Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
07/2006
07/13/2006US20060152931 Uniform illumination system
07/13/2006US20060152833 Electrical connection of optoelectronic devices
07/13/2006US20060152275 Signal transmitting circuit
07/13/2006US20060151877 Semiconductor device and manufacturing method thereof
07/13/2006US20060151874 Active rectifier module for three-phase generators of vehicles
07/13/2006US20060151867 Semiconductor multipackage module including processor and memory package assemblies
07/13/2006US20060151793 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
07/13/2006US20060150751 Power semiconductor module
07/13/2006US20060150435 Methods and systems for processing a substrate using a dynamic liquid meniscus
07/13/2006DE10340129B4 Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben The same electronic module with plug contacts and methods for preparing
07/13/2006DE102005057524A1 Cooling device for e.g. optoelectronic semiconductor chip, has two structured layers each with groove, where grooves are placed over one another to form outlet duct, and cooling device is integrated in housing of component to be cooled
07/13/2006DE102004063851A1 Verfahren zur Herstellung einer elektronischen Schaltung A process for producing an electronic circuit
07/13/2006DE102004063039A1 Anordnung eines elektrischen Bauelements und einer Zwei-Phasen-Kühlvorrichtung Arrangement of an electrical component and a two-phase cooling device
07/13/2006DE102004061907A1 Halbleitermodul mit geringer thermischer Belastung Semiconductor module with low thermal load
07/12/2006EP1678763A2 Single mask via method and device
07/12/2006EP1169736B1 Power semiconductor module
07/12/2006CN2796105Y Light emitting diode light source structure of high illumination and long distance
07/12/2006CN1802235A Method of soldering or brazing articles having surfaces that are difficult to bond
07/12/2006CN1801481A Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module
07/12/2006CN1264216C Circuit layout
07/12/2006CN1264215C Thin high-frequency module of less damaged IC chip
07/12/2006CN1264207C Semiconductor device and its mfg. method
07/11/2006US7076537 Designing interconnect fabrics
07/11/2006US7075576 CCD camera having an anti-stokes phosphor bound thereto
07/11/2006US7075501 Head mounted display system
07/11/2006US7075365 Configurable clock network for programmable logic device
07/11/2006US7075334 Repeatable block producing a non-uniform routing architecture in a field programmable gate array having segmented tracks
07/11/2006US7075333 Programmable circuit optionally configurable as a lookup table or a wide multiplexer
07/11/2006US7075332 Six-input look-up table and associated memory control circuitry for use in a field programmable gate array
07/11/2006US7075329 Signal isolators using micro-transformers
07/11/2006US7075188 Circuit device and method for manufacturing the same
07/11/2006US7075177 Semiconductor chip package
07/11/2006US7075091 Apparatus for detecting ionizing radiation
07/11/2006US7075079 Sensor for dual wavelength bands
07/11/2006US7075061 Method of calibrating a digital X-ray detector and corresponding X-ray device
07/11/2006US7074703 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
07/11/2006US7074647 Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other
07/11/2006US7074481 Adhesive for joining surface of semiconductor
07/11/2006CA2458548C Solar array concentrator system and method
07/11/2006CA2241555C True color flat panel display using an led dot matrix and led dot matrix drive method and apparatus
07/06/2006WO2006071611A1 Microelectronic package having stacked semiconductor devices and a process for its fabrication
07/06/2006WO2006071577A1 Packaging for electronic modules
07/06/2006WO2006070652A1 Semiconductor device and method for manufacturing same, wiring board and method for manufacturing same, semiconductor package, and electronic device
07/06/2006WO2006070581A1 Semiconductor device
07/06/2006WO2006069935A1 Electrical module comprising spacers between a plurality of circuit carriers
07/06/2006WO2006069878A1 Electrical subassembly comprising nested circuit supports
07/06/2006WO2006013503A3 Light emitting diode assembly
07/06/2006US20060148130 Memory chip and semiconductor device using the memory chip and manufacturing method of those
07/06/2006US20060145359 Electronic parts packaging structure and method of manufacturing the same
07/06/2006US20060145335 Method for manufacturing semiconductor device having a pair of heat sinks
07/06/2006DE19955100B4 Auf einer Leiterplatte integrierte Halbleitereinrichtung On a circuit board integrated semiconductor device
07/06/2006DE19534382B4 Monolithisch integrierte Schaltung mit einem Mikrowellen-Leistungsverstärker mit einer Anpassungsschaltung unter Verwendung verteilter Leitungen Monolithic integrated circuit with a microwave power amplifier with a matching circuit using distributed lines
07/06/2006DE10355925B4 Leistungshalbleitermodul und Verfahren seiner Herstellung The power semiconductor module and its production method
07/06/2006DE10349692B4 Halbleitervorrichtung mit Durchgangselektrode und Verfahren zur Herstellung derselben A semiconductor device having through-electrode and process for producing same
07/06/2006DE102005045076A1 Licht-Emittierende-Diode-Blitzmodul mit verbesserter Spektralemission Light-emitting diode flash module with enhanced spectral emission
07/06/2006DE102004062635A1 Elektrische Baugruppe mit Abstandshaltern zwischen mehreren Schaltungsträgern The electrical assembly with spacers between multiple circuit boards
07/06/2006DE102004061936A1 Anordnung eines Halbleitermoduls und einer elektrischen Verschienung Arrangement of a semiconductor module and an electrical busbar
07/06/2006DE102004061908A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung A circuit arrangement on a substrate and method of manufacturing the circuit arrangement
07/06/2006DE10007414B4 Verfahren zur Durchkontaktierung eines Substrats für Leistungshalbleitermodule durch Lot und mit dem Verfahren hergestelltes Substrat Method for through-hole plating of a substrate for power semiconductor modules by solder and substrate produced by the method
07/05/2006EP1677362A1 Light receiving or light emitting modular sheet and process for producing the same
07/05/2006EP1676316A1 Dc-dc converter implemented in a land grid array package
07/05/2006EP1676315A1 Electroosmotic pumps using porous frits for cooling integrated circuit stacks
07/05/2006EP1676076A2 Color-mixing lighting system
07/05/2006EP1057219B1 Contrast enhancement for an electronic display device
07/05/2006CN1799149A Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component
07/05/2006CN1799140A Switching device, generator-motor apparatus using switching device, drive system including generator-motor apparatus, and computer-readable recording medium on which a program for directing computer
07/05/2006CN1797951A Apparatus and method for adjusting performance characteristics of programmable logic devices
07/05/2006CN1797802A A light emitting source and a light emitting source array
07/05/2006CN1797766A 发光装置 Light-emitting device
07/05/2006CN1797765A Power module,Phase leg,And three-phase inverter
07/05/2006CN1797764A Encapsulation structure for multiple chips
07/05/2006CN1795944A Light struck device inuse for treatment of light power
07/05/2006CN1263156C Insulated-gate bipolar transistor
07/05/2006CN1263135C Integrated circuit and mfg. method thereof
07/05/2006CN1263127C Mounting structure of solar battery assembly array, its method and electric energy generating system
07/05/2006CN1263124C Large power semiconductor assembly capable of relieving mechanical stress
07/05/2006CN1263098C Method for producing self assembling microstructure
07/04/2006US7072241 Semiconductor memory device and multi-chip module comprising the semiconductor memory device
07/04/2006US7072201 Memory module
07/04/2006US7072096 Uniform illumination system
07/04/2006US7071719 Semiconductor device
07/04/2006US7071574 Semiconductor device and its wiring method
07/04/2006US7071568 Stacked-die extension support structure and method thereof
07/04/2006US7071567 Semiconductor device and method of fabrication thereof, optical module and method of fabrication thereof, circuit board, and electronic instrument
07/04/2006US7071555 Ball grid array package stack
07/04/2006US7071550 Semiconductor module having heat sink serving as wiring line
07/04/2006US7071547 Assemblies having stacked semiconductor chips and methods of making same
07/04/2006US7071546 Space-saving packaging of electronic circuits
07/04/2006US7071543 Semiconductor device and manufacturing method thereof
07/04/2006US7071493 High density LED array
07/04/2006US7071472 Irradiation control device
07/04/2006US7071454 Solid state detector and method of manufacturing same
07/04/2006US7071421 Stacked microfeature devices and associated methods
07/04/2006US7071405 Independent power bank system
07/04/2006US7071028 Semiconductor device and its manufacturing method
07/04/2006US7071012 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
07/04/2006US7069653 Method for electrically connecting a semiconductor component to an electrical subassembly
06/2006
06/29/2006WO2006068763A2 Solar panel with optical films
06/29/2006WO2006068297A1 Semiconductor light emitting device, illumination module, illumination apparatus, method for manufacturing semiconductor light emitting device, and method for manufacturing semiconductor light emitting element
06/29/2006WO2006067021A1 Arrangement of a semiconductor module and an electrical busbar