Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
06/2006
06/07/2006EP1663056A2 Electric toothbrush comprising an electrically powered element
06/07/2006EP1663055A2 Electric toothbrushes and replaceable components
06/07/2006EP1481196A4 Piezoelectric ignition mechanism
06/07/2006CN2785538Y Illuminating source of slit-lamp
06/07/2006CN1784786A Light-emitting diode system
06/07/2006CN1784785A Module with built-in circuit element
06/07/2006CN1783521A White-light luminous diode
06/07/2006CN1783488A Organic electro-luminescence display device and method for fabricating the same
06/07/2006CN1783487A Ciecuit device and its producing method
06/07/2006CN1783486A Multi-chip module integrated with RF property
06/07/2006CN1783485A Lighting source unit, illuminating apparatus using the same and display apparatus using the same
06/07/2006CN1783484A Thin and small outer shape package combined by metal oxide semiconductor field effect transistor and schottky diode
06/07/2006CN1783483A Organic electroluminescence display and method for manufacturing the same
06/07/2006CN1783482A Packaging structure of poly crystal sheet
06/07/2006CN1783465A Mounting structure for integrated circuit element
06/07/2006CN1783379A Capacitive/resistive devices and printed wiring boards incorporating such devices, and methods of making thereof
06/07/2006CN1783378A Capacitive/resistive devices and printed wiring boards incorporating such devices, and methods of making thereof
06/07/2006CN1783377A Capacitive/resistive devices, dielectric laminates and printed wiring boards and methods of making thereof
06/07/2006CN1258954C Manufacturing method for circuit device
06/06/2006US7057911 Memory structure, a system, and an electronic device, as well as a method in connection with a memory circuit
06/06/2006US7057821 Integrated artificial and natural lighting system
06/06/2006US7057298 Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material
06/06/2006US7057291 Methods for securing vertically mountable semiconductor devices in back-to back relation
06/06/2006US7057290 Electronic parts packaging structure and method of manufacturing the same
06/06/2006US7057279 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method
06/06/2006US7057278 Semiconductor device
06/06/2006US7057277 Chip package structure
06/06/2006US7057275 Device with power semiconductor components for controlling the power of high currents and use of said device
06/06/2006US7057272 Power supply connection structure to a semiconductor device
06/06/2006US7057270 Systems and methods for stacking chip components
06/06/2006US7057269 Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
06/06/2006US7057181 Radiation detecting cassette
06/06/2006US7056813 Methods of forming backside connections on a wafer stack
06/06/2006US7056810 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
06/06/2006US7056807 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
06/06/2006US7056801 Radio frequency integrated circuit, and method for manufacturing the same
06/06/2006US7056769 Method of manufacturing an electronic device
06/06/2006US7055987 LED-luminous panel and carrier plate
06/01/2006WO2006056648A2 Electronics module and method for manufacturing the same
06/01/2006WO2006056555A2 Power converter arrangement
06/01/2006WO2006056505A1 Semiconductor device and rectifier arrangement
06/01/2006WO2006039606A3 Three dimensional package of cpu and voltage regulator/converter module
06/01/2006WO2005114731A3 Double density method for wirebond interconnect
06/01/2006WO2005106926A3 Light emitting diode component
06/01/2006US20060115932 Method for fabricating semiconductor components with conductive vias
06/01/2006US20060115930 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
06/01/2006US20060115929 Die-to-die connection method and assemblies and packages including dice so connected
06/01/2006US20060114016 Semiconductor device
06/01/2006US20060113682 Semiconductor component having plate and stacked dice
06/01/2006US20060113678 CSP chip stack with flex circuit
06/01/2006US20060113650 Bond pad rerouting element and stacked semiconductor device assemblies including the rerouting element
06/01/2006US20060113645 Microelectronic assemblies incorporating inductors
06/01/2006US20060113638 Light emitting diodes and the manufacture thereof
06/01/2006US20060113562 Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
06/01/2006DE19755155B4 Elektronisches Modul Electronic module
06/01/2006DE102005054393A1 Isolierendes Substrat und Halbleiterbauelement Insulating substrate and the semiconductor component
06/01/2006DE102004056111A1 Halbleiterschaltmodul Semiconductor switching module
06/01/2006DE10100460B4 Leistungshalbleitermodul mit Gehäuse und Anschlußelementen Power semiconductor module with housing and connection elements
05/2006
05/31/2006EP1662568A2 Power module, phase leg, and three-phase inverter
05/31/2006EP1662567A2 Simplified multichip packaging and package design
05/31/2006EP1662564A1 Semiconductor package and manufacturing method thereof
05/31/2006EP1043591B1 Power semiconductor module
05/31/2006CN2785140Y Stack structure of semiconductor chip
05/31/2006CN2785139Y Stack type multi-chip packaging structure
05/31/2006CN2785108Y Board-shaped passive component
05/31/2006CN1781155A Memory circuit arrangement and method for the production thereof
05/31/2006CN1779974A Organic luminescent display device and its manufacture
05/31/2006CN1779973A Light emitting device
05/31/2006CN1779972A Semiconductor device with inverted chip packer coating and its production thereof
05/31/2006CN1779971A Semiconductor device and method for producing the same
05/31/2006CN1779970A Optical rotation system for optoelectronic module
05/30/2006US7055045 Automatic mode detection circuits for configuring a terminal as an output terminal in a first mode as an input terminal in a second mode
05/30/2006US7054599 High density interconnect structure for use on software defined radio
05/30/2006US7053652 Static memory cell circuit with single bit line and set/reset write function
05/30/2006US7053485 Microelectronic packages with self-aligning features
05/30/2006US7053478 Pitch change and chip scale stacking system
05/30/2006US7053477 Semiconductor multi-package module having inverted bump chip carrier second package
05/30/2006US7053476 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages
05/30/2006US7053475 Semiconductor device and manufacturing method therefor
05/30/2006US7053473 Compact integrated circuit package
05/30/2006US7053414 Optical semiconductor component to prevent electric leakage and provide different driving voltages
05/30/2006US7053379 Radiation image photographic apparatus
05/30/2006US7052924 Light active sheet and methods for making the same
05/30/2006US7051433 Multilayer circuit board
05/26/2006WO2006054339A1 Semiconductor device
05/26/2006WO2006053846A1 Semiconductor switching module
05/26/2006WO2006053832A1 Device and method for fabricating double-sided soi wafer scale package with through via connections
05/26/2006WO2006053483A1 An infrared receiver
05/25/2006US20060110858 Ultra-thin semiconductor package device and method for manufacturing the same
05/25/2006US20060110838 Multilayered circuit substrate, semiconductor device and method of producing same
05/25/2006US20060110618 Electrodes for photovoltaic cells and methods for manufacture thereof
05/25/2006US20060110099 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof
05/25/2006US20060108607 Integrated circuit component and mounting method thereof
05/25/2006US20060108430 Electronic device and method of manufacturing the same
05/25/2006US20060108138 Semiconductor chip package having an adhesive tape attached on bonding wires
05/25/2006US20060107994 Photoelectric conversion element and process for fabricating the same, electronic device and process for fabricating the same
05/25/2006US20060107993 Building element including solar energy converter
05/25/2006US20060107992 Solar power plant
05/24/2006EP1658634A2 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler
05/24/2006EP1061588B1 Photo-conductive relay and method of making same