Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2009
03/12/2009US20090069658 Analyte Monitoring Device and Methods of Use
03/12/2009US20090069657 Analyte Monitoring Device and Methods of Use
03/12/2009US20090069656 Analyte Monitoring Device and Methods of Use
03/12/2009US20090069655 Analyte Monitoring Device and Methods of Use
03/12/2009US20090068843 Method of forming mark in ic-fabricating process
03/12/2009US20090068795 Production methods of electronic devices
03/12/2009US20090068556 Battery-operated wireless-communication apparatus and method
03/12/2009US20090067135 Semiconductor Package Having Socket Function, Semiconductor Module, Electronic Circuit Module and Circuit Board with Socket
03/12/2009US20090067107 Electrostatic Discharge Protective Circuit and Semiconductor Integrated Circuit Using the Same
03/12/2009US20090066447 High speed interconnect and method of manufacture
03/12/2009US20090066437 High speed electrical interconnect and method of manufacture
03/12/2009US20090066352 Making And Using Carbon Nanotube Probes
03/12/2009US20090065956 Memory cell
03/12/2009US20090065955 Method and structures for accelerated soft-error testing
03/12/2009US20090065954 Packaging Method For Wideband Power Using Transmission Lines
03/12/2009US20090065953 Chip module and a fabrication method thereof
03/12/2009US20090065952 Semiconductor Chip with Crack Stop
03/12/2009US20090065951 Stacked die package
03/12/2009US20090065950 Stack chip and stack chip package having the same
03/12/2009US20090065949 Semiconductor package and semiconductor module having the same
03/12/2009US20090065948 Package structure for multiple die stack
03/12/2009US20090065947 Semiconductor device having circularly connected plural pads via through holes and method of evaluating the same
03/12/2009US20090065946 Method for fabricating semiconductor device and semiconductor device
03/12/2009US20090065945 Semiconductor device for preventing inflow of high current from an input/output pad and a circuit for preventing inflow of high current thereof
03/12/2009US20090065944 Reworked integrated circuit device and reworking method thereof
03/12/2009US20090065943 Microelectronic Assembly Having Second Level Interconnects Including Solder Joints Reinforced with Crack Arrester Elements and Method of Forming Same
03/12/2009US20090065942 Semiconductor device, display device, and method of manufacturing semiconductor device
03/12/2009US20090065941 Method of fabricating ultra-deep vias and three-dimensional integrated circuits using ultra-deep vias
03/12/2009US20090065940 Metal wiring of a semiconductor device and method of forming the same
03/12/2009US20090065939 Method for integrating selective ruthenium deposition into manufacturing of a semiconductior device
03/12/2009US20090065938 Semiconductor Element and Method for Manufacturing Same
03/12/2009US20090065937 Structure of high performance combo chip and processing method
03/12/2009US20090065936 Substrate, electronic component, electronic configuration and methods of producing the same
03/12/2009US20090065935 Systems and methods for ball grid array (bga) escape routing
03/12/2009US20090065934 Wiring substrate, tape package having the same, display device having the tape package, method of manufacturing the wiring substrate, method of manufacturing a tape package having the same and method of manufacturing a display device having the tape package
03/12/2009US20090065933 Semiconductor device and method of manufacturing the same
03/12/2009US20090065932 Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
03/12/2009US20090065931 Packaged integrated circuit and method of forming thereof
03/12/2009US20090065930 Package Substrate Including Surface Mount Component Mounted on a Peripheral Surface thereof and Microelectronic Package Including Same
03/12/2009US20090065929 Multi-chip semiconductor device
03/12/2009US20090065928 Anti-stiction technique for electromechanical systems and electromechanical device employing same
03/12/2009US20090065927 Semiconductor Device and Methods of Manufacturing Semiconductor Devices
03/12/2009US20090065926 Semiconductor device and manufacturing method thereof
03/12/2009US20090065925 Dual-sided chip attached modules
03/12/2009US20090065924 Semiconductor package with reduced volume and signal transfer path
03/12/2009US20090065923 Semiconductor package with improved size, reliability, warpage prevention, and head dissipation and method for manufacturing the same
03/12/2009US20090065922 Semiconductor device package structure
03/12/2009US20090065921 Electronic Package Device, Module, and Electronic Apparatus
03/12/2009US20090065920 Semiconductor package embedded in substrate, system including the same and associated methods
03/12/2009US20090065919 Semiconductor package having resin substrate with recess and method of fabricating the same
03/12/2009US20090065918 Interconnecting electrical devices
03/12/2009US20090065917 Multi-Standards Compliant Card Body
03/12/2009US20090065916 Semiconductor die mount by conformal die coating
03/12/2009US20090065915 Singulated semiconductor package
03/12/2009US20090065914 Semiconductor device with leaderframe including a diffusion barrier
03/12/2009US20090065913 Chip package with asymmetric molding
03/12/2009US20090065912 Semiconductor Package and Method of Assembling a Semiconductor Package
03/12/2009US20090065911 Semiconductor package and manufacturing method thereof
03/12/2009US20090065910 Semiconductor device and manufacturing method of the same
03/12/2009US20090065909 Segmented magnetic shielding elements
03/12/2009US20090065908 Methods of fabricating a micromechanical structure
03/12/2009US20090065907 Semiconductor packaging process using through silicon vias
03/12/2009US20090065906 Semiconductor device and producing method of the same
03/12/2009US20090065905 Conductive metal structure applied to a module IC and method of manufacturing the same
03/12/2009US20090065904 Substrate having through-wafer vias and method of forming
03/12/2009US20090065903 Semiconductor device and method for fabricating the same
03/12/2009US20090065894 Electronic circuit device having silicon substrate
03/12/2009US20090065892 Semiconductor device and method for manufacturing the same
03/12/2009US20090065871 Semiconductor chip and process for forming the same
03/12/2009US20090065842 Ta-lined tungsten plugs for transistor-local hydrogen gathering
03/12/2009US20090065775 Test-key for checking interconnect and corresponding checking method
03/12/2009US20090065774 Multilayer semiconductor device
03/12/2009US20090065773 Semiconductor device
03/12/2009US20090065590 Semiconductor device and method for manufacturing the same
03/12/2009US20090065586 Electronic device
03/12/2009US20090065243 Printed wiring board
03/12/2009US20090065176 Thermal interface
03/12/2009DE19849340B4 Keramisches Sinterprodukt und Verfahren zu seiner Herstellung Ceramic sintered product and method for its preparation
03/12/2009DE102008046031A1 Bildsensor und Verfahren zur Herstellung eines Bildsensors Image sensor and method for manufacturing an image sensor
03/12/2009DE102007054828A1 Sensorelement und ein Verfahren zur Herstellung eines kapazitiven Sensors Sensor element and a method of manufacturing a capacitive sensor
03/12/2009DE102007043182A1 Thick strip conductor producing method for e.g. LED, involves providing openings such that upper side of carrier is exposed in openings, and introducing conductor material containing electrically conductive particles in openings
03/12/2009CA2669643A1 Method and apparatus for making a radio frequency inlay
03/11/2009EP2034528A1 Electronic component
03/11/2009EP2034521A2 Fluid cooled semiconductor power module having double-sided cooling
03/11/2009EP2034520A1 Highly heat conductive, flexible sheet
03/11/2009EP2034519A1 Resin-sealed semiconductor device and electronic device using such semiconductor device
03/11/2009EP2034517A1 Semiconductor device and semiconductor device manufacturing method
03/11/2009EP2034358A1 Heat transfer apparatus for a light valve device
03/11/2009EP2033247A2 Thin film battery on an integrated circuit or circuit board and method thereof
03/11/2009EP2033219A1 Power housing for semiconductor chips and the arrangement thereof for heat dissipation
03/11/2009EP1815515A4 Semiconductor device package with bump overlying a polymer layer
03/11/2009EP1791874B1 Thermally conductive sheet
03/11/2009EP1690293A4 Single substrate hydrogen and microwave absorber for integrated microwave assembly and method of manufacturing same
03/11/2009EP1558869B1 Vacuum heat insulator and its manufacturing method
03/11/2009EP1397830A4 Copper vias in low-k technology
03/11/2009EP1358124B1 Metal-carbon composite powders
03/11/2009EP1027583B1 Structure equipped with electric contacts formed through said structure substrate and method for obtaining said structure
03/11/2009CN201207787Y Heat radiating device with hot pipe evaporation terminal equally disposed
03/11/2009CN201207786Y Fan frame improvement construction for heat radiating module
03/11/2009CN201207785Y Heat radiator construction having circuit module
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