| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/13/2006 | CN2817073Y High-voltage large-current coaxial structured inductance-free thyratron oil-tank |
| 09/13/2006 | CN2816571Y LED lighting plate and lighting apparatus using same |
| 09/13/2006 | CN1833319A Electronic module composing of components with cascade and interconnect, and corresponding component, method, assembly devices and assembly machine thereof |
| 09/13/2006 | CN1833318A Multi-chip type semiconductor device |
| 09/13/2006 | CN1832212A Led mounting having increased heat dissipation |
| 09/13/2006 | CN1832210A LED, LED module set and backlight system |
| 09/13/2006 | CN1832170A Optical semiconductor device and method for manufacturing the same, electronic device, |
| 09/13/2006 | CN1832169A Wireless chip and electronic appliance having the same |
| 09/13/2006 | CN1832168A Multi-chip high power LED device |
| 09/13/2006 | CN1832167A Light emitting device and illumination apparatus using said light emitting device |
| 09/13/2006 | CN1832166A Semiconductor device and a method for manufacturing the same |
| 09/13/2006 | CN1832165A Stacked dram memory chip for a dual inline memory module (dimm) |
| 09/13/2006 | CN1832164A 半导体模块 Semiconductor Modules |
| 09/13/2006 | CN1832163A Imaging module and method for forming the same |
| 09/13/2006 | CN1832121A Signal redistribution using bridge layer for multichip module |
| 09/13/2006 | CN1832030A 电子电路 Electronic circuit |
| 09/13/2006 | CN1275328C Semiconductor chip and semiconductor device using said semiconductor chip |
| 09/13/2006 | CN1275312C Semiconductor device and its producing method, laminated semiconductor device and circuit base board |
| 09/12/2006 | US7106592 Coolant cooled type semiconductor device |
| 09/12/2006 | US7106320 Power module and display device |
| 09/12/2006 | US7106093 Semiconductor device |
| 09/12/2006 | US7105932 Power semiconductor module |
| 09/12/2006 | US7105929 Semiconductor device |
| 09/12/2006 | US7105922 Electrode-type heat sink |
| 09/12/2006 | US7105919 Semiconductor package having ultra-thin thickness and method of manufacturing the same |
| 09/12/2006 | US7105904 CMOS type image sensor module having transparent polymeric encapsulation material |
| 09/12/2006 | US7105860 Flip chip light-emitting diode package |
| 09/12/2006 | US7105858 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density |
| 09/12/2006 | US7103970 Method for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips |
| 09/12/2006 | CA2467821C Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 09/08/2006 | WO2006016327A3 Led light system |
| 09/08/2006 | WO2006012110A3 Integrated transistor module and method of fabricating same |
| 09/07/2006 | US20060198137 Method and apparatus for producing untainted white light using off-white emitting diodes |
| 09/07/2006 | US20060197221 Integrated Circuit Having Memory Disposed Thereon and Method of Making Thereof |
| 09/07/2006 | US20060197212 Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded |
| 09/07/2006 | US20060197211 Semiconductor device and method of stacking semiconductor chips |
| 09/07/2006 | US20060197204 Semiconductor device |
| 09/07/2006 | US20060197198 Semiconductor package with passive device integration |
| 09/07/2006 | DE19651566B4 Chip-Modul sowie Verfahren zu dessen Herstellung und eine Chip-Karte -Chip module and method for its production and a chip card |
| 09/07/2006 | DE102006005050A1 Semiconductor device for controlling motor, has electrode wiring parts coming out from respective side sections of extraction electrode and electrically connected only with respective connection electrodes arranged on emitter electrode |
| 09/07/2006 | DE102005019375A1 LED-Array LED array |
| 09/07/2006 | DE102005009060A1 Modul mit strahlungsemittierenden Halbleiterkörpern Module with radiation-emitting semiconductor bodies |
| 09/06/2006 | EP1699277A1 Ceramic multilayer substrate |
| 09/06/2006 | EP1697987A1 Electronic packaging materials for use with low-k dielectric-containing semiconductor devices |
| 09/06/2006 | EP1697966A2 Method and device for the alternating contacting of two wafers |
| 09/06/2006 | EP1697745A1 Method for bonding plastic micro chip |
| 09/06/2006 | EP1470588B1 Split-gate power module and method for suppressing oscillation therein |
| 09/06/2006 | EP1461645A4 Uniform illumination system |
| 09/06/2006 | EP1332487A4 Display tile structure using organic light emitting materials |
| 09/06/2006 | CN2814622Y Flexible conductor wire structure with luminous body |
| 09/06/2006 | CN1830085A Heatsinking electronic devices |
| 09/06/2006 | CN1830084A Integrated circuit package having stacked integrated circuits and method therefor |
| 09/06/2006 | CN1830083A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/06/2006 | CN1830080A High-heat-resistant semiconductor device |
| 09/06/2006 | CN1829416A Embedded chip printed circuit board and method of manufacturing the same |
| 09/06/2006 | CN1828891A Hybrid module and production method for same, and hybrid circuit device |
| 09/06/2006 | CN1828890A IC and stack chip set with routing layer |
| 09/06/2006 | CN1828889A Ultrafast recovery diode module |
| 09/06/2006 | CN1828888A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/06/2006 | CN1828887A Chip type minitype connector and its packaging method |
| 09/06/2006 | CN1828856A Power type light-emitting diode device and its manufacturing method |
| 09/06/2006 | CN1274005C Opto-electronic device integration |
| 09/05/2006 | US7103864 Semiconductor device, and design method, inspection method, and design program therefor |
| 09/05/2006 | US7103861 Test structure for automatic dynamic negative-bias temperature instability testing |
| 09/05/2006 | US7102905 Stacked memory, memory module and memory system |
| 09/05/2006 | US7102896 Electronic component module |
| 09/05/2006 | US7102892 Modular integrated circuit chip carrier |
| 09/05/2006 | US7102387 Periodic computation structure based on 1-input lookup tables |
| 09/05/2006 | US7102386 Reconfigurable electronic device having interconnected data storage devices |
| 09/05/2006 | US7102283 Full-color light emitting device with four leads |
| 09/05/2006 | US7102240 Embedded integrated circuit packaging structure |
| 09/05/2006 | US7102238 Semiconductor device and manufacturing method thereof |
| 09/05/2006 | US7102227 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof |
| 09/05/2006 | US7102221 Memory-Module with an increased density for mounting semiconductor chips |
| 09/05/2006 | US7102220 Multiple cavity/compartment package |
| 09/05/2006 | US7102219 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument |
| 09/05/2006 | US7102211 Semiconductor device and hybrid integrated circuit device |
| 09/05/2006 | US7102074 Photovoltaic attachment system |
| 09/05/2006 | US7101733 Leadframe with a chip pad for two-sided stacking and method for manufacturing the same |
| 09/05/2006 | US7101731 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
| 09/05/2006 | US7101730 Method of manufacturing a stackable ball grid array |
| 09/05/2006 | US7101444 Defect-free semiconductor templates for epitaxial growth |
| 09/05/2006 | US7101061 Light emission apparatus |
| 08/31/2006 | WO2006090827A1 Electronic device and method for manufacturing same |
| 08/31/2006 | WO2006089512A1 Module comprising radiation-emitting semiconductor bodies |
| 08/31/2006 | WO2006089508A1 Led array |
| 08/31/2006 | WO2006061792A3 Hermetically sealed integrated circuit package |
| 08/31/2006 | WO2006056648A3 Electronics module and method for manufacturing the same |
| 08/31/2006 | US20060195729 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements |
| 08/31/2006 | US20060194366 Multi-chip ball grid array package |
| 08/31/2006 | US20060193145 Vehicle headlamp |
| 08/31/2006 | US20060192290 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 08/31/2006 | US20060192215 Light emitting device and light emitting system |
| 08/31/2006 | DE10319525B4 Bandförmige Anordnung mit einer Leiterbahnstruktur und mit damit elektrisch verbundenen elektronischen Bauteilen, insbesondere Lichtband mit Leuchtelementen Strip-type arrangement with a printed conductor structure and electrically connected thereto with electronic components, in particular strip lighting with light emitting elements |
| 08/30/2006 | EP1627425B1 Method for the production of a chip arrangement and varnish for carrying out said method |
| 08/30/2006 | EP1570572A4 Single package multi-chip rf power amplifier |
| 08/30/2006 | EP1297573B1 Screen element for a high resolution screen |
| 08/30/2006 | CN2812301Y Power type LED light source apparatus |
| 08/30/2006 | CN1825637A Light source apparatus and mfg. method thereof |
| 08/30/2006 | CN1825586A Led assembly and method of making the same |