Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
03/2006
03/09/2006DE202005018114U1 Memory module, has main body with IC-mounting parts, whose bottom conductor pin arrays include conductor pin units, which are formed in matrix arrangement for forming electrical connection with printed circuit sets on base plate
03/09/2006DE102004042367A1 Leistungshalbleitermodul The power semiconductor module
03/09/2006DE10024516B4 Leistungshalbleitermodul The power semiconductor module
03/08/2006EP1632998A1 High power electronic package with enhanced cooling characteristics
03/08/2006EP1631988A1 Power semiconductor module
03/08/2006EP1472915B1 Circuit carrier and production thereof
03/08/2006EP1342292A4 Circuit module with universal connectivity
03/08/2006EP1257990B1 Light-emitting diode display systems and methods with enhanced light intensity
03/08/2006CN2763980Y Back-to-back package IC
03/08/2006CN1745481A LED illumination light source
03/08/2006CN1744795A Circuit device and manufacture method for circuit device
03/08/2006CN1744791A Wiring substrate and semiconductor device using the same
03/08/2006CN1744316A Light emitting apparatus
03/08/2006CN1744315A Method for manufacturing semiconductor device and semiconductor device
03/08/2006CN1744314A Semiconductor device having laminated structure and manufacturing method
03/08/2006CN1744313A Semiconductor apparatus having stacked semiconductor components
03/08/2006CN1744312A Semiconductor apparatus having stacked semiconductor components
03/08/2006CN1744311A Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip
03/07/2006US7010200 Light-beam switching/adjusting apparatus and manufacturing method thereof
03/07/2006US7009304 Resin-sealed semiconductor device
03/07/2006US7009303 Multi-chip module
03/07/2006US7009300 Low profile stacked multi-chip package and method of forming same
03/07/2006US7009291 Semiconductor module and semiconductor device
03/07/2006US7009285 Optoelectronic semiconductor component
03/07/2006US7009267 Semiconductor device
03/07/2006US7009220 Transferring semiconductor crystal from a substrate to a resin
03/07/2006US7009199 Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current
03/07/2006US7009116 Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components
03/07/2006US7008823 Die stacking scheme
03/07/2006US7008822 Method for fabricating semiconductor component having stacked, encapsulated dice
03/07/2006US7008820 Chip scale package with open substrate
03/07/2006US7008080 Passive radiation optical system module especially for use with light-emitting diodes
03/07/2006US7008078 Light source having blue, blue-green, orange and red LED's
03/03/2006CA2515714A1 Circuit module system and method
03/02/2006WO2006022172A1 Electronic circuit
03/02/2006WO2005045934A3 Method and device for connecting chips
03/02/2006US20060046436 Manufacturing method of stack-type semiconductor device
03/02/2006US20060044803 LED light source
03/02/2006US20060043390 Light-receiving panel or light-emitting panel, and manufacturing method thereof
03/02/2006US20060043382 Metal base wiring board for retaining light emitting elements, light emitting source, lightning apparatus, and display apparatus
03/02/2006US20060043297 Electromagnetic radiation detection device with integrated housing comprising two superposed detectors
03/02/2006US20060042684 Method of fabricating a multijunction solar cell with a bypass diode having an intrisis layer
03/02/2006US20060042682 Photovoltaic building elements
03/02/2006US20060042681 Pv laminate backplane with optical concentrator
03/02/2006US20060042680 Photovoltaic integrated building component
03/02/2006US20060042679 Self-contained portable solar power supply system
03/02/2006US20060042678 Photoelectric cell
03/02/2006DE202004020786U1 Light emitting device, has phosphor excited to emit light having distinct wavelength, where distinct light is blended with blue, green and red lights emitted from light sources, and blended light is released to obtain white light
03/02/2006DE19918671B4 Vertikal integrierbare Schaltung und Verfahren zu ihrer Herstellung Vertically integrated circuit, and processes for their preparation
03/02/2006DE102004058732A1 Struktur von Plättchen von lichtemittierenden Dioden mit Wechselstrom Platelet structure of light emitting diodes with a voltage
03/02/2006DE102004056702B3 Verfahren zur Befestigung von elektronischen Bauelementen auf einem Substrat A method for mounting electronic components on a substrate
03/02/2006DE102004054062B3 Soldering system for heavy-duty semiconductor circuit uses spray of solder droplets in stream of hot gas to build up deposit of solder on area to be soldered
03/02/2006DE102004042186A1 Gehäuse für ein optoelektronisches Bauelement und optoelektronisches Bauelement A housing for an optoelectronic component and optoelectronic component
03/02/2006DE102004042185A1 Light-emitting diode device, has e.g. pulse-width modulator for supplying current to two antiparallel-connected LEDs
03/02/2006DE102004041417A1 Electrical arrangement for microelectronics has component insulated from substrate by dielectric layer on conductive substrate
03/02/2006DE102004040513A1 Power semiconductor module with several coupling pins of such shape that they protrude through corresponding circuit board
03/02/2006DE102004039897A1 Element mit einer Vielzahl von Leuchtdioden Member having a plurality of light emitting diodes
03/02/2006DE102004039834A1 Method of insulating and electrically contacting components or chips arranged on a substrate by provided a metalized structured insulation layer
03/02/2006DE102004026596A1 Active semiconductor arrangement with at least one module plane and having a raised geometry with a conductive layer to make contact with an upper plane
03/01/2006EP1630877A2 LED with fluorescent material
03/01/2006EP1630867A2 Method for manufacturing semiconductor device and semiconductor device
03/01/2006EP1629538A2 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
03/01/2006CN2762355Y LED multi-color line light source
03/01/2006CN2762351Y Multi-chip mounting structure
03/01/2006CN1742372A 集成电路组合件 IC assembly
03/01/2006CN1741293A Device and method for producing output light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material
03/01/2006CN1741292A Light-emitting diode packaging technology with temperature sensing
03/01/2006CN1741291A Light emitting device
03/01/2006CN1741270A Stereo-stacking packaging structure
03/01/2006CN1740630A High-density light-emitting diode array lamp board
03/01/2006CN1244258C Circuit device and its manufacturing method
03/01/2006CN1244139C Semiconductor device and semiconductor assembly
02/2006
02/28/2006US7006360 Stack-type semiconductor package having one or more semiconductor packages stacked therein
02/28/2006US7006270 Optical scanning device, image forming apparatus, and optical scanning method
02/28/2006US7005798 Flexible organic electronic device with improved resistance to oxygen and moisture degradation
02/28/2006US7005748 Flip chip interface circuit of a semiconductor memory device
02/28/2006US7005747 Semiconductor device having additional functional element and method of manufacturing thereof
02/28/2006US7005740 Thick film millimeter wave transceiver module
02/28/2006US7005739 High power semiconductor module
02/28/2006US7005735 Array printed circuit board
02/28/2006US7005730 Memory module having interconnected and stacked integrated circuits
02/28/2006US7005729 Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame
02/28/2006US7005679 Multiple component solid state white light
02/28/2006US7005577 Semiconductor chip package having an adhesive tape attached on bonding wires
02/28/2006US7005325 Semiconductor package with passive device integration
02/28/2006US7005324 Method of fabricating stacked semiconductor chips
02/28/2006US7005316 Method for package reduction in stacked chip and board assemblies
02/23/2006WO2006020428A1 Methods and systems for attaching die in stacked-die packages
02/23/2006WO2006019156A1 Method for manufacturing semiconductor device having three-dimensional multilayer structure
02/23/2006WO2005117111A3 Adhesive/spacer island structure for multiple die package
02/23/2006WO2005101503A3 Device, in particular intelligent power module with planar connection
02/23/2006WO2005098949A3 Spacer die structure and method for attaching
02/23/2006US20060040424 Semiconductor device substrate, semiconductor device, and manufacturing method thereof
02/23/2006US20060040423 Attachment of integrated circuit structures and other substrates to substrates with vias
02/23/2006US20060039143 Light emitting diode lamp and light emitting diode display unit
02/23/2006US20060038270 Semiconductor device, semiconductor package, electronic device, and method for establishing information processing environment
02/23/2006US20060038263 Semiconductor chip arrangement
02/23/2006US20060037641 Body part of a vehicle provided with a thin-film solar cell and the production thereof
02/23/2006US20060037640 Solar cell device, method for manufacture thereof, and electronic device
02/23/2006US20060037639 Method of increasing the output power from photovoltaic cells