| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/12/2006 | CN1758436A High power LED array module |
| 04/12/2006 | CN1758435A Physical quantity sensor and manufacturing method therefor |
| 04/12/2006 | CN1758433A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/12/2006 | CN1758430A Semiconductor device and manufacturing method thereof |
| 04/12/2006 | CN1251333C Luminous module and drive method for said same and optical detector |
| 04/12/2006 | CN1251327C Semiconductor integrated circuit, signal transmitting device, electro-optical device, and electronic apparatus |
| 04/12/2006 | CN1251319C Microelectronic component insert making method |
| 04/12/2006 | CN1251001C Method for producing surface illuminating back light apparatus and surface illuminating back light apparatus |
| 04/11/2006 | US7027302 Coolant cooled type semiconductor device |
| 04/11/2006 | US7026719 Semiconductor package with a heat spreader |
| 04/11/2006 | US7026718 Stacked multi-component integrated circuit microprocessor |
| 04/11/2006 | US7026709 Stacked chip-packaging structure |
| 04/11/2006 | US7026708 Low profile chip scale stacking system and method |
| 04/11/2006 | US7026651 Light emitting device having a pseudo-continuous spectrum and lighting apparatus using the same |
| 04/11/2006 | US7026188 Electronic device and method for manufacturing the same |
| 04/11/2006 | US7025651 Light emitting diode, light emitting device using the same, and fabrication processes therefor |
| 04/11/2006 | US7025477 Illumination apparatus |
| 04/11/2006 | US7024765 Method of manufacturing surface-emitting backlight by molding contact member integrally with molded case |
| 04/06/2006 | WO2006034670A1 Semiconductor module with stacked semiconductor components and electrical connecting elements between the stacked semiconductor components |
| 04/06/2006 | WO2006034668A2 Led array with temperature sensor |
| 04/06/2006 | WO2005057672A3 Surface mount light emitting chip package |
| 04/06/2006 | US20060073639 Electronic parts packaging structure and method of manufacturing the same |
| 04/06/2006 | US20060072295 Method for producing microsystems |
| 04/06/2006 | US20060071315 Method of forming a stacked semiconductor package |
| 04/06/2006 | US20060071246 Semiconductor device and sustaining circuit |
| 04/06/2006 | US20060071237 Circuit arrangement comprising a power component and a drive circuit integrated in two semiconductor bodies |
| 04/06/2006 | DE202006001650U1 Construction for a memory card frame especially a mini SD card has rubber frame with space for a circuit board and an insulated metal cover |
| 04/06/2006 | DE102004047682A1 LED-Array LED array |
| 04/06/2006 | DE102004047306A1 Power semiconductor component, has power and control assemblies, which are contacted by bonding wires of different thickness, where bonding wires serving as contact surface are thicker than contacted bonding wires |
| 04/06/2006 | DE102004013733B4 Halbleiterbauteil in Stapelbauweise mit einem optisch aktiven Halbleiterchip und Verfahren zu seiner Herstellung A stacked type semiconductor device with an optically active semiconductor chip, and process for its preparation |
| 04/06/2006 | DE10138659B4 Verfahren zur Herstellung einer Anordnung aus einem Halbleiterchip und einer damit verbundenen Leiterbahnstruktur A process for preparing an assembly of a semiconductor chip and an associated conductor track structure |
| 04/05/2006 | EP1643554A2 Light emitting diode assembly |
| 04/05/2006 | EP1643553A2 Copper interposer for reducing warping of integrated circuit packages and method of making IC packages |
| 04/05/2006 | EP1643552A1 Module including circuit elements |
| 04/05/2006 | EP1642336A1 Method for interconnecting active and passive components, and a resulting thin heterogeneous component |
| 04/05/2006 | EP1642334A1 Electronic power module comprising a rubber seal and corresponding production method |
| 04/05/2006 | CN1757109A Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
| 04/05/2006 | CN1757103A Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 04/05/2006 | CN1756922A Vehicle headlamp |
| 04/05/2006 | CN1756456A Pattern formed structure, method of forming pattern, device, electrooptical device and electronic equipment |
| 04/05/2006 | CN1755953A Full color LED formed by superposition of three primary colors |
| 04/05/2006 | CN1755952A Dissimilar LED luminous sheet or casing |
| 04/05/2006 | CN1755931A Package with multiple wafers and packaging method thereof |
| 04/05/2006 | CN1755917A Semiconductor monitoring device and manufacturing method thereof |
| 04/05/2006 | CN1755916A Semiconductor device and manufacturing method of the same |
| 04/05/2006 | CN1250061C Method for producing electronic element with protective box |
| 04/05/2006 | CN1249798C Method for manufacturing mixed integrated circuit device |
| 04/04/2006 | US7024653 Architecture for efficient implementation of serial data communication functions on a programmable logic device (PLD) |
| 04/04/2006 | US7023707 Information handling system |
| 04/04/2006 | US7023706 Semiconductor device and manufacturing the same |
| 04/04/2006 | US7023096 Multi-chip package having spacer that is inserted between chips and manufacturing method thereof |
| 04/04/2006 | US7023086 Semiconductor component arrangement with a reduced oscillation tendency |
| 04/04/2006 | US7023082 Semiconductor package and manufacturing method thereof |
| 04/04/2006 | US7023079 Stacked semiconductor chip package |
| 04/04/2006 | US7023073 Noise shield type multi-layered substrate |
| 04/04/2006 | US7022997 Photoelectric converter, its driving method, and system including the photoelectric converter |
| 04/04/2006 | US7022913 Electronic component, method of manufacturing the electronic component, and electronic apparatus |
| 04/04/2006 | US7022553 Compact system module with built-in thermoelectric cooling |
| 04/04/2006 | US7022552 Semiconductor device and method for fabricating semiconductor device |
| 04/04/2006 | US7022399 Semiconductor device integrated multilayer wiring board |
| 04/04/2006 | US7021799 Light source unit |
| 04/04/2006 | US7021520 Stacked chip connection using stand off stitch bonding |
| 03/30/2006 | WO2006032726A1 Method for assembling an opto-electric module and a structure of an opto-electric module |
| 03/30/2006 | WO2006032250A1 Semi-conductor component provided with through contacts which pass through plastic housing material and method for the production thereof |
| 03/30/2006 | WO2006003563A3 Light emitting diode module |
| 03/30/2006 | WO2005057637A3 Method for the molecular bonding of microelectronic components to a polymer film |
| 03/30/2006 | US20060070016 Data processing in digital systems |
| 03/30/2006 | US20060068523 Integrated circuit package |
| 03/30/2006 | US20060065968 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
| 03/30/2006 | US20060065841 Packaging structure for imaging detectors |
| 03/30/2006 | US20060065302 System and sub-systems for production and use of hydrogen |
| 03/30/2006 | DE102004047182A1 Elektronisches Gerät mit einem mehrschichtigen Keramiksubstrat An electronic device with a multi-layer ceramic substrate |
| 03/30/2006 | DE102004044166A1 Explosionsgeschützte Leuchte Explosion proof light |
| 03/29/2006 | EP1641049A1 Optical semiconductor device |
| 03/29/2006 | EP1641043A1 Full-color light-emitting diode (LED) formed by overlaying red, green and blue LED diode dies |
| 03/29/2006 | EP1639645A1 Microelectronic package method and apparatus |
| 03/29/2006 | EP1224698B1 Method for producing a microfunctional composite device |
| 03/29/2006 | EP1153419B1 Multiple chip module with integrated rf capabilities |
| 03/29/2006 | EP1070677B1 Microcap wafer-level package |
| 03/29/2006 | CN1754268A Lighting module and method for the production thereof |
| 03/29/2006 | CN1753200A Light emitting diode device |
| 03/29/2006 | CN1753192A Luminous diode modularization device |
| 03/29/2006 | CN1753182A Stacked light source |
| 03/29/2006 | CN1753181A Prossure fixing mechanism of series thyristor valve set |
| 03/29/2006 | CN1753180A Semiconductor packaging structure having microstrip antenna structure |
| 03/29/2006 | CN1753179A External pin lens semiconductor packaging structure and its manufacturing method |
| 03/29/2006 | CN1753177A Power semiconductor module and method of manufacturing the same |
| 03/29/2006 | CN1248312C Multi-layer integrated circuit for join of substrates with wide gaps |
| 03/28/2006 | US7020701 Method for collecting and processing data using internetworked wireless integrated network sensors (WINS) |
| 03/28/2006 | US7019408 Stackable ball grid array |
| 03/28/2006 | US7019404 Multilayered circuit substrate, semiconductor device and method of producing same |
| 03/28/2006 | US7019397 Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device |
| 03/28/2006 | US7019390 Silicon nitride insulating substrate for power semiconductor module |
| 03/28/2006 | US7019300 Radiation image taking apparatus |
| 03/28/2006 | US7018866 Circuit component built-in module with embedded semiconductor chip and method of manufacturing |
| 03/28/2006 | US7018575 Method for assembly of complementary-shaped receptacle site and device microstructures |
| 03/28/2006 | US7018218 Device for controlling a vehicle |
| 03/28/2006 | US7018065 Light-emitting diode light source unit |
| 03/28/2006 | US7017638 Forming folded-stack packaged device using vertical progression folding tool |
| 03/28/2006 | CA2333973C Scaleable integrated data processing device |