| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 04/26/2006 | CN1765021A Semiconductor device |
| 04/26/2006 | CN1764351A Bank structure, method of forming bank structure, device, electro-optical device and electronic apparatus |
| 04/26/2006 | CN1763982A Light source with a light-emitting element |
| 04/26/2006 | CN1763947A Lsi package provided with interface module, and transmission line header employed in the package |
| 04/26/2006 | CN1763946A Optical member,optical connector and electronic parts and instrument |
| 04/26/2006 | CN1763940A Contact unit for high power semiconductor module an round disk |
| 04/26/2006 | CN1763924A Electronic circuit packaging process |
| 04/26/2006 | CN1763584A Method and apparatus for mixing light emitted by a plurality of solid-state light emitters |
| 04/25/2006 | US7036105 Integrated circuits with at least one layer that has more than one preferred interconnect direction, and method for manufacturing such IC's |
| 04/25/2006 | US7036058 Semiconductor device having integrally sealed integrated circuit chips arranged for improved testing |
| 04/25/2006 | US7035113 Multi-chip electronic package having laminate carrier and method of making same |
| 04/25/2006 | US7034401 Packaging substrates for integrated circuits and soldering methods |
| 04/25/2006 | US7034395 Power semiconductor module with cooling element and pressing apparatus |
| 04/25/2006 | US7034392 Duplexer |
| 04/25/2006 | US7034388 Stack type flip-chip package |
| 04/25/2006 | US7034387 Semiconductor multipackage module including processor and memory package assemblies |
| 04/25/2006 | US7034386 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
| 04/25/2006 | US7034345 High-power, integrated AC switch module with distributed array of hybrid devices |
| 04/25/2006 | US7033935 Semiconductor device and method for manufacturing the same |
| 04/25/2006 | US7033911 Adhesive of folded package |
| 04/25/2006 | US7033860 Process for manufacturing semiconductor device |
| 04/25/2006 | US7033655 Thermofusible polymer(s) of vinylacetate-ethylene, polyisobutylene, polyamide, or based on sealant of polyurethane, polysulphide or silicone |
| 04/20/2006 | US20060084285 Circuit carrier and production thereof |
| 04/20/2006 | US20060084258 Semiconductor device and method of manufacturing the same |
| 04/20/2006 | US20060082983 Leadframe-based module DC bus design to reduce module inductance |
| 04/20/2006 | US20060082969 Alternator in connection with a remotely-cooled rectifier |
| 04/20/2006 | US20060082681 Solder reflux method for holding cryogenically aligned parts |
| 04/20/2006 | US20060081980 Integrated circuit package employing a heat-spreader member |
| 04/20/2006 | US20060081977 Ceramic multilayer substrate |
| 04/20/2006 | US20060081833 Package structure of light-emitting device |
| 04/20/2006 | US20060081785 X-ray detector |
| 04/20/2006 | US20060081770 Low-photon flux image-intensified electronic camera |
| 04/20/2006 | US20060081270 Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus |
| 04/20/2006 | DE19616014B4 Verfahren zur Herstellung von mikromechanische Strukturen aufweisenden Halbleiterbauelementen A process for producing micromechanical structures having semiconductor devices |
| 04/20/2006 | DE112004000864T5 Licht abstrahlende Dioden - Baugruppe und Licht abstrahlendes Diodensystem mit mindestens zwei Wärmesenken Light-emitting diodes - assembly and light-emitting diode system with at least two heat sinks |
| 04/20/2006 | DE102005043649A1 Lichtemissionsbauteil mit Stromkreis-Schutzschaltung Light emitting device with circuit protection circuit |
| 04/20/2006 | DE102004050792A1 Bauelemente-Modul für Hochtemperaturanwendungen und Verfahren zum Herstellen eines derartigen Bauelemente-Moduls Components module for high temperature applications and methods for producing such components module |
| 04/20/2006 | DE102004049356A1 Halbleitermodul mit einem internen Halbleiterchipstapel und Verfahren zur Herstellung desselben Of the same semiconductor module with an internal semiconductor chip stack and processes for preparing |
| 04/20/2006 | DE102004048908A1 Antriebsstrang für ein Fahrzeug mit elektrischer Maschine Driveline for a vehicle with electric machine |
| 04/20/2006 | DE102004044882B3 Halbleitermodul mit gestapelten Halbleiterbauteilen und elektrischen Verbindungselementen zwischen den gestapelten Halbleiterbauteilen A semiconductor module with stacked semiconductor devices and electrical connecting elements between the stacked semiconductor devices |
| 04/20/2006 | DE10102750B4 Schaltungsanordnung Circuitry |
| 04/20/2006 | DE10056281B4 Elektronisches Bauteil mit einem Halbleiterchip Electronic component having a semiconductor chip |
| 04/19/2006 | EP1648029A2 Contact device for power semiconductor moduls and disc-shaped semiconductor cells |
| 04/19/2006 | EP1647173A2 Packaging of semiconductor devices for increased reliability |
| 04/19/2006 | EP1647051A2 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 04/19/2006 | CN2773910Y Integrated AC LED filament |
| 04/19/2006 | CN2773907Y Chip mould set |
| 04/19/2006 | CN2773906Y Crystal-coated chip piling and packing structure |
| 04/19/2006 | CN1761058A 3D superposition type module of multi-chip |
| 04/18/2006 | US7030904 Reduced area imaging device incorporated within wireless endoscopic devices |
| 04/18/2006 | US7030501 Semiconductor device and switching element |
| 04/18/2006 | US7030494 Semiconductor package having built-in micro electric mechanical system and manufacturing method thereof |
| 04/18/2006 | US7030491 Power semiconductor module with deflection-resistant base plate |
| 04/18/2006 | US7030489 Multi-chip module having bonding wires and method of fabricating the same |
| 04/18/2006 | US7030482 Method and apparatus for protecting a die ESD events |
| 04/18/2006 | US7030481 High density chip carrier with integrated passive devices |
| 04/18/2006 | US7030477 Optical semiconductor device |
| 04/18/2006 | US7030472 Integrated circuit device having flexible leadframe |
| 04/18/2006 | US7030445 Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 04/18/2006 | US7030411 Electronic unit integrated into a flexible polymer body |
| 04/18/2006 | US7030378 Real-time radiation sensor calibration |
| 04/18/2006 | US7030359 Exposing a UV-sensitive glass layer in selected areas between receiver and emitter areas in a reflected-light sensor; tempering UV-sensitive glass layer to produce light-absorbing areas in selected areas; wherein at least two glass layers are stacked on one top of other connected by diffusion bonds |
| 04/18/2006 | US7029953 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device |
| 04/18/2006 | US7029950 Thin-film semiconductor device and method of manufacturing the same |
| 04/18/2006 | US7029946 Method for manufacturing semiconductor device and semiconductor device |
| 04/18/2006 | US7029937 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 04/18/2006 | US7029931 Stacked die module and techniques for forming a stacked die module |
| 04/13/2006 | WO2006039642A1 Cpu power delivery system |
| 04/13/2006 | WO2005115072A3 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 04/13/2006 | WO2005041256A3 An integrated circuit micro-cooler using self-assembled nano structures |
| 04/13/2006 | US20060079027 Semiconductor device and its manufacturing method |
| 04/13/2006 | US20060079023 Semiconductor device and manufacturing method for the same |
| 04/13/2006 | US20060079014 Method of manufacturing an LED |
| 04/13/2006 | US20060077749 Memory card structure and manufacturing method thereof |
| 04/13/2006 | US20060077723 Memory circuit arrangement and method for the production thereof |
| 04/13/2006 | US20060076686 Method for manufacturing an electronic module, and an electronic module |
| 04/13/2006 | US20060076671 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module |
| 04/13/2006 | US20060076661 Attachment of integrated circuit structures and other substrates to substrates with vias |
| 04/13/2006 | US20060076655 Integrated circuit package employing a flexible substrate |
| 04/13/2006 | US20060076620 Semiconductor device |
| 04/13/2006 | US20060076566 Light emitting device and optical device using the same |
| 04/13/2006 | DE202005018155U1 Light emitting module for light source of e.g. table lamp, has substrate with recesses for light emitting diode chips, in which sidewalls of recesses have different angles such that light angle of chips is different |
| 04/13/2006 | DE19739684B4 Verfahren zur Herstellung von Chipstapeln Process for the preparation of chip stacks |
| 04/13/2006 | DE102004049663B3 Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung derselben Plastic housing and the semiconductor device with such plastic housing, as well as methods for making same |
| 04/13/2006 | DE102004049654B3 Halbleiterbauteil mit Kunststoffgehäuse und Verfahren zur Herstellung desselben Of the same semiconductor device with plastic housing and methods for preparing |
| 04/13/2006 | DE102004047763A1 Mehrfachleuchtdiodenanordnung Multiple LED arrangement |
| 04/13/2006 | DE102004046806A1 Leistungshalbleitermodul The power semiconductor module |
| 04/13/2006 | DE102004046699A1 Contact surfaces e.g. cooling unit, connecting device, has contact surfaces connected by solidifying liquid e.g. melted solder, such that section of one of two surface edges exhibits structuring in area of edges |
| 04/12/2006 | EP1646090A1 Light-emitting or light-receiving semiconductor device and method for making the same |
| 04/12/2006 | EP1646089A2 Light-emitting or light-receiving semiconductor module and method for making the same |
| 04/12/2006 | EP1645023A2 Printed circuit board for a three-phase power device having embedded directional impedance control channels |
| 04/12/2006 | EP1644996A2 A two stage energy storage device |
| 04/12/2006 | EP1644991A2 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same |
| 04/12/2006 | EP1644976A2 Stackable integrated circuit package and method therefor |
| 04/12/2006 | EP1364392B1 Method of manufacturing optical devices and related improvements |
| 04/12/2006 | EP1226610B1 Optical semiconductor housing and method for making same |
| 04/12/2006 | EP1029360A4 Vertical interconnect process for silicon segments with dielectric isolation |
| 04/12/2006 | CN2772031Y Packaging structure for light-emitting device |
| 04/12/2006 | CN1759487A LED package die having a small footprint |
| 04/12/2006 | CN1758438A Semiconductor memory device and package thereof, and memory card using the same |