| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/15/2006 | WO2004079797A3 High speed electronics interconnect and method of manufacture |
| 06/15/2006 | US20060128101 Memory package |
| 06/15/2006 | US20060128067 Semiconductor device package |
| 06/15/2006 | US20060128060 Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same |
| 06/15/2006 | US20060128059 Compact system module with built-in thermoelectric cooling |
| 06/15/2006 | US20060126328 LED light source assembly |
| 06/15/2006 | US20060126313 Electronic component with a housing package |
| 06/15/2006 | US20060126312 Housing for power semiconductor modules |
| 06/15/2006 | US20060125116 Multi-chip module |
| 06/15/2006 | US20060125096 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 06/15/2006 | US20060125093 Multi-chip module having bonding wires and method of fabricating the same |
| 06/15/2006 | US20060125092 High density integrated circuit package architecture |
| 06/15/2006 | US20060125083 Multi-layer interconnection circuit module and manufacturing method thereof |
| 06/15/2006 | US20060125076 Circuit boards, electronic devices, and methods of manufacturing thereof |
| 06/15/2006 | US20060125058 Semiconductor circuitry constructions |
| 06/15/2006 | US20060125042 Electronic component and panel for producing the same |
| 06/15/2006 | US20060124957 Single-phase converter module |
| 06/15/2006 | US20060124955 Method of manufacturing surface-emitting backlight, by molding contact member integrally with molded case |
| 06/15/2006 | US20060124345 Method for manufacturing board with built-in device and board with built-in device and method for manufacturing printed wiring board and printed wiring board |
| 06/15/2006 | US20060124167 Thermal-efficient power converter enclosure for solar panels |
| 06/15/2006 | US20060124166 Method and apparatus for achieving worldwide reduction of carbon dioxide emissions and deforestation |
| 06/14/2006 | EP1670071A1 Semiconductor light emitting device |
| 06/14/2006 | EP1670069A1 Linear light source and production method therefor and surface emission device |
| 06/14/2006 | EP1668702A1 Sphere-supported thin film phosphor electroluminescent devices |
| 06/14/2006 | EP1668686A2 Reversible leadless package and methods of making and using same |
| 06/14/2006 | EP1304019B1 Illuminating device with light emitting diodes (led), method of illumination and method for image recording with said led illumination device |
| 06/14/2006 | DE10303463B4 Halbleiterbauelement mit wenigstens zwei in einem Gehäuse integrierten und durch einen gemeinsamen Kontaktbügel kontaktierten Chips Semiconductor component having at least two integrated in a housing and contacted by a common contact bridge chips |
| 06/14/2006 | DE102005057981A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 06/14/2006 | DE102004058946A1 Leistungshalbleitermodul mit Hilfsanschluss Power semiconductor module with auxiliary port |
| 06/14/2006 | DE102004039883B3 Transparent element comprises primary and secondary transparent plates, and an intermediate electrical consumer |
| 06/14/2006 | DE10011537B4 Optoelektronische integrierte Schaltungsvorrichtung Opto-electronic integrated circuit device |
| 06/14/2006 | CN2788355Y MOSFET and Schottky diode combining small form package |
| 06/14/2006 | CN1788331A High power AlInGaN based multi-chip light emitting diode |
| 06/14/2006 | CN1787215A Integrated circuit chip with fast flash memory and identifying function |
| 06/14/2006 | CN1787214A Organic luminous display with dual fase displaying |
| 06/14/2006 | CN1787213A Image pickup module |
| 06/14/2006 | CN1787212A Multi-level semiconductor module and method for fabricating the same |
| 06/14/2006 | CN1787210A Power semiconductor module with auxiliary connector |
| 06/14/2006 | CN1259717C Power semiconductor module |
| 06/13/2006 | US7061785 Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of package |
| 06/13/2006 | US7061454 Light emitting diode device |
| 06/13/2006 | US7061271 Six-input look-up table for use in a field programmable gate array |
| 06/13/2006 | US7061269 I/O buffer architecture for programmable devices |
| 06/13/2006 | US7061257 Probe card assembly |
| 06/13/2006 | US7061122 Components, methods and assemblies for multi-chip packages |
| 06/13/2006 | US7061121 Stacked microelectronic assemblies with central contacts |
| 06/13/2006 | US7061120 Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| 06/13/2006 | US7061118 Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 06/13/2006 | US7061113 Semiconductor apparatus, led head, and image forming apparatus |
| 06/13/2006 | US7061107 Semiconductor device and manufacturing method of the same |
| 06/13/2006 | US7061105 Semiconductor device and a method of manufacturing the same |
| 06/13/2006 | US7061103 Chip package structure |
| 06/13/2006 | US7061100 Semiconductor built-in millimeter-wave band module |
| 06/13/2006 | US7061097 Semiconductor device and manufacturing method for the same |
| 06/13/2006 | US7061092 High-density modularity for ICS |
| 06/13/2006 | US7061089 Memory module having space-saving arrangement of memory chips and memory chip therefore |
| 06/13/2006 | US7061088 Semiconductor stacked multi-package module having inverted second package |
| 06/13/2006 | US7061087 Multi-package stack module |
| 06/13/2006 | US7061079 Chip package structure and manufacturing method thereof |
| 06/13/2006 | US7061064 Semiconductor device and package for containing semiconductor element |
| 06/13/2006 | US7060601 Packaging substrates for integrated circuits and soldering methods |
| 06/13/2006 | US7060529 Multiple chip semiconductor arrangement having electrical components in separating regions |
| 06/13/2006 | US7060528 Method for mounting a semiconductor element to an interposer by compression bonding |
| 06/13/2006 | US7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components |
| 06/08/2006 | WO2006060746A2 Visible light and ir combined image camera with a laser pointer |
| 06/08/2006 | WO2006059589A1 Packaged stacked semiconductor device and method for manufacturing same |
| 06/08/2006 | WO2006059381A1 Semiconductor device and method for manufacturing the same |
| 06/08/2006 | WO2006058850A1 Metallised film for sheet contacting |
| 06/08/2006 | WO2006058477A1 Thin small outline package in which mosfet and schottky diode being co-packaged |
| 06/08/2006 | WO2005101492A3 Stacked die bga or lga component assembly |
| 06/08/2006 | WO2005101491A3 Micropede stacked die component assembly |
| 06/08/2006 | US20060121645 Method of fabrication of stacked semiconductor devices |
| 06/08/2006 | US20060120047 Coolant cooled type semiconductor device |
| 06/08/2006 | US20060119668 Manufacturing process of light-emitting device |
| 06/08/2006 | US20060119512 Power semiconductor device |
| 06/08/2006 | US20060118970 Semiconductor device, its manufacturing method, and radio communication device |
| 06/08/2006 | US20060118938 Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging |
| 06/08/2006 | US20060118927 Memory module having interconnected and stacked integrated circuits |
| 06/08/2006 | US20060118832 Fast switching power insulated gate semiconductor device |
| 06/08/2006 | US20060118816 Press pack power semiconductor module |
| 06/08/2006 | US20060118163 Rack assembly for mounting solar modules |
| 06/08/2006 | US20060118162 Powering a vehicle and providing excess energy to an external device using photovoltaic cells |
| 06/08/2006 | DE102005035654A1 Kühlsystem eines Stromhalbleitermoduls Cooling system of a power semiconductor module |
| 06/08/2006 | DE102004058395A1 Stackable semiconductor chip wiring method, involves applying filling material into semiconductor chip adjacent region, and applying conductive layer on chip front side, and connecting chip contacting region with contacting surfaces |
| 06/08/2006 | DE102004057494A1 Metallisierte Folie zur flächigen Kontaktierung Metallized film for dimensional contacting |
| 06/08/2006 | DE102004057421A1 Pressure contact power semiconductor module for higher temperature operation as in motor vehicles has sinter contact technology and contact spring for control connection |
| 06/08/2006 | DE102004056984A1 Stromrichteranordnung Converter assembly |
| 06/08/2006 | DE102004054063B3 Process to produce a crack free connection between two components of different thermal coefficients of expansion such a power semiconductor and heat sink uses hot gas spray |
| 06/08/2006 | DE10147375B4 Elektronisches Bauteil mit einem Halbleiterchip und Verfahren zur Herstellung desselben The same electronic component having a semiconductor chip and method for producing |
| 06/07/2006 | WO2006070863A1 Semiconductor chip mounting structure and method for manufacturing same |
| 06/07/2006 | EP1667325A1 Programmable logic device with unified cell structure including signal interface bumps |
| 06/07/2006 | EP1667228A2 Semiconductor light emitting device and method of manufacturing the same |
| 06/07/2006 | EP1667227A1 Module and mounting structure using the same |
| 06/07/2006 | EP1665397A2 Led lighting source and led lighting apparatus |
| 06/07/2006 | EP1665393A2 Pv wind performance enhancing methods and apparatus |
| 06/07/2006 | EP1665380A2 Integrated lamp with feedback and wireless control |
| 06/07/2006 | EP1665379A1 Electronic package having a folded flexible substrate and method of manufacturing the same |
| 06/07/2006 | EP1665374A2 Multiple cavity/compartment package |
| 06/07/2006 | EP1663058A2 Illuminated electric toothbrushes |
| 06/07/2006 | EP1663057A2 Toothbrush with severable electrical connections |