | US6984881 Portable, high density electronics including printed circuits having stacks of chips connected using solders; miniaturization |
| 01/10/2006 | US6984873 Method of forming a stacked device filler |
| 01/10/2006 | US6984852 Package structure for light emitting diode and method thereof |
| 01/10/2006 | US6984544 Die to die connection method and assemblies and packages including dice so connected |
| 01/10/2006 | US6984542 Method of forming wiring |
| 01/05/2006 | WO2005086235A3 Base semi-conductor component for a semi-conductor component stack and method for the production thereof |
| 01/05/2006 | WO2005062393A3 Semiconductor light emitting devices and submounts and methods for forming the same |
| 01/05/2006 | US20060001177 Semiconductor chip stack |
| 01/05/2006 | US20060001155 Semiconductor device packages including leads with substantially planar exposed portions extending from bottom edges of the packages, and assemblies including the packages |
| 01/05/2006 | US20060001152 Direct connection multi-chip semiconductor element structure |
| 01/05/2006 | US20060001150 Alignment devices for securing semiconductor devices to carrier substrates, and assemblies including the alignment devices |
| 01/05/2006 | US20060001146 Low inductance semiconductor device having half-bridge configuration |
| 01/05/2006 | US20060001143 Castellation wafer level packaging of integrated circuit chips |
| 01/05/2006 | US20060001142 Castellation wafer level packaging of integrated circuit chips |
| 01/05/2006 | US20060001055 Led and fabrication method of same |
| 01/05/2006 | US20060001034 RGB light emitting diode package with improved color mixing properties |
| 01/05/2006 | US20060000504 Solar module having a connecting element |
| 01/05/2006 | US20060000503 Method of fabricating photovoltaic panel |