H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices

Patents for H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
10/2006
10/26/2006	US20060238983 Power semiconductor module
10/26/2006	US20060238080 Piezoelectric oscillator, manufacturing method thereof, and electronic device
10/26/2006	US20060237833 System having semiconductor component with multiple stacked dice
10/26/2006	US20060237832 Standoffs for centralizing internals in packaging process
10/26/2006	US20060237738 LED lamps
10/26/2006	US20060237225 Multilayer printed wiring board
10/26/2006	DE19609929B4 Leistungshalbleitermodul The power semiconductor module
10/26/2006	DE102005022017B3 Semiconductor chip stack manufacturing method, involves holding stabilization layer at chemical mechanical polishing- or etched stop layer while thinning wafer of isolated semiconductor chips
10/26/2006	DE102005018175A1 LED-Modul und LED-Beleuchtungseinrichtung mit mehreren LED-Modulen LED module and LED illumination device having a plurality of LED modules
10/25/2006	EP1715526A2 Solid-state imaging apparatus and camera using the same
10/25/2006	EP1715525A2 Solid-state imaging apparatus
10/25/2006	EP1715524A2 Solid-state imaging apparatus
10/25/2006	EP1715523A1 Transparent LED display
10/25/2006	EP1715522A1 Transparent LED display and method for manufacture thereof
10/25/2006	EP1715521A1 Method for manufacture of transparent devices having light emitting diodes (LED)
10/25/2006	EP1715512A2 Semiconductor device and method of forming the same
10/25/2006	EP1414050B1 Method for producing nanocomposite magnet using atomizing method
10/25/2006	EP0860024A4 Circuit structure having a flip-mounted matrix of devices
10/25/2006	CN2831440Y Double-color LED
10/25/2006	CN2831439Y Photoelectrical chip encapsulating structure with controlling chip
10/25/2006	CN2831433Y Plane surrounded salient point encapsulation structure of integrated circuit or discrete component
10/25/2006	CN2831432Y Plane lined salient point encapsulation structure of integrated circuit or discrete component
10/25/2006	CN2831431Y Plane array salient point encapsulation structure of integrated circuit or discrete component
10/25/2006	CN2831430Y Plane salient point combined encapsulation structure of integrated circuit or discrete component
10/25/2006	CN1853451A Method for manufacturing an electronic module
10/25/2006	CN1853272A Electronic package having a folded flexible substrate and method of manufacturing the same
10/25/2006	CN1851918A Day-light diode light-source and making method for fluorescent powder
10/25/2006	CN1851907A Semiconductor packing structure comprising passive element
10/25/2006	CN1282244C Electronic module having 3-D array of carrier-mounted IC packages
10/24/2006	US7127031 Radiation imaging apparatus, radiation imaging system and radiation imaging method
10/24/2006	US7126836 Semiconductor device, system device using it, and manufacturing method of a semiconductor device
10/24/2006	US7126226 Semiconductor device and semiconductor chip for use therein
10/24/2006	US7126219 Small memory card
10/24/2006	US7126214 Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
10/24/2006	US7126209 Lead frame, resin-encapsulated semiconductor device, and method of producing the same
10/24/2006	US7126173 Method for enhancing the electric connection between a power electronic device and its package
10/24/2006	US7126159 Plural leds mounted within a central cutout of a surrounding circular reflective electrode
10/24/2006	US7126128 Flat panel x-ray detector
10/24/2006	US7126054 Gel electrolytes; dye sensitizer solar cells
10/24/2006	US7125798 Circuit device and manufacturing method of circuit device
10/24/2006	US7125751 Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
10/24/2006	US7125746 Flip-chip sub-assembly, methods of making same and device including same
10/24/2006	US7125745 Multi-chip package substrate for flip-chip and wire bonding
10/24/2006	US7125143 LED module
10/19/2006	WO2006109857A1 Semiconductor device
10/19/2006	WO2006109506A1 Process for producing semiconductor device, and semiconductor device
10/19/2006	WO2006109383A1 Electronic device provided with wiring board, method for manufacturing such electronic device and wiring board used for such electronic device
10/19/2006	WO2006108993A2 Bluetooth ® wireless dental radiology device and system
10/19/2006	WO2006108992A2 Stand-alone wireless dental radiology device and system
10/19/2006	WO2006078070A3 Semiconductor module and semiconductor device
10/19/2006	US20060234560 Modular sockets using flexible interconnects
10/19/2006	US20060234409 Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
10/19/2006	US20060232969 Illumination device for backlighting an image reproduction device
10/19/2006	US20060232942 Electric circuit module as well as power converter and vehicle-mounted electric system that include the module
10/19/2006	US20060232939 Coolant cooled type semiconductor device
10/19/2006	US20060231958 Fan out type wafer level package structure and method of the same
10/19/2006	US20060231937 Thin multiple semiconductor die package
10/19/2006	US20060231928 Semiconductor device and chip-stack semiconductor device
10/19/2006	US20060231927 Semiconductor chip mounting body and manufacturing method thereof
10/19/2006	DE112004002018T5 Halbleiterbauelement-Baugruppe, die ein herausstehendes Zwischenverbindungsmaterial verwendet A semiconductor device module that uses an out-standing interconnection material
10/19/2006	DE112004001727T5 Verfahren zur Herstellung eines elektronischen Moduls A process for producing an electronic module
10/19/2006	DE102006009955A1 Lichtaussendende Einrichtung und Beleuchtungsvorrichtung, die die lichtaussendende Einrichtung verwendet A light-emitting device and lighting device using the light emitting means
10/19/2006	DE102005017206A1 LED module for head up display of vehicle, has color LED, which sends spectral centroid and is arranged in direct proximity to white light LED, where symmetry in terms of axis or point is produced between each white light LED and color LED
10/19/2006	DE102005016008A1 Component module, e.g. sensor component, for use on substrate of motor vehicle air conditioning system, has chip housing body with cavities, where sensor chip-arrangement and humidity measuring chip are fastened in cavities, respectively
10/19/2006	DE102005014674A1 Halbleitermodul mit Halbleiterchips in einem Kunststoffgehäuse in getrennten Bereichen und Verfahren zur Herstellung desselben The same semiconductor module with the semiconductor chip in a plastic housing in separate areas and methods for preparing
10/18/2006	EP1713308A2 Fault tolerant led display design
10/18/2006	EP1713124A2 Power semiconductor module with connecting tracks and with connecting elements which are arranged flush with the connecting tracks.
10/18/2006	EP1713123A2 Electronic assembly with stacked integrated circuit die
10/18/2006	EP1713122A2 Semiconductor device and method for producing the same
10/18/2006	EP1711963A2 Integrating passive components on spacer in stacked dies
10/18/2006	CN2829094Y Mixed photoelectric integrated packaging
10/18/2006	CN2829093Y LED assembling module and lamp composed by it
10/18/2006	CN2829092Y Module circuit assembly
10/18/2006	CN1849707A Integrated lamp with feedback and wireless control
10/18/2006	CN1848466A White light emitting device with light-emitting diode and application thereof
10/18/2006	CN1848428A Memory module
10/18/2006	CN1848427A Electronic apparatus and method for manufacturing the same
10/18/2006	CN1848426A Light emitting device
10/18/2006	CN1848425A Power semiconductor module with connecting tracks and with connecting elements which are arranged flush with the connecting tracks
10/18/2006	CN1848424A Non-cavity semiconductor packages
10/18/2006	CN1848423A Semiconductor apparatus and circuit apparatus
10/18/2006	CN1846602A Light source device for slit lamp microscope
10/18/2006	CN1280884C Semiconductor device and manufacture thereof, circuit board and electronic machine
10/18/2006	CN1280866C Semiconductor assembly
10/18/2006	CN1280574C Device and method for modularization mounting of LED
10/17/2006	US7123497 Memory module and memory system
10/17/2006	US7123107 Piezoelectric oscillator, manufacturing method thereof, and electronic device
10/17/2006	US7123084 Semiconductor integrated circuit and designing method for same
10/17/2006	US7122912 Chip and multi-chip semiconductor device using thereof and method for manufacturing same
10/17/2006	US7122906 Die-wafer package and method of fabricating same
10/17/2006	US7122904 Semiconductor packaging device and manufacture thereof
10/17/2006	US7122901 Semiconductor device
10/17/2006	US7122890 Low cost power semiconductor module without substrate
10/17/2006	US7122889 Semiconductor module
10/17/2006	US7122886 Semiconductor module and method for mounting the same
10/17/2006	US7122883 Stacked semiconductor device including improved lead frame arrangement
10/17/2006	US7122840 Image sensor with optical guard ring and fabrication method thereof
10/17/2006	US7122457 Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
10/17/2006	US7122404 Techniques for packaging a multiple device component
10/17/2006	US7122400 Method of fabricating an interconnection for chip sandwich arrangements

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