| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 05/24/2006 | DE19527611B4 Verfahren zum Herstellen eines Substrats für elektrische Schaltkreise A method for producing a substrate for electrical circuits |
| 05/24/2006 | DE102004055534A1 Power semiconductor module, has wiring layer internally connected with sprayed layer, coated on insulating layer and formed by spraying particle on particle area of heat-sink in stream of hot gas |
| 05/24/2006 | DE102004054837A1 Illuminating unit for rear projector, has illuminant including multiple LEDs, which are arranged adjacently and one above the other on printed circuit board, and heat sink arranged on rear side of LEDs |
| 05/24/2006 | DE10159851B4 Halbleiterbauelementanordnung mit verminderter Oszillationsneigung Semiconductor device assembly with reduced to oscillation |
| 05/24/2006 | DE10102621B4 Leistungsmodul Power module |
| 05/24/2006 | CN1777991A Lamp and method of producing a lamp |
| 05/24/2006 | CN1776908A Semiconductor light emitting device, backlight device for liquid crystal display |
| 05/24/2006 | CN1257552C 半导体器件 Semiconductor devices |
| 05/24/2006 | CN1257546C Integrated circuit element installation structure and method |
| 05/24/2006 | CN1257540C Semiconductor chip package method and its package structure |
| 05/23/2006 | US7050304 Heat sink structure with embedded electronic components for semiconductor package |
| 05/23/2006 | US7050303 Semiconductor module with vertically mounted semiconductor chip packages |
| 05/23/2006 | US7049761 Light tube and power supply circuit |
| 05/23/2006 | US7049746 Light-emitting unit and illuminator utilizing the same |
| 05/23/2006 | US7049692 Stacked semiconductor device |
| 05/23/2006 | US7049691 Die attached to substrate; stacked die packages connected by wire bonding |
| 05/23/2006 | US7049688 Semiconductor device having a pair of heat sinks and method for manufacturing the same |
| 05/23/2006 | US7049684 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
| 05/23/2006 | US7049528 Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module |
| 05/23/2006 | US7049229 Method of fabricating semiconductor device and semiconductor device |
| 05/23/2006 | US7049217 Method of forming multi-piled bump |
| 05/23/2006 | US7049170 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities |
| 05/23/2006 | US7048866 Metal/ceramic bonding article and method for producing same |
| 05/23/2006 | US7047634 Method of making a multilayer wiring board |
| 05/18/2006 | WO2006052344A2 Voltage regulator and method using substrate board with insulator layer and conductive traces |
| 05/18/2006 | WO2006051887A1 Ic chip, antenna, and manufacturing method of the ic chip and the antenna |
| 05/18/2006 | US20060105737 Method and apparatus for integrating a surface acoustic wave filter and a transceiver |
| 05/18/2006 | US20060105504 Fabrication method of semiconductor integrated circuit device |
| 05/18/2006 | US20060105498 Wafer stack separator |
| 05/18/2006 | US20060103421 System-in-package type semiconductor device |
| 05/18/2006 | US20060103015 Multi-chip electronic package and cooling system |
| 05/18/2006 | US20060103005 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate |
| 05/18/2006 | US20060102226 Method for producing the photoelectrode of a solar cell |
| 05/18/2006 | US20060102225 Base assembly having a plurality of solar powered illuminators for simultaneously illumination |
| 05/18/2006 | DE19729677B4 Gehäuse für Halbleiterbauelemente, insbesondere für Leistungshalbleiterbauelemente Enclosure for semiconductor devices, in particular for power semiconductor components |
| 05/18/2006 | DE10349839B4 Elektrisches Bauelement mit einem transparenten Kunststoffgehäuse Electrical component with a transparent plastic case |
| 05/18/2006 | DE102004055061A1 Verfahren zur Anordnung eines Flip-Chips auf einem Substrat A process for the assembly of a flip chip on a substrate |
| 05/18/2006 | DE102004054822A1 Leuchte für Fahrzeuge, vorzugsweise für Kraftfahrzeuge Light for vehicles, preferably for motor vehicles |
| 05/18/2006 | DE10126310B4 Leiterplattenvorrichtung, deren Verwendung und Halbleiterspeichervorrichtung Printed circuit board means, their use and the semiconductor memory device |
| 05/17/2006 | EP1657750A1 Semiconductor device |
| 05/17/2006 | EP1657749A2 Multilevel microelectronic package with internal shielding |
| 05/17/2006 | EP1657746A1 Semiconductor device and method for making the same |
| 05/17/2006 | CN2781172Y High brightness LED bulb |
| 05/17/2006 | CN1774818A Selfluminous device |
| 05/17/2006 | CN1774800A Metal-base circuit board and its manufacturing method |
| 05/17/2006 | CN1773880A 通讯模块 Communication module |
| 05/17/2006 | CN1773740A Integrated thermoelectric cooling devices and methods for fabricating same |
| 05/17/2006 | CN1773703A White light emitting element and producing method thereof |
| 05/17/2006 | CN1773702A Light-emitting diode module and light-emitting diode bulb made of the same |
| 05/17/2006 | CN1773701A Electronic packed element containing photoelectric element and integrated circuit |
| 05/17/2006 | CN1773700A Packing structure of multichip |
| 05/17/2006 | CN1256769C Power source semiconductor module and cooling element for holding semiconductor module |
| 05/17/2006 | CN1256738C High-frequency power amplifier |
| 05/16/2006 | US7046522 Method for scalable architectures in stackable three-dimensional integrated circuits and electronics |
| 05/16/2006 | US7046518 Power module |
| 05/16/2006 | US7045907 Semiconductor device and method of manufacturing same |
| 05/16/2006 | US7045905 Molded package and semiconductor device using molded package |
| 05/16/2006 | US7045901 Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board |
| 05/16/2006 | US7045900 Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device |
| 05/16/2006 | US7045899 Semiconductor device and fabrication method of the same |
| 05/16/2006 | US7045892 Stack package of semiconductor device |
| 05/16/2006 | US7045887 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 05/16/2006 | US7045886 Semiconductor device and method of fabricating the same |
| 05/16/2006 | US7045884 Semiconductor device package |
| 05/16/2006 | US7045835 High-density inter-die interconnect structure |
| 05/16/2006 | US7045828 Card-type LED illumination source |
| 05/16/2006 | US7045824 High speed optical subassembly with ceramic carrier |
| 05/16/2006 | US7045820 Light emitting device having a sensor for determining luminous intensity |
| 05/16/2006 | US7045443 Method for manufacturing semiconductor device, semiconductor device, circuit board, and electronic apparatus |
| 05/16/2006 | US7045396 Stackable semiconductor package and method for manufacturing same |
| 05/16/2006 | US7045390 Stacked die package |
| 05/16/2006 | US7045386 Semiconductor device and semiconductor chip for use therein |
| 05/16/2006 | US7045375 White light emitting device and method of making same |
| 05/16/2006 | US7044657 Transistor outline package with exteriorly mounted resistors |
| 05/11/2006 | WO2006050446A1 Structures and methods for proximity communication using bridge chips |
| 05/11/2006 | WO2006049849A1 Process for manufacturing a light emitting array |
| 05/11/2006 | WO2006049799A2 Solar concentrator |
| 05/11/2006 | WO2006016326A3 Led lamp system |
| 05/11/2006 | WO2006013230A3 Manufacture of a layer including a component |
| 05/11/2006 | WO2006012842A3 Optoelectronic component that emits electromagnetic radiation and illumination module |
| 05/11/2006 | WO2006002607A3 Light-emitting diode arrangement, optical recording device and method for the pulsed operation of at least one light-emitting diode |
| 05/11/2006 | WO2005083789A3 Micro-optics on optoelectronics |
| 05/11/2006 | US20060099796 Method of forming a multi-layer semiconductor structure having a seam-less bonding interface |
| 05/11/2006 | US20060099735 Method for wafer level stack die placement |
| 05/11/2006 | US20060097750 Electronic circuit with array of programmable logic cells |
| 05/11/2006 | US20060097408 Semiconductor package device and method for fabricating the same |
| 05/11/2006 | US20060097381 Chip package with grease heat sink |
| 05/11/2006 | US20060097380 Semiconductor module |
| 05/11/2006 | US20060097376 Electronic product, a body and a method of manufacturing |
| 05/11/2006 | US20060097367 Integrated circuit device having flexible leadframe |
| 05/11/2006 | US20060097276 Flip chip type LED lighting device manufacturing method |
| 05/11/2006 | US20060097266 Large-diameter sic wafer and manufacturing method thereof |
| 05/11/2006 | US20060096632 Sealed thin film photovoltaic modules |
| 05/11/2006 | DE202006002797U1 Electrical illuminating device with light emitting diode (LED) for emergency lighting e.g. in ships has LED carrier fitted with single piece block which consists of heat conducting material and is thermally coupled with LED |
| 05/11/2006 | DE19806017B4 Halbleiter-Multichip-Modul Semiconductor multi-chip module |
| 05/11/2006 | DE102005025452A1 Halbleitervorrichtung mit einer Durchgangselektrode und Verfahren zu ihrer Herstellung A semiconductor device having a through electrode and process for their preparation |
| 05/11/2006 | DE102004052921A1 Verfahren zur Herstellung von Halbleiterbauelementen mit externen Kontaktierungen A process for producing semiconductor devices with external contacts |
| 05/10/2006 | EP1654761A2 Module for epas/ehpas applications |
| 05/10/2006 | EP1595287B1 Electronic component comprising a semiconductor chip and method for producing said component |
| 05/10/2006 | CN2779619Y Tabulate electric power electron semiconductor device module |