| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
|---|
| 02/23/2006 | DE19835265B4 Leistungsbauelement in einem Gehäuse Power device in a housing |
| 02/23/2006 | DE19709259B4 Mehrlagiges Bodenanschlussgehäuse A multi-layer floor connection housing |
| 02/23/2006 | DE102005021835A1 Solarzellenmodul-Verbindungsglied und Verfahren zum Herstellen eines Solarzellenmodul-Panels A solar cell module-connecting member and method for manufacturing a solar cell module panels |
| 02/23/2006 | DE102004040326A1 Automotive sensor for e.g. adaptive cruise control, blind angle scanning, parking manoeuvres and pre-crash sensors |
| 02/22/2006 | EP1628347A1 Semiconductor chip leadframe module |
| 02/22/2006 | EP1627431A1 Bi-directional switch, and use of said switch |
| 02/22/2006 | EP1627430A1 An integrated circuit package employing a flexible substrate |
| 02/22/2006 | EP1627428A1 An integrated circuit package employing a head-spreader member |
| 02/22/2006 | EP1627427A2 An encased thermal management device and method of making such a device |
| 02/22/2006 | EP1627425A2 Method for the production of a chip arrangement and varnish for carrying out said method |
| 02/22/2006 | EP1627179A2 Method and apparatus for led panel lamp systems |
| 02/22/2006 | CN2760382Y LED module and LED bulb manufactured thereby |
| 02/22/2006 | CN1739202A Light emitting device |
| 02/22/2006 | CN1739197A DC-DC converter implemented in a land grid array package |
| 02/22/2006 | CN1738065A Diode capable of forming multi luminous mode |
| 02/22/2006 | CN1738027A Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device |
| 02/21/2006 | US7002805 Thermal enhance MCM package and manufacturing method thereof |
| 02/21/2006 | US7002621 Communication devices incorporating reduced area imaging devices |
| 02/21/2006 | US7002255 Multi-chips stacked package |
| 02/21/2006 | US7002254 Integrated circuit package employing flip-chip technology and method of assembly |
| 02/21/2006 | US7002251 Semiconductor device |
| 02/21/2006 | US7002248 Semiconductor components having multiple on board capacitors |
| 02/21/2006 | US7001057 Lighting apparatus for guiding light onto a light polymerizable piece to effect hardening thereof |
| 02/21/2006 | US7000664 Sheet set apparatus for sealing preparation, output lead wire set apparatus for sealing preparation, and sealing preparation apparatus |
| 02/21/2006 | US7000622 Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus |
| 02/16/2006 | WO2006016198A1 Electronic component with stacked semiconductor chips and heat dissipating means |
| 02/16/2006 | US20060036985 Compacting circuit responses |
| 02/16/2006 | US20060035503 Invertible microfeature device packages and associated methods |
| 02/16/2006 | US20060035416 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
| 02/16/2006 | US20060035408 Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components |
| 02/16/2006 | US20060033517 Probe for semiconductor devices |
| 02/16/2006 | US20060033216 Stacked packages |
| 02/16/2006 | US20060033212 Wafer level package, multi-package stack, and method of manufacturing the same |
| 02/16/2006 | US20060033194 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 02/16/2006 | US20060033190 Vertically mountable and alignable semiconductor device packages and assemblies including the same |
| 02/16/2006 | US20060032527 Solar panel overlay and solar panel overlay assembly |
| 02/16/2006 | DE202005018662U1 Illuminating diode used in lighting arrangements comprises a wafer produced by mixing a fluorescent powder and a plastic composition and cutting, fitting the cut wafer into a recess of a support and filling with a molding composition |
| 02/16/2006 | DE202005016208U1 Functional unit e.g. lamp, has LEDs with technical units e.g. anodes, cathodes and LED body, that are fixed together by balls that are fixed relative to units by filling cavities between balls with insulating material |
| 02/16/2006 | DE102005025153A1 LED-Kraftfahrzeugscheinwerfer LED automotive headlamp |
| 02/16/2006 | DE102004035746A1 Power semiconductor module has heat conductive element in baseplate with connection to cooling element and components mounted on the opposite face |
| 02/16/2006 | DE102004031689A1 Light-emitting diode device, has e.g. pulse-width modulator for supplying current to two antiparallel-connected LEDs |
| 02/16/2006 | DE102004018468A1 Verfahren zum strukturierten Aufbringen einer laminierbaren Folie auf ein Substrat für ein Halbleitermodul Method for structured application of a laminatable film on a substrate for a semiconductor module |
| 02/15/2006 | EP1625620A2 Integrated light-emitting didode system |
| 02/15/2006 | CN1735974A Light source module and method for production thereof |
| 02/15/2006 | CN1735965A Method for producing microsystems |
| 02/15/2006 | CN1734803A Semiconductor light-emitting device and method of manufacturing the same |
| 02/15/2006 | CN1734801A Optical semiconductor module and semiconductor device including the same |
| 02/15/2006 | CN1734762A Matrix type LED and manufacturing method thereof |
| 02/15/2006 | CN1242476C Semiconductor device and photoelectric device including same |
| 02/15/2006 | CN1242474C Power module and air conditioner |
| 02/15/2006 | CN1242463C Method for mfg. stacked semiconductor device |
| 02/14/2006 | US6999318 Heatsinking electronic devices |
| 02/14/2006 | US6998912 High-frequency composite switch module and mobile communication device using the same |
| 02/14/2006 | US6998721 A first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first |
| 02/14/2006 | US6998720 Semiconductor package device and method for fabricating the same |
| 02/14/2006 | US6998717 Multi-dice chip scale semiconductor components |
| 02/14/2006 | US6998704 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 02/14/2006 | US6998703 Thin package for stacking integrated circuits |
| 02/14/2006 | US6998701 Resin sealing-type semiconductor device and method for manufacturing the same |
| 02/14/2006 | US6998691 Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
| 02/14/2006 | US6998655 Semiconductor device comprising memories on the inside and outside of bonding pad |
| 02/14/2006 | US6998344 Method for fabricating semiconductor components by forming conductive members using solder |
| 02/14/2006 | US6998281 Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
| 02/14/2006 | US6997535 Ink tank and ink jet recording apparatus provided with the same |
| 02/09/2006 | WO2006013644A1 Production system |
| 02/09/2006 | WO2006013230A2 Manufacture of a layer including a component |
| 02/09/2006 | WO2006013177A2 Planar connection technique for guiding a current in the event of a failure |
| 02/09/2006 | WO2006012866A2 Image module |
| 02/09/2006 | WO2006012846A1 Base semiconductor component comprising a wiring substrate and an intermediate wiring plate for a semiconductor component stack and a method for producing said component |
| 02/09/2006 | WO2005062389A3 Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device |
| 02/09/2006 | US20060030081 Method for fabricating semiconductor package with circuit side polymer layer |
| 02/09/2006 | US20060030072 Methods for securing packaged semiconductor devices to carrier substrates |
| 02/09/2006 | US20060030063 Package structure for light emitting diode and method thereof |
| 02/09/2006 | US20060028806 Leadframe-based module DC bus design to reduce module inductance |
| 02/09/2006 | US20060027908 3-D stackable semiconductor package |
| 02/09/2006 | US20060027829 Package structure for light emitting diode and method thereof |
| 02/09/2006 | US20060027758 Photoelectric converter, its driving method, and system including the photoelectric converter |
| 02/09/2006 | DE202005017030U1 LED-Lichtquelle LED light source |
| 02/09/2006 | DE202005014808U1 Printed circuit card for memory module, has base plate with several printed circuit sets, and memory retainers fixed to one or both sides of plate, where each retainer has retaining compartment with conductor pin arrangement at its base |
| 02/09/2006 | DE19706798B4 Halbleiter-Leistungsmodul Semiconductor power module |
| 02/09/2006 | DE102005031613A1 LED und LED-Array mit einer jeweiligen Kleberschicht LED and LED array with a respective adhesive layer |
| 02/09/2006 | DE102005030411A1 Halbleitersystem Semiconductor system |
| 02/09/2006 | DE102004055511B3 Production process for a power semiconductor module forms solder layer between two partner layers then three hard fixing bridges and melts solder to give exact thickness |
| 02/09/2006 | DE102004034421A1 Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern Method and device for the mutual contacting of two wafer |
| 02/09/2006 | DE102004033533A1 Light emitting semi-conductor diode manufacture on printed circuit board involves chip alignment and connection to circuit board and plastic injection onto board in a tool to form light distributor |
| 02/09/2006 | DE102004031592A1 Elektronikmodulanordnung und entsprechendes Herstellungsverfahren Electronics module assembly and method of manufacture |
| 02/08/2006 | EP1623450A2 High power allngan based mulit-chip light emitting diode |
| 02/08/2006 | CN1732568A RF power transistor with internal bias feed |
| 02/08/2006 | CN1731572A Electronic component production method and electronic component produced by the method |
| 02/08/2006 | CN1241273C Electro-optical device |
| 02/08/2006 | CN1241252C Semiconductor device and producing method thereof, circuit substrate and electronic instrument |
| 02/08/2006 | CN1241244C Method for mounting semiconductor element |
| 02/07/2006 | US6996795 Data processing in digital systems |
| 02/07/2006 | US6995486 Electronic package for electrical machine |
| 02/07/2006 | US6995473 Stacked semiconductor transistors |
| 02/07/2006 | US6995468 Semiconductor apparatus utilizing a preparatory stage for a chip assembly |
| 02/07/2006 | US6995467 Semiconductor component |
| 02/07/2006 | US6995463 Integrated chip package having intermediate substrate and multiple semiconductor chips |
| 02/07/2006 | US6995455 Semiconductor device |
| 02/07/2006 | US6995448 Semiconductor package including passive elements and method of manufacture |