| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 03/23/2006 | WO2006030662A1 Semiconductor device and method for manufacturing the same |
| 03/23/2006 | US20060063303 Packaging method, packaging structure and package substrate for electronic parts |
| 03/23/2006 | US20060063302 Apparatus and method for high density multi-chip structures |
| 03/23/2006 | US20060063288 High power AllnGaN based multi-chip light emitting diode |
| 03/23/2006 | US20060063283 Stacked die module and techniques for forming a stacked die module |
| 03/23/2006 | US20060061944 Plasma display device |
| 03/23/2006 | US20060061327 Battery with embedded circuits |
| 03/23/2006 | US20060060982 Power semiconductor module and method of manufacturing the same |
| 03/23/2006 | US20060060957 Module assembly and method for stacked BGA packages |
| 03/23/2006 | US20060060954 Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components |
| 03/23/2006 | US20060060878 Submount for use in flipchip-structured light-emitting device including transistor |
| 03/23/2006 | DE19756941B4 Halbleitervorrichtung, Halbleitervorrichtungseinheit und Verfahren zum Herstellen der Halbleitervorrichtungseinheit Semiconductor device, the semiconductor device unit and method of manufacturing the semiconductor device unit |
| 03/23/2006 | DE112004000572T5 Multi-Chip-Ball-Grid-Array-Gehäuse und Herstellungsverfahren Multi-chip ball grid array package and manufacturing processes |
| 03/23/2006 | DE10230712B4 Elektronikeinheit mit einem niedrigschmelzenden metallischen Träger Electronic unit with a low-melting metal support |
| 03/23/2006 | DE102005040058A1 Leistungshalbleitermodul und Verfahren zur Herstellung desselben The power semiconductor module and method of manufacturing the same |
| 03/23/2006 | DE102005038254A1 Schaltungsmodulsystem und -Verfahren Circuit module system and method |
| 03/23/2006 | DE102005036646A1 Halbleiterchip und Herstellungsverfahren Semiconductor chip and the manufacturing method |
| 03/23/2006 | DE102004043019A1 Baugruppe Module |
| 03/23/2006 | DE102004042563A1 Semiconductor component for e.g. personal computer, has circuit board on which RAM or logic chips are arranged, and intermediate layer provided between chips and circuit board, where layer is made up of heat conductive material |
| 03/23/2006 | DE102004037078A1 Planare Verbindungstechnik für Stromführung im Fehlerfall Planar interconnect technology for power management in case of error |
| 03/23/2006 | DE102004036982A1 Power semiconductor module, has cavity region arranged between two heat sink sections, where power semiconductor- components are arranged in cavity region so that semiconductor devices are placed in thermal contact with heat sink |
| 03/23/2006 | DE102004036909A1 Halbleiterbasisbauteil mit Verdrahtungssubstrat und Zwischenverdrahtungsplatte für einen Halbleiterbauteilstapel sowie Verfahren zu deren Herstellung Basic semiconductor device having wiring substrate and intermediate wiring board for a semiconductor component stack and process for their preparation |
| 03/22/2006 | EP1636842A2 Stackable semiconductor device and method of manufacturing the same |
| 03/22/2006 | EP1636130A2 Integrated circuit on high performance chip |
| 03/22/2006 | CN2766448Y Draw bail of high-frequency transformer and power device for large power switch power supply |
| 03/22/2006 | CN2766348Y LED module made from multicoloured LED and bulb using the same |
| 03/22/2006 | CN2766345Y LED lighting lamp tube |
| 03/22/2006 | CN1750282A Light emitting diode |
| 03/22/2006 | CN1750277A Light emitting diode grain structure with AC loop |
| 03/22/2006 | CN1750262A 功率放大器模块 Power Amplifier Module |
| 03/22/2006 | CN1750261A Packaging device of ic circuit and its producing method |
| 03/22/2006 | CN1750260A Capacitance type physical quantity sensor having sensor chip and circuit chip |
| 03/22/2006 | CN1749972A System, device, and method for improved mirror mode operation |
| 03/22/2006 | CN1749947A Composite controller |
| 03/22/2006 | CN1246904C Method of driving image sensor |
| 03/22/2006 | CN1246901C 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 03/22/2006 | CN1246897C Multi chip assemble and multi chip closing method |
| 03/21/2006 | US7015578 Semiconductor unit with cooling system |
| 03/21/2006 | US7015575 LSI package |
| 03/21/2006 | US7015574 Electronic device carrier adapted for transmitting high frequency signals |
| 03/21/2006 | US7015572 Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system |
| 03/21/2006 | US7015571 Multi-chips module assembly package |
| 03/21/2006 | US7015514 Light-emitting diode and method for the production thereof |
| 03/21/2006 | US7015070 Electronic device and a method of manufacturing the same |
| 03/21/2006 | US7015063 Methods of utilizing a back to back semiconductor device module |
| 03/16/2006 | WO2006028643A2 Circuit module system and method |
| 03/16/2006 | WO2006028312A1 Semiconductor device for emitting light and method for fabricating the same |
| 03/16/2006 | WO2006028155A1 Module type electronic component and electronic device |
| 03/16/2006 | WO2006027981A1 Stereoscopic electronic circuit device, electronic device using the same, and method for manufacturing the same |
| 03/16/2006 | WO2005109503A3 A method of assembly and assembly thus made |
| 03/16/2006 | WO2005091366A3 Semiconductor module comprising a coupling substrate and associated production method |
| 03/16/2006 | WO2005091365A3 Coupling substrate for semiconductor components and method for the production thereof |
| 03/16/2006 | US20060057866 Microelectronic packaging and components |
| 03/16/2006 | US20060055053 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
| 03/16/2006 | US20060055051 Method for producing chip stacks |
| 03/16/2006 | US20060055020 Stackable ball grid array |
| 03/16/2006 | US20060055019 Multi-chip package structure |
| 03/16/2006 | US20060055012 LED package with zener diode protection circuit |
| 03/16/2006 | US20060055009 Chip scale package with open substrate |
| 03/16/2006 | US20060055001 Semiconductor device having multiple substrates |
| 03/16/2006 | US20060054911 Light source assembly having high-performance heat dissipation means |
| 03/16/2006 | US20060054904 Light emitting diode and fabrication method thereof |
| 03/16/2006 | US20060054351 Substrate structure, a method and an arrangement for producing such substrate structure |
| 03/16/2006 | US20060054213 Photovoltaic module comprising external connector pins |
| 03/16/2006 | US20060054211 Photovoltaic modules for solar concentrator |
| 03/16/2006 | US20060054210 Photovoltaic module with an electronic device in the laminated stack |
| 03/16/2006 | DE202005017572U1 Light emitting diode matrix, has mounting plates attached in housing, and space between plates for contact legs of diodes, which are stuck over plates, where cooling medium flows over legs of diode during operation after housing is closed |
| 03/16/2006 | DE102005043013A1 Sensoranordnung mit einem Stopper zur Begrenzung einer Verschiebung Sensor array with a stopper to limit movement |
| 03/16/2006 | DE102004042488A1 Elektrische Baugruppe Electrical assembly |
| 03/16/2006 | DE102004037656A1 Bauteilanordnung mit optimierter Montagefähigkeit Component assembly with improved mounting capability |
| 03/16/2006 | DE102004034821A1 Halbleiter und Verfahren zu dessen Herstellung Semiconductor and process for its preparation |
| 03/15/2006 | EP1635404A2 Semiconductor composite device, method for manufacturing the semiconductor composite device, LED head that employs the semiconductor composite device, and image forming apparatus that employs the LED head |
| 03/15/2006 | EP1634332A1 Insulated metal substrate with at least one light diode, light diode matrix and production method |
| 03/15/2006 | EP1602133A4 Modular shade system with solar tracking panels |
| 03/15/2006 | EP1300001B1 Communication devices incorporating reduced area imaging devices |
| 03/15/2006 | CN2765327Y Module card |
| 03/15/2006 | CN1748310A Light emitting devices |
| 03/15/2006 | CN1748306A 半导体装置 Semiconductor device |
| 03/15/2006 | CN1747168A Mould set structure with multiple package and fins |
| 03/15/2006 | CN1747162A Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 03/15/2006 | CN1747154A Wafer supporting device, thin wafer holding method and manufacture of semiconductor device |
| 03/14/2006 | US7012810 Leadframe-based module DC bus design to reduce module inductance |
| 03/14/2006 | US7012325 Ultra-thin semiconductor package device and method for manufacturing the same |
| 03/14/2006 | US7012323 Microelectronic assemblies incorporating inductors |
| 03/14/2006 | US7012321 Stacked semiconductor device including improved lead frame arrangement |
| 03/14/2006 | US7011994 Method of forming wiring and method of manufacturing image display system by using the same |
| 03/14/2006 | US7011989 Method for producing encapsulated chips |
| 03/14/2006 | US7011985 Method for producing miniature amplifier and signal processing unit |
| 03/09/2006 | WO2006024330A1 Power semiconductor module |
| 03/09/2006 | WO2006010903A3 Multiple chip semiconductor device |
| 03/09/2006 | WO2005117107A3 Power semiconductor module and method for cooling a power semiconductor module |
| 03/09/2006 | WO2005083803A3 Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
| 03/09/2006 | WO2005020288A3 Multiple cavity/compartment package |
| 03/09/2006 | US20060051953 Module assembly and method for stacked BGA packages |
| 03/09/2006 | US20060050526 Light-emitting diode |
| 03/09/2006 | US20060049528 Semiconductor chip stack structure and method for forming the same |
| 03/09/2006 | US20060049504 Module assembly and method for stacked BGA packages |
| 03/09/2006 | US20060049495 Semiconductor package and laminated semiconductor package |
| 03/09/2006 | US20060049475 High power LED array |
| 03/09/2006 | US20060048810 Solar electricity generator consisting of groups of plants |