Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/16/2010CN101192567B Method and apparatus for forming metal wiring in semiconductor device
06/16/2010CN101192533B Semiconductor device and manufacturing method thereof, and etch stop layer forming method
06/16/2010CN101180727B Printed wiring board and manufacturing method thereof
06/16/2010CN101150121B Flexible circuits having improved reliability and thermal dissipation
06/16/2010CN101124674B Electronic component module
06/16/2010CN101114632B Semiconductor device and method for improving horizontal carrier capability
06/16/2010CN101114623B Packaging module and electronic device
06/16/2010CN101112134B Packaging installation module
06/16/2010CN101091245B Layer between interfaces of different components in semiconductor devices and method for preparing the same, semiconductor device having the layer and manufacturing method thereof
06/16/2010CN101091001B Method for forming tantalum nitride film
06/16/2010CN101083251B Semiconductor device
06/16/2010CN101065415B Curable diamantane compound
06/16/2010CN101060116B LDD package
06/16/2010CN101043021B Semiconductor device having wirings formed by damascene and its manufacture method
06/16/2010CN101040162B Vapor chamber with boiling-enhanced multi-wick structure
06/16/2010CN101038899B Heat sink mounting device and mounting method, and server blade using the same
06/16/2010CN101032023B 半导体装置 Semiconductor device
06/16/2010CN101017808B Semiconductor device and method for manufacturing same
06/16/2010CN101009333B Semiconductor device
06/16/2010CA2688618A1 Method for encapsulating an electronic arrangement
06/15/2010US7739624 Methods and apparatuses to generate a shielding mesh for integrated circuit devices
06/15/2010US7738568 Multiplexed RF isolator
06/15/2010US7738258 Semiconductor mounting board
06/15/2010US7738256 Multilayer substrate including components therein
06/15/2010US7738250 Water-cooling radiator for a computer chip
06/15/2010US7738248 Electronic device, loop heat pipe and cooling device
06/15/2010US7737710 Socket, and test apparatus and method using the socket
06/15/2010US7737567 Method and apparatus for wafer marking
06/15/2010US7737566 Alignment devices and methods for providing phase depth control
06/15/2010US7737565 Stackable semiconductor package and method for its fabrication
06/15/2010US7737564 Power configuration method for structured ASICs
06/15/2010US7737563 Semiconductor chip with reinforcement structure
06/15/2010US7737562 Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode
06/15/2010US7737561 Dual damascene integration of ultra low dielectric constant porous materials
06/15/2010US7737560 Metallization layer for a power semiconductor device
06/15/2010US7737559 Semiconductor constructions
06/15/2010US7737558 Semiconductor device with a high-frequency interconnect
06/15/2010US7737557 Semiconductor apparatus
06/15/2010US7737556 Encapsulated damascene with improved overlayer adhesion
06/15/2010US7737555 Semiconductor method having silicon-diffused metal wiring layer
06/15/2010US7737554 Pitch by splitting bottom metallization layer
06/15/2010US7737553 Semiconductor device
06/15/2010US7737552 Device having a bonding structure for two elements
06/15/2010US7737551 Semiconductor power module with SiC power diodes and method for its production
06/15/2010US7737549 Circuit module with thermal casing systems
06/15/2010US7737548 Semiconductor die package including heat sinks
06/15/2010US7737547 Dummy buried contacts and vias for improving contact via resistance in a semiconductor device
06/15/2010US7737546 Surface mountable semiconductor package with solder bonding features
06/15/2010US7737545 Multi-surface IC packaging structures and methods for their manufacture
06/15/2010US7737543 Semiconductor device and method of manufacturing the same
06/15/2010US7737542 Stackable semiconductor package
06/15/2010US7737541 Semiconductor chip package structure
06/15/2010US7737540 Stacked semiconductor devices and signal distribution methods thereof
06/15/2010US7737539 Integrated circuit package system including honeycomb molding
06/15/2010US7737538 Semiconductor package
06/15/2010US7737537 Electronic device
06/15/2010US7737536 Capacitive techniques to reduce noise in high speed interconnections
06/15/2010US7737535 Total ionizing dose suppression transistor architecture
06/15/2010US7737525 Method for producing low-K CDO films
06/15/2010US7737524 Lateral thin-film SOI device having a field plate with isolated metallic regions
06/15/2010US7737505 Semiconductor device and method of forming the same
06/15/2010US7737500 CMOS diodes with dual gate conductors, and methods for forming the same
06/15/2010US7737474 Semiconductor device with seal ring having protruding portions
06/15/2010US7737473 Integrated circuit device and method for forming the same
06/15/2010US7737470 High-frequency diode
06/15/2010US7737463 Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die
06/15/2010US7737440 Test structure for charged particle beam inspection and method for fabricating the same
06/15/2010US7737439 Semiconductor component having test pads and method and apparatus for testing same
06/15/2010US7737428 Memory component with memory cells having changeable resistance and fabrication method therefor
06/15/2010US7737369 Semiconductor module
06/15/2010US7737052 Advanced multilayer dielectric cap with improved mechanical and electrical properties
06/15/2010US7737027 Method of manufacturing a semiconductor device
06/15/2010US7737025 Via including multiple electrical paths
06/15/2010US7737023 Method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit device
06/15/2010US7737017 Semiconductor device having recess gate and isolation structure and method for fabricating the same
06/15/2010US7736946 System and method for sealing a MEMS device
06/15/2010US7736944 Semiconductor device with improved design freedom of external terminal
06/15/2010US7736916 System and apparatus for using test structures inside of a chip during the fabrication of the chip
06/15/2010US7736844 photoresists; photomasks; photolithography; vapor deposition; semiconductors
06/15/2010US7736693 applying an emulsion onto a surface of substrate, drying to remove the liquid carrier containing water and solvent such as methanol, metal alloy (Al leached alloy) nano-particles, sintering at low temperature to form a transparent and electroconductive coating in the form of a network-like pattern
06/15/2010US7736573 Thermoplastic material
06/10/2010WO2010065831A1 Multi-thickness semiconductor with fully depleted devices and photonic integration
06/10/2010WO2010065564A1 Environmental barrier coating for organic semiconductor devices and methods thereof
06/10/2010WO2010064732A1 Semiconductor integrated circuit device and method for producing the same
06/10/2010WO2010064346A1 Semiconductor device and method for manufacturing same
06/10/2010WO2010064341A1 Semiconductor device having chip
06/10/2010WO2010064240A1 Uv-curable inorganic-organic hybrid resin and method for preparation thereof
06/10/2010WO2010038186A3 Lead-free solder bump
06/10/2010WO2010037474A3 A semiconductor device comprising an in-chip active heat transfer system
06/10/2010WO2010033902A3 Method and apparatus for attaching chip to a textile
06/10/2010WO2010030968A3 Method and apparatus for enhancing the triggering of an electrostatic discharge protection device
06/10/2010WO2010026486A3 Heat pipe and electronic device
06/10/2010US20100146641 Method and device for protection of an mram device against tampering
06/10/2010US20100143619 Thermal Conduction Principle And Device For Intercrossed Structure Having Different Thermal Characteristics
06/10/2010US20100142174 Integrated circuit packaging system and method of manufacture thereof
06/10/2010US20100142169 Electronic device and process for manufacturing electronic device
06/10/2010US20100142155 Preferentially Cooled Electronic Device
06/10/2010US20100141229 Semiconductor Device
06/10/2010US20100140816 Method of forming a marker, substrate having a marker and device manufacturing method
06/10/2010US20100140815 Semiconductor device and method of forming an interconnect structure for 3-d devices using encapsulant for structural support
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