| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 06/29/2006 | WO2006067018A1 Circuit arrangement arranged on a substrate and method for producing said circuit arrangement |
| 06/29/2006 | WO2006067013A1 Semi-conductor module having a low thermal load |
| 06/29/2006 | WO2006046221A3 An illuminator and manufacturing method |
| 06/29/2006 | US20060141749 Adhesive of folder package |
| 06/29/2006 | US20060141668 Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package |
| 06/29/2006 | US20060141644 Light emitting diode and fabricating method thereof |
| 06/29/2006 | US20060138649 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 06/29/2006 | US20060138638 Substrate for semiconductor devices and semiconductor device |
| 06/29/2006 | US20060138628 Stack chip package |
| 06/29/2006 | US20060138618 Method for wafer stacking using copper structures of substantially uniform height |
| 06/29/2006 | US20060138441 Light source module and method for production thereof |
| 06/29/2006 | US20060138435 Multiple component solid state white light |
| 06/29/2006 | US20060137736 Support system and program for installing photovoltaic power generator |
| 06/29/2006 | US20060137734 High efficiency solar cells |
| 06/29/2006 | US20060137733 Photovoltaic module with adjustable heat sink and method of fabrication |
| 06/29/2006 | DE69635227T2 Kontakträger zum bestücken von substraten mit federkontakten Contact carrier of fitting substrates with spring contacts |
| 06/29/2006 | DE102005059224A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 06/29/2006 | DE102005056892A1 Elektronikmodul für eine Systemplatine mit Durchgangslöchern Electronics module for a system board with through holes |
| 06/29/2006 | DE102005056872A1 Mehrchipmodul mit Leistungssystem und Durchgangslöchern Multi-chip module with a power system and through holes |
| 06/29/2006 | DE102004061250A1 Switching device, e.g. for motor vehicle technology, has condenser whose contact and connection of digital circuit are connected with one another, so that measuring current does not flow over measuring layer between circuit and condenser |
| 06/29/2006 | DE102004061099A1 Power semiconductor module for use as contact for sensors comprises of substrate arranged with base plate and frame housing enclosing substrate, whereby second section of auxiliary connections are connected with high impedance connection |
| 06/29/2006 | DE102004049356B4 Halbleitermodul mit einem internen Halbleiterchipstapel und Verfahren zur Herstellung desselben Of the same semiconductor module with an internal semiconductor chip stack and processes for preparing |
| 06/29/2006 | DE102004041417B4 Electrical arrangement for microelectronics has component insulated from substrate by dielectric layer on conductive substrate |
| 06/29/2006 | DE102004028989B4 Elektronische Schaltungsvorrichtung mit gestapelten elektronischen Schaltungseinheiten An electronic circuit device with stacked electronic circuit units |
| 06/28/2006 | EP1675179A1 Stacked-type semiconductor device |
| 06/28/2006 | EP1675177A2 Semiconductor apparatus and circuit apparatus |
| 06/28/2006 | EP1673816A1 Semiconductor device for emitting light and method for fabricating the same |
| 06/28/2006 | CN1795558A Electronic parts, module, module assembling method, identification method, and environment setting method |
| 06/28/2006 | CN1795557A 半导体装置 Semiconductor device |
| 06/28/2006 | CN1795555A Selective reference plane bridge(s) on folded package |
| 06/27/2006 | US7068519 Printed circuit board and method manufacturing the same |
| 06/27/2006 | US7068246 Light emitting module and method of driving the same, and optical sensor |
| 06/27/2006 | US7068124 Integrated passive devices fabricated utilizing multi-layer, organic laminates |
| 06/27/2006 | US7068072 Integrated circuit with interface tile for coupling to a stacked-die second integrated circuit |
| 06/27/2006 | US7067926 Semiconductor chip and method for manufacturing the same |
| 06/27/2006 | US7067910 Method and apparatus for using capacitively coupled communication within stacks of laminated chips |
| 06/27/2006 | US7067909 Multi-layer integrated semiconductor structure having an electrical shielding portion |
| 06/27/2006 | US7067893 Optoelectronic element with a non-protruding lens |
| 06/27/2006 | US7067857 Semiconductor device having led out conductor layers, manufacturing method of the same, and semiconductor module |
| 06/27/2006 | US7067848 High intensity LED |
| 06/27/2006 | US7067810 Thermal type infrared imaging device and fabrication method thereof |
| 06/27/2006 | US7067787 Solid state detector and method of manufacturing same |
| 06/27/2006 | US7067741 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 06/27/2006 | US7067345 Method of joining components |
| 06/27/2006 | US7066741 Flexible circuit connector for stacked chip module |
| 06/27/2006 | US7066626 LED lamp |
| 06/27/2006 | US7066623 Method and apparatus for producing untainted white light using off-white light emitting diodes |
| 06/22/2006 | WO2006064666A1 Power module, method for producing same and air conditioner |
| 06/22/2006 | WO2006012866A3 Image module |
| 06/22/2006 | WO2005052999A3 Decoupling circuit for co-packaged semiconductor devices |
| 06/22/2006 | US20060136089 Numerical control device for machine tool and numerical control method for machine tool |
| 06/22/2006 | US20060133073 Selfluminous device |
| 06/22/2006 | US20060133003 Two stage energy storage device |
| 06/22/2006 | US20060132401 Light emitting module and method of driving the same, and optical sensor |
| 06/22/2006 | US20060131757 Light emitting module |
| 06/22/2006 | US20060131741 Semiconductor device and manufacturing method of the same |
| 06/22/2006 | US20060131719 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 06/22/2006 | US20060131718 Multi-chip package structure |
| 06/22/2006 | US20060131717 Multi-chip package structure |
| 06/22/2006 | US20060131716 Stacking system and method |
| 06/22/2006 | US20060131594 Led illumination light source |
| 06/22/2006 | US20060131506 Thermal type infrared ray imaging device and fabrication method thereof |
| 06/22/2006 | US20060131433 Method of manufacturing a contactless card |
| 06/22/2006 | US20060130889 Solar panel with optical films |
| 06/22/2006 | DE202006005664U1 Semiconductor laser diode-module`s individual component e.g. laser diode, contacting arrangement, has optical components arranged on base body, and printed circuit board including conducting lines with contact connection to components |
| 06/22/2006 | DE102005020695B4 Radiation emitting device with variable spectral properties, superimposes beams from luminescent dyes with different absorption spectra excited by LEDs with different emission spectra |
| 06/22/2006 | DE10122837B4 Leistungshalbleiter-Modul The power semiconductor module |
| 06/21/2006 | EP1672692A1 Power semiconductor module |
| 06/21/2006 | EP1260121B1 A printed circuit board assembly with improved bypass decoupling for bga packages |
| 06/21/2006 | CN2789936Y Thermoelectric module packaging |
| 06/21/2006 | CN2789933Y Large current three-phase rectifier power electronic device module |
| 06/21/2006 | CN1791979A Semiconductor chip mounting body and manufacturing method thereof |
| 06/21/2006 | CN1790708A Light-emitting diode flash module with enhanced spectral emission |
| 06/21/2006 | CN1790707A Multi-mode quickflashing memory IC |
| 06/21/2006 | CN1790706A Multi-level semiconductor module |
| 06/21/2006 | CN1790705A Apparatus and methods for cooling semiconductor integrated circuit chip packages |
| 06/21/2006 | CN1790691A Semiconductor device |
| 06/21/2006 | CN1260795C Semiconductor device and manufacture thereof, circuit board and electronic machine |
| 06/21/2006 | CN1260789C Circuit board, semiconductor device mfg. method, and electroplating system |
| 06/21/2006 | CN1260775C Method for manufacturing optical devices and related improvements |
| 06/20/2006 | US7064645 Electronic device |
| 06/20/2006 | US7064630 High-frequency module and its manufacturing method |
| 06/20/2006 | US7064566 Probe card assembly and kit |
| 06/20/2006 | US7064444 Multi-chip ball grid array package |
| 06/20/2006 | US7064443 Semiconductor device having a plurality of stacked semiconductor chips with positions of chip-selecting terminals being different from each other |
| 06/20/2006 | US7064440 Semiconductor device |
| 06/20/2006 | US7064426 Semiconductor multi-package module having wire bond interconnect between stacked packages |
| 06/20/2006 | US7064425 Semiconductor device circuit board, and electronic equipment |
| 06/20/2006 | US7064424 Optical surface mount technology package |
| 06/20/2006 | US7064354 Color mixing light emitting diode |
| 06/20/2006 | US7064328 Ultra sensitive silicon sensor millimeter wave passive imager |
| 06/20/2006 | US7064055 Method of forming a multi-layer semiconductor structure having a seamless bonding interface |
| 06/20/2006 | US7064018 Methods for fabricating three dimensional integrated circuits |
| 06/20/2006 | US7064007 Method of using foamed insulators in three dimensional multichip structures |
| 06/20/2006 | US7064006 Multiple die stack apparatus employing T-shaped interposer elements |
| 06/20/2006 | US7064005 Semiconductor apparatus and method of manufacturing same |
| 06/20/2006 | US7064003 Memory package |
| 06/20/2006 | CA2530614A1 Light emitting device |
| 06/15/2006 | WO2006062091A1 Component mounting apparatus and component mounting method |
| 06/15/2006 | WO2006061673A1 Semiconductor package having at least two semiconductor chips and method of assembling the semiconductor package |