| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 08/30/2006 | CN1825585A 半导体装置 Semiconductor device |
| 08/30/2006 | CN1825584A Electronic package and packaging method |
| 08/30/2006 | CN1824989A Electronic light source special for ice engraving technique |
| 08/30/2006 | CN1272688C Semiconductor memory device inverted chip interface circuit and inverted chip interface method |
| 08/29/2006 | US7100130 Device for the emulation of designs for integrated circuits |
| 08/29/2006 | US7099648 Radio frequency integrated circuit layout with noise immunity border |
| 08/29/2006 | US7099173 Stacked layered type semiconductor memory device |
| 08/29/2006 | US7098685 Scalable serializer-deserializer architecture and programmable interface |
| 08/29/2006 | US7098683 Motor driving system having power semiconductor module life detection function |
| 08/29/2006 | US7098543 Flip-chip packaged SMD-type LED with antistatic function and having no wire bonding |
| 08/29/2006 | US7098541 Interconnect method for directly connected stacked integrated circuits |
| 08/29/2006 | US7098538 System semiconductor device and method of manufacturing the same |
| 08/29/2006 | US7098486 Light source assembly having high-performance heat dissipation means |
| 08/29/2006 | US7098483 Light emitting diodes packaged for high temperature operation |
| 08/29/2006 | US7098078 Microelectronic component and assembly having leads with offset portions |
| 08/29/2006 | US7096914 Apparatus for bonding a chip using an insulating adhesive tape |
| 08/24/2006 | WO2006088161A1 Semiconductor device |
| 08/24/2006 | WO2006087957A1 Semiconductor device manufacturing method and semiconductor device |
| 08/24/2006 | WO2006087065A2 Power semiconductor assembly |
| 08/24/2006 | WO2006086927A1 Led lighting lamp tube |
| 08/24/2006 | WO2006008679A3 Electronic device comprising an integrated circuit |
| 08/24/2006 | WO2005112100A3 Stacked module systems and methods |
| 08/24/2006 | WO2005099110A3 Radio front-end module with passive circuit elements monolithically integrated in a semiconductor substrate and with an integrated circuit connected to said substrate |
| 08/24/2006 | US20060190903 ASICs having programmable bypass of design faults |
| 08/24/2006 | US20060189117 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
| 08/24/2006 | US20060189040 Method of manufacturing an electronic device |
| 08/24/2006 | US20060189031 Semiconductor device and manufacturing method thereof |
| 08/24/2006 | US20060186526 Semiconductor device and its wiring method |
| 08/24/2006 | US20060186423 Method of making optical light engines with elevated LEDs and resulting product |
| 08/24/2006 | US20060185712 Silane composition, silicon film forming method and solar cell production method |
| 08/24/2006 | DE102005025214A1 Motor vehicle e.g. heavy goods vehicle, external lighting, has electronic light sources and electrical conductors, which are encased by casting, which is made of casting compound, where the casting is free from cavities |
| 08/24/2006 | DE102005008322A1 Signal transmission arrangement, has three semiconductor chips that is connected with each other in common housing, where arrangement is arranged for signal transmission between logic chip and memory chip over transmitting/receiving port |
| 08/24/2006 | DE102005007373A1 Leistungshalbleiterbaugruppe Power semiconductor module |
| 08/24/2006 | DE102005006995A1 Semiconductor module component, has plastic housing comprising conducting path, through which lower contact surfaces are electrically connected with upper contact surfaces, where paths comprise contacting path layer |
| 08/24/2006 | DE102004009082B4 Leistungs-MOS-FET-Anordnung mit Temperatursensor Power MOS FET device with temperature sensor |
| 08/23/2006 | EP1693892A2 Stacked microelectronic layer and module with three-axis channel T-connects |
| 08/23/2006 | EP1692729A2 Semiconductor light emitting devices and submounts and methods for forming the same |
| 08/23/2006 | EP1692722A2 Light emitting diode based illumination assembly |
| 08/23/2006 | EP1692716A2 Method for the molecular bonding of microelectronic components to a polymer film |
| 08/23/2006 | EP1568158B1 Bidirectional emitting and receiving module |
| 08/23/2006 | EP1325521A4 Semiconductor light emitting element formed on a clear or translucent substrate |
| 08/23/2006 | EP1171914B1 Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
| 08/23/2006 | CN2809883Y Improved structure of front face-emitting LED |
| 08/23/2006 | CN2809879Y A light bulb |
| 08/23/2006 | CN2809871Y Disk spring clamping mechanism for thyristor installation |
| 08/23/2006 | CN1823561A Packaging of semiconductor devices for incrased reliability |
| 08/23/2006 | CN1823416A Stackable integrated circuit package and method therefor |
| 08/23/2006 | CN1822731A Packaging structure of two-side organic electroluminescence module and packaging method |
| 08/23/2006 | CN1822365A Light emitting device provided with lens for controlling light distribution characteristic |
| 08/23/2006 | CN1822364A 半导体器件 Semiconductor devices |
| 08/23/2006 | CN1271900C Sandwich-structured intelligent power module |
| 08/23/2006 | CN1271708C BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same |
| 08/22/2006 | US7095765 Light emitter with a voltage dependent resistor layer |
| 08/22/2006 | US7095253 Programmable multi-chip module |
| 08/22/2006 | US7095144 Rectifying apparatus of AC generator for vehicle |
| 08/22/2006 | US7095112 Semiconductor device, semiconductor package member, and semiconductor device manufacturing method |
| 08/22/2006 | US7095110 Light emitting diode apparatuses with heat pipes for thermal management |
| 08/22/2006 | US7095105 Vertically stacked semiconductor device |
| 08/22/2006 | US7095104 Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same |
| 08/22/2006 | US7095060 Unit for driving light-emitting device |
| 08/22/2006 | US7095053 Light emitting diodes packaged for high temperature operation |
| 08/22/2006 | US7094632 Low profile chip scale stacking system and method |
| 08/22/2006 | US7094631 Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices |
| 08/22/2006 | US7094630 Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface |
| 08/22/2006 | US7094619 Method of fabricating a light emitting device |
| 08/22/2006 | US7094108 Apparatus for forming modular sockets using flexible interconnects and resulting structures |
| 08/22/2006 | US7094046 Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging |
| 08/22/2006 | US7093958 LED light source assembly |
| 08/17/2006 | WO2006085825A1 A packaging method for mems devices, and mems packages produced using the method |
| 08/17/2006 | WO2006085363A1 Semiconductor apparatus and electronic circuit |
| 08/17/2006 | WO2005122706A3 Method of aligning semiconductor device and semiconductor structure thereof |
| 08/17/2006 | US20060180943 Semiconductor device |
| 08/17/2006 | US20060180942 Semiconductor device |
| 08/17/2006 | US20060180818 Semiconductor light emitting device, light emitting module and lighting apparatus |
| 08/17/2006 | DE102006004015A1 Isolierender Flächenkörper und Verfahren zu seiner Herstellung und den Isolierenden Flächenkörper aufweisendes Leistungsmodul Insulating sheet and method for its preparation and the insulating sheet exhibiting power module |
| 08/17/2006 | DE102005054353A1 Electronic component, especially multi chip as in ball grid array, has one chip above another with spacers between them and bond wire to inner conductive surface of lower chip |
| 08/17/2006 | DE102005005622A1 Safety-semiconductor chip stack, has connecting units provided in chips to provide mechanical connection between chips, where units and functional layers are made from copper, and units stand in direct contact with layers |
| 08/17/2006 | DE10024377B4 Gehäuseeinrichtung und darin zu verwendendes Kontaktelement Housing means and to be used in contact element |
| 08/16/2006 | EP1690300A2 Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device |
| 08/16/2006 | CN2807596Y Semiconductor three-phase bridge commutating module |
| 08/16/2006 | CN2807483Y Special-purpose double-illuminator LED lamp for miner's lamp |
| 08/16/2006 | CN2807481Y Mixing type photoelectric accumulating body package structure |
| 08/16/2006 | CN1819289A Light-emitting diode apparatus |
| 08/16/2006 | CN1819284A LED and production thereof |
| 08/16/2006 | CN1819193A Universal light-emitting diodes and light thereof |
| 08/16/2006 | CN1819192A 半导体器件以及半导体封装 Semiconductor device and semiconductor package |
| 08/16/2006 | CN1819191A Memory module and method of mounting memory device on PCB for memory module |
| 08/16/2006 | CN1819190A 半导体器件 Semiconductor devices |
| 08/16/2006 | CN1819189A Method for manufacturing circuit device |
| 08/16/2006 | CN1819188A Semiconductor device |
| 08/16/2006 | CN1819187A Semiconductor device and capsule type semiconductor package |
| 08/16/2006 | CN1819186A Semiconductor device |
| 08/16/2006 | CN1819185A Die module system and method |
| 08/16/2006 | CN1819175A Surface installing emitting led |
| 08/16/2006 | CN1819163A Insulating sheet and method for producing it, and power module comprising the insulating sheet |
| 08/16/2006 | CN1819129A Semiconductor packer and production for godown chip |
| 08/16/2006 | CN1819111A Semiconductor device fabrication method and semiconductor device fabrication device |
| 08/16/2006 | CN1819056A Integrated DRAM memory device |
| 08/16/2006 | CN1270403C Circuit board device and its manufacturing method |
| 08/16/2006 | CN1270378C Semiconductor arrangement and producing method thereof |