Patents
Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2006
10/12/2006WO2006106569A1 Stacked type semiconductor device and method for manufacturing same
10/12/2006WO2006105586A1 A method for producing a multi component electronic module and a module produced by the method
10/12/2006US20060226543 Ball grid array package stack
10/12/2006US20060226541 Electroosmotic pumps using porous frits for cooling integrated circuit stacks
10/12/2006US20060226531 Power semiconductor module
10/12/2006US20060226529 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
10/12/2006DE202006009689U1 Illuminating unit for full color LED display, has LEDs, e.g. red, green and blue LEDs, that are crosswisely arranged and have rectangular or trapezoidal or polygonal upper surface, where virtual pixel technique of display is applied to LEDs
10/12/2006DE202006008138U1 Power converter for use in e.g. low voltage switchboard, has direct current and alternating current bus bars for electrically contacting converter and/or thyristor, where bus bars are formed from pure aluminum and/or aluminum alloy
10/11/2006EP1710846A1 Light-emitting diode
10/11/2006EP1710835A1 Stacked device and method for stacking integrated circuit devices
10/11/2006EP1709693A2 Semiconductor structure comprising active zones
10/11/2006EP1709686A2 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
10/11/2006EP1264347B1 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages
10/11/2006EP1058224B1 Electronic device with solar cell
10/11/2006CN2826708Y 发光二极管 Led
10/11/2006CN1846318A Linear light source and production method therefor and surface emission device
10/11/2006CN1846311A Stackable electronic assembly
10/11/2006CN1846308A Microelectronic package method and device
10/11/2006CN1846306A Method for producing an electronic component or module and a corresponding component or module
10/11/2006CN1845325A Laminated semiconductor device
10/11/2006CN1845324A Stack bare-die package composite structure of multiple IC
10/11/2006CN1279628C Electromagnetic radiation sensing with signal crystal SiC
10/11/2006CN1279605C Semiconductor device and its producing method, circuit base board and electronic instrment
10/11/2006CN1279604C Semiconductor device and its producing method, circuit base board and electronic instrument
10/11/2006CN1279596C Soft soldering method for semiconductor components and semiconductor device
10/10/2006US7120069 Electronic circuit package
10/10/2006US7119761 Pixel structure
10/10/2006US7119487 Semiconductor light emitting device with stacked light emitting elements
10/10/2006US7119445 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
10/10/2006US7119437 Electronic substrate, power module and motor driver
10/10/2006US7119429 3-D stackable semiconductor package
10/10/2006US7119428 Semiconductor device
10/10/2006US7119427 Stacked BGA packages
10/10/2006US7119426 Semiconductor device and manufacturing method of same
10/10/2006US7119425 Stacked multi-chip semiconductor package improving connection reliability of stacked chips
10/10/2006US7119340 Radiation detector, radiation detector element, and radiation imaging apparatus
10/10/2006US7119004 Semiconductor device, its manufacturing method, and ratio communication device
10/10/2006US7118938 Method for packaging a multi-chip module of a semiconductor device
10/10/2006US7118931 Radiation emitter device having an integral micro-groove lens
10/10/2006US7117913 Mounting device and method thereof
10/05/2006WO2006105250A2 Apparatus, system, and method for internet trade
10/05/2006WO2006103512A1 Optical data tranceiver
10/05/2006WO2006103299A1 Low- thickness electronic module comprising a pile of electronic package provided with connection balls
10/05/2006WO2006102874A1 Semiconductor module comprising semiconductor chips that are contained in separate areas of a plastic housing and method for producing said module
10/05/2006US20060223216 Sensor module structure and method for fabricating the same
10/05/2006US20060220212 Stacked package for electronic elements
10/05/2006US20060220211 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
10/05/2006US20060220180 Semiconductor device with extraction electrode
10/05/2006US20060218782 Method for manufacturing an electronic module
10/05/2006DE19652030B4 Verfahren zum Einkapseln eines Infrarotsendeempfängers A method of encapsulating an infrared transceiver
10/05/2006DE102005014094A1 Integration device for semiconductor components, has interposer having recess with contact surfaces, in which semiconductor component is inserted into recess with contact points of semiconductor component engaged with contact surfaces
10/05/2006DE102005013325A1 Connection method of integrated circuits to circuit module, involves using module carrier that has chip mounting area provided with guide mechanisms and connection mechanisms for guiding and electrical connection of semiconductor chips
10/04/2006EP1708260A2 Electric circuit module as well as power converter and vehicle-mounted electric system that include the module
10/04/2006CN2824293Y Light emitting bipolar body lampbulb
10/04/2006CN2824292Y Water proof radiating LED light source module
10/04/2006CN1842906A Reversible leadless package and methods of making and using same
10/04/2006CN1842307A Illuminated electric toothbrushes emitting high luminous intensity toothbrush
10/04/2006CN1841901A 微型电功率转换器 Micro-electrical power converter
10/04/2006CN1841729A Heavy current three-phase rectification power electronic device module
10/04/2006CN1841728A Semiconductor module and method of manufacturing the same
10/04/2006CN1841727A Connecting member used for semiconductor device and semiconductor device provided with the same
10/04/2006CN1841726A 电路装置及其制造方法 Circuit device and manufacturing method thereof
10/04/2006CN1841725A Semiconductor device with power module housed in casing
10/04/2006CN1841715A Electric circuit module as well as power converter and vehicle-mounted electric system that include the module
10/04/2006CN1841688A Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component
10/04/2006CN1840960A Spread illuminating apparatus of side light type
10/04/2006CN1278418C Affinity based self-assembly systems and devices for photonic and electronic applications
10/04/2006CN1278412C Press-contacting type semiconductor device
10/03/2006US7116122 Method for ball grid array chip packages having improved testing and stacking characteristics
10/03/2006US7116002 Overhang support for a stacked semiconductor device, and method of forming thereof
10/03/2006US7115986 Flexible ball grid array chip scale packages
10/03/2006US7115984 Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
10/03/2006US7115977 Multi-chip package type semiconductor device
10/03/2006US7115972 Semiconductor device and chip-stack semiconductor device
10/03/2006US7115962 Housing for a photoactive semiconductor chip and a method for the production thereof
10/03/2006US7115931 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
10/03/2006US7115877 Radiation detector, radiation detector element, and radiation imaging apparatus
10/03/2006US7115505 Methods for electrically isolating portions of wafers
10/03/2006US7115483 Stacked chip package having upper chip provided with trenches and method of manufacturing the same
10/03/2006US7115451 Methods of forming semiconductor circuitry
10/03/2006US7115441 Semiconductor package with semiconductor chips stacked therein and method of making the package
10/03/2006US7114827 Lighting assembly
10/03/2006US7114251 Method of producing of circuit board; for semiconductor device
09/2006
09/28/2006WO2006101155A1 Electronic component mounting method and electronic circuit device
09/28/2006WO2006101150A2 Power semiconductor module
09/28/2006WO2006099741A1 Solid-state lighting device package
09/28/2006WO2006072107A3 Semiconductor device with embedded heat spreader
09/28/2006US20060216967 Device for controlling a vehicle
09/28/2006US20060216866 Universal interconnect die
09/28/2006US20060216865 Direct cooling of leds
09/28/2006US20060216864 Stacked die in die BGA package
09/28/2006US20060216862 Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
09/28/2006US20060216858 Vertically Stacked Semiconductor Device
09/28/2006US20060216845 White light emitting device and method of making same
09/28/2006US20060215129 2D/3D data projector
09/28/2006US20060214696 Voltage supply structure and method
09/28/2006US20060214306 Semiconductor Chip and Method for Manufacturing the Same
09/28/2006US20060214302 Manufacturing method for semiconductor device, semiconductor device, and electronic apparatus
09/28/2006US20060214255 Semiconductor device and method of manufacturing the same
09/28/2006DE10323394B4 Verfahren zum Erzeugen einer elektrischen Kontaktierung zwischen zwei Halbleiterstücken und Verfahren zum Herstellen einer Anordnung von Halbleiterstücken A method of producing an electrical contact between two semiconductor pieces and methods of making an array of semiconductor pieces