| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 02/07/2006 | US6995409 Module for high voltage power for converting a base of IGBT components |
| 02/07/2006 | US6995405 Illuminator |
| 02/07/2006 | US6995322 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
| 02/07/2006 | US6995044 Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board |
| 02/07/2006 | US6995041 Semiconductor package with circuit side polymer layer and wafer level fabrication method |
| 02/07/2006 | US6995039 Method and apparatus for electrostatically aligning integrated circuits |
| 02/02/2006 | WO2006012167A1 Bottom heat spreader |
| 02/02/2006 | WO2006012127A2 Microelectronic packages and methods therefor |
| 02/02/2006 | WO2006012110A2 Integrated transistor module and method of fabricating same |
| 02/02/2006 | WO2006011960A1 Integrated circuit chip that supports through-chip electromagnetic communication |
| 02/02/2006 | WO2006011508A1 Hybrid electronic component and method for manufacturing the same |
| 02/02/2006 | WO2006011477A1 Semiconductor device |
| 02/02/2006 | WO2006010911A2 Laminated interconnects for organic opto-electronic device modules |
| 02/02/2006 | WO2006010903A2 Multiple chip semiconductor device |
| 02/02/2006 | WO2005112117A3 Power semiconductor assembly |
| 02/02/2006 | WO2005076353A3 Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
| 02/02/2006 | WO2005055288A3 Method and device for the alternating contacting of two wafers |
| 02/02/2006 | US20060025102 Integrated radio front-end module with embedded circuit elements |
| 02/02/2006 | US20060024505 Mounting an integrated circuit on a substrate, disposing a light transmissive epoxy over the first light filter and portions of the integrated circuit and the substrate to form an epoxy encapsulation; disposing a coating over the second epoxy surface to form a second filter; oven curing the epoxy |
| 02/02/2006 | US20060023439 Stacked chip electronic package having laminate carrier and method of making same |
| 02/02/2006 | US20060023109 Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera |
| 02/02/2006 | US20060022733 Voltage droop suppressing circuit |
| 02/02/2006 | US20060022331 Semiconductor device and method of manufacturing same |
| 02/02/2006 | US20060022234 Reduced area imaging device incorporated within wireless endoscopic devices |
| 02/02/2006 | US20060021648 Device and method to transmit waste heat or thermal pollution into deep space |
| 02/02/2006 | DE10394180T5 Integrierter Schaltungsbaustein und Verfahren zu seiner Herstellung Integrated circuit package and method for its preparation |
| 02/02/2006 | DE10300759B4 Abschaltbares Leistungshalbleiterbauelement Turn-off power semiconductor device |
| 02/02/2006 | DE10140328B4 Kühlanordnung zur Kühlung elektronischer Bauelemente Cooling means for cooling electronic components |
| 02/02/2006 | DE10120408B4 Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung Electronic component having a semiconductor chip, electronic assembly of stacked semiconductor chips and processes for their preparation |
| 02/01/2006 | EP1621053A1 Electrical element comprising lines made of carbonated plastic, and method and device for the production thereof |
| 02/01/2006 | EP1620902A2 Light emitting diodes and the manufacture thereof |
| 02/01/2006 | EP1620896A2 Light emitting diodes packaged for high temperature operation |
| 02/01/2006 | EP1620893A2 Semiconductor wafer, panel and electronic component comprising stacked semiconductor chips, and method for the production thereof |
| 02/01/2006 | EP1620890A2 Electronic component as well as system support and panel for the production thereof |
| 02/01/2006 | EP1378152A4 A method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 02/01/2006 | CN1729571A Electrical connection of optoelectronic devices |
| 02/01/2006 | CN1728573A Radio communicator |
| 02/01/2006 | CN1728548A Airtight package, piezoelectric device, and piezoelectric oscillator |
| 02/01/2006 | CN1728397A Semiconductor modular, solid-state pickup element, camera and mfg. method |
| 02/01/2006 | CN1728378A Encapsulation of flash memory chips in pile type, and method |
| 02/01/2006 | CN1728377A Packaging base plate of improving thermolysis structure, and electronic device |
| 02/01/2006 | CN1728359A Method of reducing serial resistance between inductance in chip and antenna in chip |
| 02/01/2006 | CN1728073A Double lined and directly inserted memory module and computer memory system |
| 02/01/2006 | CN1240258C Electronic circuit unit |
| 02/01/2006 | CN1240132C Memory device mfg. and assembling structure and method |
| 01/31/2006 | US6992940 Semiconductor memory apparatus with variable contact connections, and a corresponding semiconductor apparatus |
| 01/31/2006 | US6992896 Stacked chip electronic package having laminate carrier and method of making same |
| 01/31/2006 | US6992891 Metal ball attachment of heat dissipation devices |
| 01/31/2006 | US6992871 Microtransformer for system-on-chip power supply |
| 01/31/2006 | US6992528 Semiconductor device |
| 01/31/2006 | US6992474 Movement actuator/sensor systems |
| 01/31/2006 | US6992399 Die connected with integrated circuit component for electrical signal passing therebetween |
| 01/31/2006 | US6992396 Semiconductor device and method for fabricating the same |
| 01/31/2006 | US6992395 Semiconductor device and semiconductor module having external electrodes on an outer periphery |
| 01/31/2006 | US6992333 Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
| 01/31/2006 | US6992292 Detection of turbulence in fluids |
| 01/31/2006 | US6991966 Method for embedding a component in a base and forming a contact |
| 01/31/2006 | US6991964 Stacked type semiconductor device |
| 01/31/2006 | US6991963 Electronic unit integrated into a flexible polymer body |
| 01/31/2006 | US6991470 Circuit carrier and production thereof |
| 01/26/2006 | WO2006008411A1 Assembling two substrates by molecular adhesion |
| 01/26/2006 | WO2006008410A1 Assembling two substrates by molecular adhesion, one of the two supporting an electrically conductive film |
| 01/26/2006 | US20060017147 Method and apparatus for using capacitively coupled communication within stacks of laminated chips |
| 01/26/2006 | US20060017069 Superior piezoelectric/electrostrictive characteristics without containing lead (Pb) and which can obtain an especially large displacement |
| 01/26/2006 | US20060016471 Thermally resistant spacers for a submicron gap thermo-photo-voltaic device and method |
| 01/26/2006 | DE20321147U1 Semiconductor device, has one semiconductor chip including set of bumps with different heights is face-bonded on either of mount substrate and another chip, which is die-bonded on mount substrate |
| 01/26/2006 | DE102004033227A1 Metall-Keramik-Substrat A metal-ceramic substrate |
| 01/26/2006 | DE102004032928A1 RF-Modul mit verbesserter Integration RF module with improved integration |
| 01/26/2006 | DE102004032371A1 Elektronische Schaltungseinheit An electronic circuit unit |
| 01/26/2006 | DE102004032368A1 Cooling structure for a circuit layout has a connecting element on a heat sink for transferring the circuit's heat energy onto the heat sink via the connecting element |
| 01/26/2006 | DE102004031997A1 Gehäuse für ein Halbleiter-Bauelement und Halbleiter-Bauelement-Test-System zum Testen der Kontaktierung bei übereinander angeordneten Halbleiter-Bauelementen A housing for a semiconductor device and semiconductor device testing system for testing the contact in superposed semiconductor devices |
| 01/25/2006 | EP1619545A1 Backlight for display device |
| 01/25/2006 | EP1618610A2 Electronically tunable rf chip packages |
| 01/25/2006 | EP1618570A2 Memory-circuit arrangement and method for the production thereof |
| 01/25/2006 | EP1025589B1 Three-dimensional packaging configuration for multi-chip module assembly |
| 01/25/2006 | CN1726638A Single package multi-chip RF power amplifier |
| 01/25/2006 | CN1725483A High density package with wrap around interconnect |
| 01/25/2006 | CN1725366A Stacked semiconductor memory device |
| 01/25/2006 | CN1238909C Manufacturing method of light emitting diode bulb and its structure |
| 01/25/2006 | CN1238905C Electronic component comprising variable capacitance diodes, use of said component in receiving unit and circuit arrangement comprising said component |
| 01/25/2006 | CN1238898C 三维器件 3D device |
| 01/25/2006 | CN1238723C Electronic component, and rotating speed sensor using same |
| 01/24/2006 | US6989658 Circuit design for a circuit for switching currents |
| 01/24/2006 | US6989605 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 01/24/2006 | US6989590 Power semiconductor device with a control circuit board that includes filled through holes |
| 01/24/2006 | US6989587 Semiconductor device and manufacturing the same |
| 01/24/2006 | US6989554 Carrier plate for opto-electronic elements having a photodiode with a thickness that absorbs a portion of incident light |
| 01/24/2006 | US6989538 Method of reducing recovery time in an x-ray detector |
| 01/24/2006 | US6989286 Method of manufacturing optical devices and related improvements |
| 01/24/2006 | US6989285 Method of fabrication of stacked semiconductor devices |
| 01/24/2006 | US6988327 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 01/19/2006 | WO2005109499A3 Semiconductor component provided with a rewiring substrate and method for the production thereof |
| 01/19/2006 | US20060014326 Method for fabricating a semiconductor component with contacts situated at the underside |
| 01/19/2006 | US20060014319 Castellation wafer level packaging of integrated circuit chips |
| 01/19/2006 | US20060014318 Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same |
| 01/19/2006 | US20060014317 Integrated circuit package having reduced interconnects |
| 01/19/2006 | US20060014308 Procedure for arranging chips of a first substrate on a second substrate |
| 01/19/2006 | US20060012053 Flip-chip packaged SMD-type LED with antistatic function and having no wire bonding |
| 01/19/2006 | US20060012040 Semiconductor package |
| 01/19/2006 | US20060012035 Method of packaging integrated circuits, and integrated circuit packages produced by the method |