Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/10/2010US20100140814 Rf device and method with trench under bond pad feature
06/10/2010US20100140813 Integrated circuit packaging system and method of manufacture thereof
06/10/2010US20100140812 Semiconductor device
06/10/2010US20100140811 Semiconductor die interconnect formed by aerosol application of electrically conductive material
06/10/2010US20100140810 Chip package with coplanarity controlling feature
06/10/2010US20100140809 Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
06/10/2010US20100140808 Power Distribution In A Vertically Integrated Circuit
06/10/2010US20100140807 Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof
06/10/2010US20100140806 Method for Forming Super Contact in Semiconductor Device
06/10/2010US20100140805 Bump Structure for Stacked Dies
06/10/2010US20100140804 Dual metal interconnects for improved gap-fill, reliability, and reduced capacitance
06/10/2010US20100140803 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
06/10/2010US20100140802 Film forming method and film forming apparatus
06/10/2010US20100140801 Device
06/10/2010US20100140800 Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device
06/10/2010US20100140799 Extended Redistribution Layers Bumped Wafer
06/10/2010US20100140798 Semiconductor chip bump connection apparatus and method
06/10/2010US20100140797 Device mounting board and method of manufacturing the board, semiconductor module and method of manufacturing the module
06/10/2010US20100140796 Manufacturing method of semiconductor device, and semiconductor device
06/10/2010US20100140795 Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices
06/10/2010US20100140794 Apparatus and method for packaging circuits
06/10/2010US20100140793 Process For Manufacturing Contact Elements For Probe Card Assembles
06/10/2010US20100140792 Graphite nanoplatelets for thermal and electrical applications
06/10/2010US20100140791 Integrated circuit packaging structure and method of making the same
06/10/2010US20100140790 Chip having thermal vias and spreaders of cvd diamond
06/10/2010US20100140789 Integrated circuit packaging system with exposed terminal interconnects and method of manufacture thereof
06/10/2010US20100140788 Manufacturing fan-out wafer level packaging
06/10/2010US20100140787 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
06/10/2010US20100140786 Semiconductor power module package having external bonding area
06/10/2010US20100140785 Semiconductor device
06/10/2010US20100140784 Accessing or interconnecting integrated circuits
06/10/2010US20100140783 Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices
06/10/2010US20100140782 Printed circuit board having built-in integrated circuit package and fabrication method therefor
06/10/2010US20100140781 Quad flat non-leaded package and manufacturing method thereof
06/10/2010US20100140780 Semiconductor Device and Method of Forming an IPD Beneath a Semiconductor Die with Direct Connection to External Devices
06/10/2010US20100140779 Semiconductor Package with Semiconductor Core Structure and Method of Forming Same
06/10/2010US20100140778 Package, method of manufacturing the same and use thereof
06/10/2010US20100140777 Stacked ball grid array package module utilizing one or more interposer layers
06/10/2010US20100140776 Triaxial through-chip connecton
06/10/2010US20100140775 Semiconductor device and method for manufacturing the same
06/10/2010US20100140774 Method of producing external pads on a semiconductor device, and semiconductor device
06/10/2010US20100140773 Stacked chip, micro-layered lead frame semiconductor package
06/10/2010US20100140772 Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound
06/10/2010US20100140771 Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant
06/10/2010US20100140770 Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof
06/10/2010US20100140769 Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof
06/10/2010US20100140768 Systems and processes for forming three-dimensional circuits
06/10/2010US20100140767 Component Stacking Using Pre-Formed Adhesive Films
06/10/2010US20100140766 Large die package structures and fabrication method therefor
06/10/2010US20100140765 Leadless integrated circuit packaging system and method of manufacture thereof
06/10/2010US20100140764 Wire-on-lead package system and method of manufacture thereof
06/10/2010US20100140763 Integrated circuit packaging system with stacked paddle and method of manufacture thereof
06/10/2010US20100140762 Interconnection of lead frame to die utilizing flip chip process
06/10/2010US20100140761 Quad Flat Package
06/10/2010US20100140760 Alpha shielding techniques and configurations
06/10/2010US20100140759 Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die after Forming a Build-Up Interconnect Structure
06/10/2010US20100140758 Integrated Circuit with Improved Transmission Line Structure and Electromagnetic Shielding Between Radio Frequency Circuit Paths
06/10/2010US20100140757 Semiconductor package having an antenna with reduced area and method for fabricating the same
06/10/2010US20100140755 Rare-earth oxides, rare-earth nitrides, rare-earth phosphides and ternary alloys
06/10/2010US20100140753 Stacked Semiconductor Component Having Through Wire Interconnect And Method Of Fabrication
06/10/2010US20100140752 Semiconductor Device and Method of Forming Compliant Polymer Layer Between UBM and Conformal Dielectric Layer/RDL for Stress Relief
06/10/2010US20100140751 Semiconductor Device and Method of Forming a Conductive Via-in-Via Structure
06/10/2010US20100140750 Parallel Plane Memory and Processor Coupling in a 3-D Micro-Architectural System
06/10/2010US20100140749 Semiconductor device
06/10/2010US20100140748 Integrated circuits on a wafer and methods for manufacturing integrated circuits
06/10/2010US20100140747 Semiconductor devices
06/10/2010US20100140737 Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures
06/10/2010US20100140665 Gallium Nitride Material Devices and Thermal Designs Thereof
06/10/2010US20100140627 Package for Semiconductor Devices
06/10/2010US20100140617 Semiconductor device manufacturing method and semiconductor device
06/10/2010US20100140616 Electronic device and method for manufacturing the same
06/10/2010US20100140615 Active device array substrate
06/10/2010US20100140581 Bottom electrode for memory device and method of forming the same
06/10/2010US20100140235 Laser system for processing a memory link with a set of at least two laser pulses
06/10/2010US20100139997 Electrical apparatus, cooling system therefor, and electric vehicle
06/10/2010US20100139970 Wiring board having lead pin, and lead pin
06/10/2010US20100139904 Heat sink and method of producing the same
06/10/2010US20100139767 Chip package structure and method of fabricating the same
06/10/2010DE112008001916T5 Belastungsmechanismus für eine Fassung mit Kontaktgitteranordnung (LGA-Land Grid Array) für mobile Plattformen Loading mechanism for a version with ball grid array (LGA Land Grid Array) for mobile platforms
06/10/2010DE112008001657T5 Integriertes Leistungsbauelementgehäuse und Modul mit zweiseitiger Kühlung und Verfahren zur Herstellung Integrated power device and the housing module with two-sided cooling and processes for preparing
06/10/2010DE10254617B4 Gatekommutierte Halbleitervorrichtungen Gatekommutierte semiconductor devices
06/10/2010DE102008063407A1 Eine optoelektronische oberflächenmontierte Vorrichtung und ein Verfahren zum Bilden einer optoelektronischen oberflächenmontierten Vorrichtung A surface-mounted opto-electronic device and a method for forming a surface-mounted optoelectronic device
06/10/2010DE102008059856A1 Laminar high temperature pressure sensor for determination of pressure distribution in sensor surface, has upper surface layer, lower surface layer and optical fiber
06/10/2010DE102008059504A1 Eingebaute Nachgiebigkeit in Strukturen zum Testen von Leckströmen und dielektrischen Durchschlag dielektrischer Materialien von Metallisierungssystemen von Halbleiterbauelementen Built-compliance in structures for testing of leakage currents and dielectric breakdown of dielectric materials of metallization of semiconductor devices
06/10/2010CA2745075A1 Uv-curable inorganic-organic hybrid resin and method for preparation thereof
06/09/2010EP2194766A1 Ceramic multilayer substrate
06/09/2010EP2194577A1 Power semiconductor module
06/09/2010EP2194574A2 Method for producing interconnect structures for integrated circuits
06/09/2010EP2194572A1 Electronic component part device
06/09/2010EP2194488A1 Data carrier with electric destruction device
06/09/2010EP2194440A2 Method and device for cooling computer components which generate heat
06/09/2010EP2194151A1 Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
06/09/2010EP2193581A1 Spectrally tunable laser module
06/09/2010EP2193548A2 Method for producing a solar cell
06/09/2010EP2193544A1 Device for cooling electronic components
06/09/2010EP2193543A1 Electrical device, method and use
06/09/2010EP2193542A2 Wafer level packaged mems device
06/09/2010EP2193539A1 Carrier chip with cavity
06/09/2010CN201504362U Ceramic matrix circuit assembly
06/09/2010CN201503871U High power LED structure with rapid heat dissipation
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