| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/16/2006 | CN1270272C IC card |
| 08/15/2006 | US7093210 Method of manufacturing circuit device using a communication network |
| 08/15/2006 | US7091820 Methods for manufacturing resistors using a sacrificial layer |
| 08/15/2006 | US7091745 Indicating completion of configuration for programmable devices |
| 08/15/2006 | US7091716 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
| 08/15/2006 | US7091637 AC generator for vehicle having rectifying unit |
| 08/15/2006 | US7091623 Multi-chip semiconductor package and fabrication method thereof |
| 08/15/2006 | US7091619 Semiconductor device, semiconductor package, electronic device, electronic apparatus, and manufacturing methods of semiconductor device and electronic device |
| 08/15/2006 | US7091606 Circuit device and manufacturing method of circuit device and semiconductor module |
| 08/15/2006 | US7091604 Three dimensional integrated circuits |
| 08/15/2006 | US7091597 Power supply device |
| 08/15/2006 | US7091595 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same |
| 08/15/2006 | US7091593 Circuit board with built-in electronic component and method for manufacturing the same |
| 08/15/2006 | US7091592 Stacked package for electronic elements and packaging method thereof |
| 08/15/2006 | US7091591 Semiconductor device |
| 08/15/2006 | US7091590 Multiple stacked-chip packaging structure |
| 08/15/2006 | US7091588 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation |
| 08/15/2006 | US7091587 Semiconductor device |
| 08/15/2006 | US7091580 Semiconductor device |
| 08/15/2006 | US7091525 Apparatus for producing a display unit |
| 08/15/2006 | US7091124 Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices |
| 08/15/2006 | US7091061 Method of forming a stack of packaged memory dice |
| 08/15/2006 | US7091055 White light emitting diode and method for manufacturing the same |
| 08/15/2006 | US7089984 Forming folded-stack packaged device using progressive folding tool |
| 08/15/2006 | CA2200266C A display sign and an optical element for use in the same |
| 08/14/2006 | CA2531632A1 Led assembly with led position template and method of making an led assembly using led position template |
| 08/10/2006 | WO2006083700A2 Asics having programmable bypass of design faults |
| 08/10/2006 | WO2006083190A1 Microelectronic bundle module or device |
| 08/10/2006 | WO2006082750A1 Packaging structure for electronic component and method for manufacturing electronic component package provided with such structure |
| 08/10/2006 | WO2006082620A1 Layered semiconductor device and layered semiconductor device manufacturing method |
| 08/10/2006 | WO2006039149A3 Compact solar apparatus for producing electricity |
| 08/10/2006 | US20060175956 Light emitting device |
| 08/10/2006 | US20060175716 Molded package and semiconductor device using molded package |
| 08/10/2006 | US20060175690 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods |
| 08/10/2006 | US20060175630 Electronic power module comprising a rubber seal and corresponding production method |
| 08/10/2006 | DE19730914B4 Mikroelektronik-Baugruppe Microelectronics assembly |
| 08/10/2006 | DE102006005955A1 Inline memory module architecture, has two arrays of memory devices located on respective sides of printed circuit board, where devices of one array are arranged to overlap relative to reference axis of circuit board |
| 08/10/2006 | DE102006004788A1 Halbleiterbauelement und Fertigungsverfahren für dieses Semiconductor device and manufacturing method thereof |
| 08/10/2006 | DE102006003567A1 Manufacturing structure of assembly of photoelectric semiconductor wafer involves covering large area of wafer by current conducting material and photoelectric semiconductor is then stacked on current conducting material |
| 08/09/2006 | EP1688997A1 Electronic component with stacked semiconductor chips and method for its manufacture |
| 08/09/2006 | EP1688993A2 Standardized bonding location process and apparatus |
| 08/09/2006 | EP1688847A1 Die-to-die interconnect interface and protocol for stacked semiconductor dies |
| 08/09/2006 | EP1449264B1 Photoluminescent material for light emitting diodes, and light emitting diode |
| 08/09/2006 | EP1195079B1 An arrangement for mounting chips in multilayer printed circuit boards |
| 08/09/2006 | CN2805094Y No-bed course, multiple-chip piling-up package structure |
| 08/09/2006 | CN1816911A Electronic power module comprising a rubber seal and corresponding production method |
| 08/09/2006 | CN1815734A Light-emitting-diode array packing structure and method thereof |
| 08/09/2006 | CN1815733A Semiconductor device and manufacturing method therefor |
| 08/09/2006 | CN1815732A Method and system of inter-chip communication and microprocessor |
| 08/09/2006 | CN1815731A Semiconductor memory module |
| 08/09/2006 | CN1815722A Low power multi-chip semiconductor memory device and chip enable method thereof |
| 08/09/2006 | CA2535757A1 Package or pre-applied foamable underfill for lead-free process |
| 08/08/2006 | US7089032 Radio transmitting/receiving device |
| 08/08/2006 | US7088983 Semiconductor device for radio communication device, and radio communication device using said semiconductor device |
| 08/08/2006 | US7088311 Current generating circuit, semiconductor integrated circuit, electro-optical device, and electronic apparatus |
| 08/08/2006 | US7088134 Programmable logic device with flexible memory allocation and routing |
| 08/08/2006 | US7088005 Wafer stacking with anisotropic conductive adhesive |
| 08/08/2006 | US7087990 Power semiconductor device |
| 08/08/2006 | US7087989 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device |
| 08/08/2006 | US7087988 Semiconductor packaging apparatus |
| 08/08/2006 | US7087514 Substrate having built-in semiconductor apparatus and manufacturing method thereof |
| 08/08/2006 | US7087502 Method for generating chip stacks |
| 08/08/2006 | US7087459 Method for packaging a multi-chip module of a semiconductor device |
| 08/08/2006 | US7087455 Semiconductor device and manufacturing method for the same |
| 08/08/2006 | US7087445 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture |
| 08/08/2006 | US7087442 Process for the formation of a spatial chip arrangement and spatial chip arrangement |
| 08/08/2006 | US7087271 Silicon oxycarbide; vapor deposition |
| 08/08/2006 | US7086786 Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology |
| 08/08/2006 | US7086600 Electronic device and method of manufacturing the same |
| 08/08/2006 | US7086149 Method of making a contact structure with a distinctly formed tip structure |
| 08/03/2006 | WO2006080351A1 Semiconductor device and its manufacturing method |
| 08/03/2006 | WO2006080337A1 Semiconductor device and method for manufacturing same, and stacked type semiconductor integrated circuit |
| 08/03/2006 | WO2006080082A1 Layered semiconductor device carrier and layered semiconductor device manufacturing method |
| 08/03/2006 | WO2005022030A3 Color-mixing lighting system |
| 08/03/2006 | US20060172463 Semiconductor multi-package module having wire bond interconnect between stacked packages |
| 08/03/2006 | US20060172462 Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
| 08/03/2006 | US20060172461 Semiconductor stacked multi-package module having inverted second package |
| 08/03/2006 | US20060172459 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 08/03/2006 | US20060171130 Semiconductor module |
| 08/03/2006 | US20060170091 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
| 08/03/2006 | US20060170084 Semiconductor device and a method of manufacturing the same |
| 08/03/2006 | US20060170051 Semiconductor circuit constructions |
| 08/03/2006 | US20060169992 Light receiving or light emitting modular sheet and process for producing the same |
| 08/03/2006 | DE102005003633A1 Light dispersing and concentrating device for e.g. motor vehicle headlight, has flexible matrix achieving concave or convex shape due to effect of forces so that lights emitted from sources as concentrated at common point or are dispersed |
| 08/03/2006 | DE10103084B4 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation |
| 08/02/2006 | EP1686623A1 Semiconductor device and process for fabricating the same |
| 08/02/2006 | EP1685600A1 Stackable electronic assembly |
| 08/02/2006 | EP1685596A2 Electric motor and method for producing said motor |
| 08/02/2006 | EP1206325A4 Vapor phase connection techniques |
| 08/02/2006 | CN2802728Y Improved structure of color mixture LED |
| 08/02/2006 | CN2802727Y Improved structure of color mixture point matrix LED |
| 08/02/2006 | CN1812093A Light-emitting diode, backlight device and method of manufacturing the light-emitting diode |
| 08/02/2006 | CN1812092A Flash module with quantum dot light conversion |
| 08/02/2006 | CN1812091A Semiconductor device |
| 08/02/2006 | CN1812090A Power semiconductor module with reduced parasitic inductances |
| 08/02/2006 | CN1812089A Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument |
| 08/02/2006 | CN1812088A Multi-level semiconductor module and method for fabricating the same |
| 08/02/2006 | CN1812087A Battery protection ic chip |
| 08/02/2006 | CN1812063A Circuit device manufacturing method |
| 08/02/2006 | CN1812059A Zener diode and methods for fabricating and packaging same |