| Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835) |
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| 09/28/2006 | DE10261365B4 Optoelektronisches Bauelement mit einer Mehrzahl von strahlungsemittierenden Halbleiterchips Optoelectronic component having a plurality of radiation-emitting semiconductor chips |
| 09/28/2006 | DE102005043557A1 Semiconductor device for electronic device, has through contact arranged in prefabricated through contact flat rod, which is positioned in end region of device and exhibits through opening which is filled with metal |
| 09/28/2006 | DE102005032740B3 Microelectronic arrangement manufacture involves arranging components of microelectronic arrangement in assembly position, connecting components using bonding wires and setting components to final position deforming bonding wires |
| 09/28/2006 | DE102005013155A1 LED-lamp, has LEDs assembled on circle segment plates, where each LED is displaced on respective circle segment plate from its vertical mounting position into its definite operating angle for adjusting radiation angles |
| 09/28/2006 | DE102005011857A1 Flächige Beleuchtungseinrichtung Area lighting device |
| 09/28/2006 | CA2613974A1 Solid-state lighting device package |
| 09/27/2006 | EP1705702A2 Hybrid semiconductor apparatus, print head and image forming apparatus |
| 09/27/2006 | EP1704594A1 Various structure/height bumps for wafer level-chip scale package |
| 09/27/2006 | CN2821875Y Light source mother plate of white light emitting group |
| 09/27/2006 | CN2821874Y Light source mother plate with phosphor thin sheet |
| 09/27/2006 | CN2821867Y White light LED |
| 09/27/2006 | CN1839474A Module and mounting structure using the same |
| 09/27/2006 | CN1838409A Memory module with different types of multi chip packages |
| 09/27/2006 | CN1277290C Method for preparing low dielectric films |
| 09/27/2006 | CN1277279C High frequency inductor with low inductance and less inductance fluctuation, and its mfg. method |
| 09/26/2006 | US7113250 Apparatuses and methods for forming assemblies |
| 09/26/2006 | US7112887 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme |
| 09/26/2006 | US7112884 Integrated circuit having memory disposed thereon and method of making thereof |
| 09/26/2006 | US7112878 Die stacking scheme |
| 09/26/2006 | US7112877 High density package with wrap around interconnect |
| 09/26/2006 | US7112863 Optical device, optical module, semiconductor apparatus and its manufacturing method, and electronic apparatus |
| 09/26/2006 | US7112776 Solid state detector and method of manufacturing same |
| 09/26/2006 | US7112520 Semiconductor die packages with recessed interconnecting structures and methods for assembling the same |
| 09/26/2006 | US7112473 Double side stack packaging method |
| 09/26/2006 | US7112469 Method of fabricating a semiconductor package utilizing a thermosetting resin base member |
| 09/26/2006 | US7112468 Stacked multi-component integrated circuit microprocessor |
| 09/26/2006 | US7112457 Method of manufacturing an opto-coupler |
| 09/26/2006 | US7111968 Systems and components for enhancing rear vision from a vehicle |
| 09/21/2006 | WO2006098364A1 Module board |
| 09/21/2006 | WO2006010911A3 Laminated interconnects for organic opto-electronic device modules |
| 09/21/2006 | US20060208359 Double density method for wirebond interconnect |
| 09/21/2006 | US20060208351 Semiconductor devices including peripherally located bond pads, intermediates thereof, and assemblies and packages including the semiconductor devices |
| 09/21/2006 | US20060208350 Support elements for semiconductor devices with peripherally located bond pads |
| 09/21/2006 | US20060208349 Semiconductor device and manufacturing method for the same |
| 09/21/2006 | DE202006006336U1 High speed-LED-package assembly, has metallic-cooling unit mounted on heat-conducting base and heat-conducting insulation layer provided between heat-conducting base and metallic-cooling unit |
| 09/21/2006 | DE102004029023B4 Leistungshalbleitermodul mit einem Detektor zum Erfassen eines durch ein Leistungshalbleiterbauteil fliessenden Schaltungshauptstroms Power semiconductor module with a detector for detecting a current flowing through a power semiconductor device circuit the main current |
| 09/21/2006 | DE10128419B4 Festkörper-Bildaufnahmeeinrichtung mit Mikrolinse und Unterfüllung Solid-state image pickup device with microlens and underfill |
| 09/20/2006 | EP1703558A2 Wiring board with embedded semiconductor chip, embedded reinforcing member and method of manufacturing the same |
| 09/20/2006 | EP1703554A2 Power semiconductor module |
| 09/20/2006 | EP1552343A4 High-density interconnection of temperature sensitive electronic devices |
| 09/20/2006 | EP1468449B1 Multi-chip module semiconductor devices |
| 09/20/2006 | EP1174921B1 Semiconductor device |
| 09/20/2006 | CN2819647Y Ceramic sealer of crystal oscillator |
| 09/20/2006 | CN2819478Y Sealing structure of multiple-chip light emitting diode |
| 09/20/2006 | CN2819477Y Stacking structure of module cards |
| 09/20/2006 | CN1836348A Two stage energy storage device |
| 09/20/2006 | CN1836337A Fast switching power insulated gate semiconductor device |
| 09/20/2006 | CN1836329A Circuit device and method for manufacturing same |
| 09/20/2006 | CN1836326A Semiconductor device and method for making the same |
| 09/20/2006 | CN1835661A Wiring board manufacturing method |
| 09/20/2006 | CN1835654A Wiring board and method of manufacturing the same |
| 09/20/2006 | CN1835308A Application of microwave photon crystal copolaner waveguide in packing high speed photoelectronic element |
| 09/20/2006 | CN1835232A Multi-chip semiconductor device with high withstand voltage, and a fabrication method of the same |
| 09/20/2006 | CN1835231A Semiconductor device and manufacturing method therefor |
| 09/20/2006 | CN1835230A Stacked semiconductor package |
| 09/20/2006 | CN1835229A Semiconductor device and method of manufacturing semiconductor device |
| 09/20/2006 | CN1835228A Three-dimensional package and method of forming same |
| 09/20/2006 | CN1835227A 半导体封装 The semiconductor package |
| 09/20/2006 | CN1835215A Luminous modular and its light source device |
| 09/20/2006 | CN1835056A Light-emitting module and driving method therefor, and optical sensor |
| 09/20/2006 | CN1276492C Method for producing semiconductor |
| 09/20/2006 | CN1276211C Projection light source generating apparatus using light emitting diode |
| 09/19/2006 | US7111266 Multiple voltage integrated circuit and design method therefor |
| 09/19/2006 | US7111214 Circuits and methods for testing programmable logic devices using lookup tables and carry chains |
| 09/19/2006 | US7110061 Image display device and light emission device |
| 09/19/2006 | US7109747 Low power, high speed logic controller that implements thermometer-type control logic by utilizing scan flip-flops and a gated clock |
| 09/19/2006 | US7109687 Three-phase ac generator for vehicle |
| 09/19/2006 | US7109581 System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler |
| 09/19/2006 | US7109576 Semiconductor component having encapsulated die stack |
| 09/19/2006 | US7109574 Integrated circuit package with exposed die surfaces and auxiliary attachment |
| 09/19/2006 | US7109528 Light receiving or emitting semiconductor apparatus |
| 09/19/2006 | US7109492 Radiographic apparatus |
| 09/19/2006 | US7109488 Multi-color infrared imaging device |
| 09/19/2006 | US7109063 Semiconductor substrate for build-up packages |
| 09/19/2006 | US7109060 Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment |
| 09/19/2006 | US7109059 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 09/19/2006 | US7109054 Image sensor with recessed planarizing layers and method for making same |
| 09/19/2006 | US7108399 Light source unit |
| 09/19/2006 | US7108396 Modular mounting arrangement and method for light emitting diodes |
| 09/19/2006 | US7108386 High-brightness LED-phosphor coupling |
| 09/14/2006 | WO2006095852A1 Electronic component module and method for manufacturing same |
| 09/14/2006 | WO2006095703A1 Structure and method for mounting bare chip |
| 09/14/2006 | WO2006095602A1 Mounting body and method for manufacturing same |
| 09/14/2006 | WO2006033031A3 Illumination system |
| 09/14/2006 | US20060205209 Enhanced barrier liner formation for vias |
| 09/14/2006 | US20060202353 Semiconductor device and method of manufacturing the same |
| 09/14/2006 | US20060202315 Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures |
| 09/14/2006 | US20060202228 Semiconductor device |
| 09/14/2006 | US20060202225 Submount for use in flipchip-structured light emitting device including transistor |
| 09/14/2006 | US20060201704 Stacked microfeature devices and associated methods |
| 09/14/2006 | DE102006010761A1 Halbleitermodul Semiconductor module |
| 09/14/2006 | DE102006009561A1 Stapel aus Chips mit einer flexiblen Verbindung Stack of chips with a flexible connection |
| 09/14/2006 | DE102006006930A1 LED-Baugruppe mit einer LED-Positionierungsschablone und ein Verfahren zur Herstellung einer LED-Baugruppe unter Verwendung einer LED-Positionierungsschablone LED assembly having an LED positioning plate and a method for manufacturing a LED package using a LED positioning plate |
| 09/14/2006 | DE102005057447A1 LED-Befestigung mit erhöhter Wärmedissipation LED Fixture with increased heat dissipation |
| 09/13/2006 | EP1701384A1 Network chip design for grid communication |
| 09/13/2006 | EP1700350A2 Surface mount light emitting chip package |
| 09/13/2006 | EP1700344A2 Semiconductor light emitting device, lighting module, lighting apparatus, display element, and manufacturing method for semiconductor light emitting device |
| 09/13/2006 | EP1668686A4 Reversible leadless package and methods of making and using same |
| 09/13/2006 | EP1297572A4 Led lamp |
| 09/13/2006 | CN2817074Y Multi-substrate thick-film circuit |