| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/02/2006 | CN1811098A Solar electricity-generating and light-emitting tile |
| 08/02/2006 | CN1267999C Camera |
| 08/02/2006 | CN1267993C Semiconductor device and manufacture thereof |
| 08/02/2006 | CN1267676C Vehicular headlamp employing semiconductor light source |
| 08/02/2006 | CN1267282C Ink cartridge and ink-jet recording equipment mounted with the same cartridge |
| 08/01/2006 | US7084935 Display device with molded light guide |
| 08/01/2006 | US7084515 Electronic device package |
| 08/01/2006 | US7084514 Multi-chip module and methods |
| 08/01/2006 | US7084513 Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same |
| 08/01/2006 | US7084501 Interconnecting component |
| 08/01/2006 | US7084495 Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
| 08/01/2006 | US7084436 Multi element, multi color solid state LED/laser |
| 08/01/2006 | US7084009 Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate |
| 08/01/2006 | US7084008 Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product |
| 08/01/2006 | US7084007 Fabrication and assembly structures and methods for memory devices |
| 08/01/2006 | US7084005 Semiconductor device and method of manufacturing the same |
| 08/01/2006 | US7083288 Illumination apparatus and image projection apparatus using the illumination apparatus |
| 08/01/2006 | US7082682 Contact structures and methods for making same |
| 08/01/2006 | US7082681 Methods for modifying a vertical surface mount package |
| 07/27/2006 | WO2006077739A1 Method and apparatus for manufacturing integrated circuit device using self organizing function |
| 07/27/2006 | WO2006056555A3 Power converter arrangement |
| 07/27/2006 | WO2006052344A3 Voltage regulator and method using substrate board with insulator layer and conductive traces |
| 07/27/2006 | WO2006039156A3 Method and apparatus for illuminating a solar cell with indirect sunrays |
| 07/27/2006 | WO2006013177A3 Planar connection technique for guiding a current in the event of a failure |
| 07/27/2006 | WO2005094240A3 Reconfigurable processor module with stacked die elements |
| 07/27/2006 | WO2003105460A3 Highly sensitive imaging camera for space applications including detection of ultrahigh energy cosmic rays |
| 07/27/2006 | US20060166405 Manufacturing method of semiconductor device |
| 07/27/2006 | US20060166404 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices |
| 07/27/2006 | US20060166395 High-density inter-die interconnect structure |
| 07/27/2006 | US20060165294 Optical sensor |
| 07/27/2006 | US20060164002 Laminated polymer with integrated lighting, sensors and electronics |
| 07/27/2006 | US20060163710 Semiconductor device and manufacturing method thereof |
| 07/27/2006 | US20060163703 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same |
| 07/27/2006 | US20060163648 Semiconductor component |
| 07/27/2006 | US20060163602 Optical semiconductor device |
| 07/27/2006 | US20060163601 Lighting module and method the production thereof |
| 07/27/2006 | US20060162104 High speed optical sub-assembly with ceramic carrier |
| 07/27/2006 | DE10345768B4 Anschlussmittel und Verfahren zum Kontaktieren des Anschlussmittels Connection means and methods for contacting the connection means |
| 07/27/2006 | DE10335153B4 Schaltungsanordnung auf einem Substrat, die einen Bestandteil eines Sensors aufweist, und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate having a part of a sensor and method for manufacturing the circuit arrangement on the substrate |
| 07/27/2006 | DE102006002452A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 07/27/2006 | DE102005041266A1 Multi-chip arrangement, has heat conducting device provided such that heat, generated within interior of multi-chip arrangement, is dissipated in direction of opposite side of stack arrangement of contact units |
| 07/27/2006 | DE102005003125A1 High-frequency electrical circuit for multi-chip module, has electrical components mechanically connected with each other by sealing compound and provided with conductive strip layers, which electrically connects components with each other |
| 07/26/2006 | EP1684348A2 Improved stack chip package |
| 07/26/2006 | EP1683198A2 Semiconductor device and manufacturing method thereof |
| 07/26/2006 | EP1683197A2 Power module |
| 07/26/2006 | CN1809925A Optimized multi-application assembly |
| 07/26/2006 | CN1808905A Methods of reducing power in programmable logic devices using low voltage swing for routing signals |
| 07/26/2006 | CN1808714A Light-emitting diode display with compartment |
| 07/26/2006 | CN1808711A Package body and package body module |
| 07/26/2006 | CN1266777C Luminous unit, luminous unit assembly and illuminator produced by said unit |
| 07/26/2006 | CN1266764C Semiconductor device and its producing method |
| 07/25/2006 | US7081678 Multi-chip package combining wire-bonding and flip-chip configuration |
| 07/25/2006 | US7081671 Power module |
| 07/25/2006 | US7081665 Semiconductor component having thinned substrate, backside pin contacts and circuit side contacts |
| 07/25/2006 | US7081374 Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it |
| 07/25/2006 | US7081373 CSP chip stack with flex circuit |
| 07/20/2006 | WO2006075197A1 Flip-chip semiconductor packages and methods for their production |
| 07/20/2006 | US20060160409 Card type led illumination source |
| 07/20/2006 | US20060160271 Stacked semiconductor module |
| 07/20/2006 | US20060160257 White-light emitting devices and methods for manufacturing the same |
| 07/20/2006 | US20060158804 Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof |
| 07/20/2006 | US20060158581 Image display device and light emission device |
| 07/20/2006 | US20060158295 Semiconductor multi-package module having inverted bump chip carrier second package |
| 07/20/2006 | US20060157830 Semiconductor package using flexible film and method of manufacturing the same |
| 07/20/2006 | DE102005047170A1 Electronic device e.g. optical device used for optical connector, has no wiring pattern at outer periphery edge or its vicinity of mold resin and between surface of substrate and base |
| 07/20/2006 | DE102005001590A1 Board on chip package for high frequency integrated circuit, has silicon chip with core including copper wires having build-up layers, which are structured, such that copper wires on substrate is directly accessible in canal for wire bonds |
| 07/19/2006 | EP1681728A1 Light-emitting device |
| 07/19/2006 | EP1681720A2 Multichip module containing an integrated passive device |
| 07/19/2006 | EP1680814A2 Method and device for connecting chips |
| 07/19/2006 | EP1680811A2 Method for making a flat-top pad |
| 07/19/2006 | CN2798310Y Inserting type memory module |
| 07/19/2006 | CN1806347A Led lamp |
| 07/19/2006 | CN1806345A 光半导体装置 An optical semiconductor device |
| 07/19/2006 | CN1805158A Light emitting diode with quasi-omnibearing reflector |
| 07/19/2006 | CN1265456C Electronic devices |
| 07/19/2006 | CN1265455C Semiconductor device and its making method |
| 07/18/2006 | US7080185 Bus control device altering drive capability according to condition |
| 07/18/2006 | US7079998 Method for analyzing power noise and method for reducing the same |
| 07/18/2006 | US7079453 Timepiece and electronic apparatus with bulb-shaped semiconductor element |
| 07/18/2006 | US7078818 Semiconductor device |
| 07/18/2006 | US7078811 Semiconductor device and method for fabricating the device |
| 07/18/2006 | US7078808 Double density method for wirebond interconnect |
| 07/18/2006 | US7078797 Hybrid integrated circuit device |
| 07/18/2006 | US7078792 Universal interconnect die |
| 07/18/2006 | US7078790 Semiconductor stacked die devices and methods of forming semiconductor stacked die devices |
| 07/18/2006 | US7078738 Light-emitting device |
| 07/18/2006 | US7078729 Semiconductor device and method of manufacturing the same |
| 07/18/2006 | US7078612 Photon battery |
| 07/18/2006 | US7078266 Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts |
| 07/18/2006 | US7078264 Stacked semiconductor die |
| 07/18/2006 | US7078254 LED package die having a small footprint |
| 07/18/2006 | US7077552 Vehicle head lamp |
| 07/18/2006 | US7076965 Cooling circuit for receiver of solar radiation |
| 07/18/2006 | CA2221315C Semiconductor device |
| 07/13/2006 | WO2006073825A2 Led light sources for image projection sytems |
| 07/13/2006 | WO2006072512A1 Method for producing an electronic circuit |
| 07/13/2006 | WO2005098941A3 Integrated circuit stacking system and method |
| 07/13/2006 | US20060154473 Semiconductor device and method of manufacturing the same |
| 07/13/2006 | US20060154446 Method for fabricating semiconductor component with thnned substrate having pin contacts |
| 07/13/2006 | US20060154444 Method of forming wiring |