| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 03/18/2009 | CN100470779C Substrate for mounting electronic part and electronic part |
| 03/18/2009 | CN100470778C Device comprising multi-layer thin film having excellent adhesive strength and method for fabricating the same |
| 03/18/2009 | CN100470777C Heat sink |
| 03/18/2009 | CN100470776C heat absorber |
| 03/18/2009 | CN100470775C Radiator fastener |
| 03/18/2009 | CN100470774C Radiating apparatus |
| 03/18/2009 | CN100470773C Heat pipe radiating device |
| 03/18/2009 | CN100470772C Solder-free PCB assembly |
| 03/18/2009 | CN100470771C 芯片封装结构及其制造方法 Chip packaging structure and manufacturing method |
| 03/18/2009 | CN100470770C 半导体装置 Semiconductor device |
| 03/18/2009 | CN100470769C Semiconductor package and manufacturing method thereof |
| 03/18/2009 | CN100470768C Semiconductor package, its manufacturing process and semiconductor device |
| 03/18/2009 | CN100470767C Device and method for joining substrates |
| 03/18/2009 | CN100470766C Semiconductor device and manufacturing method thereof |
| 03/18/2009 | CN100470765C Adaptive threshold voltage control with positive body bias for N and P-channel transistors |
| 03/18/2009 | CN100470764C Two-dimensional display semiconductor structure and producing method thereof |
| 03/18/2009 | CN100470760C Array substrate and forming method thereof |
| 03/18/2009 | CN100470757C Conducting-wire structure, pixel structure, display panel, photoelectric device and its forming method |
| 03/18/2009 | CN100470745C Wafer pasting board package and manufacturing method thereof |
| 03/18/2009 | CN100470742C Chip-size package structure and forming method of the same |
| 03/18/2009 | CN100470445C Heat-radiating structure of electronic apparatus |
| 03/18/2009 | CN100469923C Copper alloy for high-temperature-resisting softening lead frame and its making process |
| 03/18/2009 | CN100469550C Resin sealing method for electronic part and mold used for the method |
| 03/18/2009 | CA2639146A1 Decoupling capacitor assembly, integrated circuit/decoupling capacitor assembly and method for fabricating same |
| 03/17/2009 | US7505281 Multilayer wiring board for an electronic device |
| 03/17/2009 | US7505276 Semiconductor module provided with contacts extending through the package |
| 03/17/2009 | US7505273 Cooling body and rectifier module for an electrical machine |
| 03/17/2009 | US7505268 Electronic device package with an integrated evaporator |
| 03/17/2009 | US7504925 Electric component with a protected current feeding terminal |
| 03/17/2009 | US7504856 Programming semiconductor dies for pin map compatibility |
| 03/17/2009 | US7504736 Semiconductor packaging mold and method of manufacturing semiconductor package using the same |
| 03/17/2009 | US7504735 to prevent a resin in a spacing from being peeled off from a dicing tape while dicing, thereby preventing the resin in a semiconductor device from becoming chipped, preventing a dicing blade from being damaged, and improving productivity |
| 03/17/2009 | US7504734 Semiconductor device having improved solder joint and internal lead lifetimes |
| 03/17/2009 | US7504733 Semiconductor die package |
| 03/17/2009 | US7504732 Three dimensional structure memory |
| 03/17/2009 | US7504731 Interconnect structure to reduce stress induced voiding effect |
| 03/17/2009 | US7504730 Memory elements |
| 03/17/2009 | US7504729 Semiconductor device with extraction electrode |
| 03/17/2009 | US7504727 Semiconductor interconnect structure utilizing a porous dielectric material as an etch stop layer between adjacent non-porous dielectric materials |
| 03/17/2009 | US7504726 Chip and manufacturing method and application thereof |
| 03/17/2009 | US7504725 Semiconductor memory device having low-resistance tungsten line and method of manufacturing the semiconductor memory device |
| 03/17/2009 | US7504724 contact plug connecting multilayer wiring lines formed with a fine wiring width and a fine wiring space |
| 03/17/2009 | US7504723 Electrical connection pattern in an electronic panel |
| 03/17/2009 | US7504722 Semiconductor device with slanting side surface for external connection |
| 03/17/2009 | US7504721 Apparatus and methods for packaging dielectric resonator antennas with integrated circuit chips |
| 03/17/2009 | US7504720 Semiconductor unit, and power conversion system and on-vehicle electrical system using the same |
| 03/17/2009 | US7504719 Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same |
| 03/17/2009 | US7504718 Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain |
| 03/17/2009 | US7504717 Semiconductor device |
| 03/17/2009 | US7504716 Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking |
| 03/17/2009 | US7504715 Packaging of a microchip device |
| 03/17/2009 | US7504714 Chip package with asymmetric molding |
| 03/17/2009 | US7504713 Plastic semiconductor packages having improved metal land-locking features |
| 03/17/2009 | US7504712 soldering surface and bonding surface are selectively plated with nickel/palladium/gold; mold adhesion surface and the die attachment surface are roughened for better attachment |
| 03/17/2009 | US7504711 Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof |
| 03/17/2009 | US7504710 Multilayer dielectric substrate and semiconductor package |
| 03/17/2009 | US7504709 Electronic device, method of manufacturing an electronic device, and electronic apparatus |
| 03/17/2009 | US7504707 Semiconductor device and manufacturing method thereof |
| 03/17/2009 | US7504699 Fabrication of a semiconductor device with air gaps for ultra-low capacitance interconnections |
| 03/17/2009 | US7504693 Dislocation free stressed channels in bulk silicon and SOI CMOS devices by gate stress engineering |
| 03/17/2009 | US7504685 Oxide epitaxial isolation |
| 03/17/2009 | US7504674 The H2 plasma treatment removes unwanted oxide from the surface region of the core conducting layer such that the interface between the core conducting layer and the capping adhesion/barrier is substantially free of oxides |
| 03/17/2009 | US7504670 has a groove for storing the adhesive; high reliability of electric connection |
| 03/17/2009 | US7504658 Sensor elements with cantilevered bar structures made of semiconductors based on group III-nitride |
| 03/17/2009 | US7504460 and a cross-linking agent comprising at least one of 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, or 1,4-bis(4-aminophenoxy)benzene; upon curing produce a three dimensional cross-linked matrix having a low coefficient of thermal expansion |
| 03/17/2009 | US7504284 Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices |
| 03/17/2009 | US7504281 Substrate based unmolded package |
| 03/17/2009 | US7504271 Integrated circuit package substrate having a thin film capacitor structure |
| 03/17/2009 | US7504199 Multilayer wiring pattern of low resistivity metal formed in simple manner at low cost; metals constituting respective layers can be freely selected according to intended application; forming photocatalytic film layer, water-soluble polymer layer, exposing layers to light to form latent image; plating |
| 03/17/2009 | US7504007 thin soft magnetic film combines a high magnetization with an insulating character. The film is formed by nitriding Fe-rich ferromagnetic nanograins immersed in an amorphous substrate. A selective oxidation of the amorphous substrate is then performed. |
| 03/17/2009 | US7503479 Semiconductor device and an information management system therefor |
| 03/17/2009 | US7503155 Method for packaging a tape substrate |
| 03/12/2009 | WO2009032539A2 Semiconductor assemblies and methods of manufacturing such assemblies |
| 03/12/2009 | WO2009032537A1 Semiconductor die package including stand off structures |
| 03/12/2009 | WO2009032506A2 Systems and methods for ball grid array (bga) escape routing |
| 03/12/2009 | WO2009032488A1 Improved low k porous sicoh dielectric and integration with post film formation treatment |
| 03/12/2009 | WO2009032465A2 Redistribution structures for microfeature workpieces |
| 03/12/2009 | WO2009032389A1 Method of packaging an integrated circuit die |
| 03/12/2009 | WO2009032371A1 Electrical interconnect formed by pulsed dispense |
| 03/12/2009 | WO2009032153A2 Memory device interface methods, apparatus, and systems |
| 03/12/2009 | WO2009031588A1 Circuit board, circuit module and circuit board manufacturing method |
| 03/12/2009 | WO2009031586A1 Circuit board and method for manufacturing circuit board |
| 03/12/2009 | WO2009031541A1 Device mounting module and its manufacturing method |
| 03/12/2009 | WO2009031536A1 Insulating sheet and multilayer structure |
| 03/12/2009 | WO2009031482A1 Semiconductor device and method for manufacturing the same |
| 03/12/2009 | WO2009031349A1 Semiconductor device using carbon nanotube film and process for producing the semiconductor device |
| 03/12/2009 | WO2009031342A1 Active matrix substrate, display device and method for manufacturing active matrix substrate |
| 03/12/2009 | WO2009031251A1 Wiring substrate and method for manufacturing the same |
| 03/12/2009 | WO2009031100A1 Method and device for cooling a heat generating component |
| 03/12/2009 | WO2009031057A2 Security chip |
| 03/12/2009 | WO2009030979A2 Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
| 03/12/2009 | WO2009030639A1 Circuit arrangement for protection against electrostatic charges and method for dissipation thereof |
| 03/12/2009 | WO2009030562A1 Method for the production and contacting of electronic components by means of a substrate plate, particularly a dcb ceramic substrate plate |
| 03/12/2009 | WO2009030409A2 Method for producing a solar cell |
| 03/12/2009 | WO2009030336A1 Circuit arrangement and method for the encapsulation thereof |
| 03/12/2009 | WO2009030159A1 Electrostatic discharge protection circuit and electronic product with the protection circuit |
| 03/12/2009 | WO2009030078A1 Inner lead structure of semiconductor device |
| 03/12/2009 | WO2008150596A3 Notebook computer with hybrid diamond heat spreader |
| 03/12/2009 | WO2005112533A3 Lightweight heat sink |
| 03/12/2009 | WO2005036587A3 Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator |