Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2010
06/16/2010CN101740563A Multi-functional chip
06/16/2010CN101740562A Heat spreader structures in scribe lines
06/16/2010CN101740561A Organic electroluminescent display device and method and apparatus of manufacturing the same
06/16/2010CN101740558A Light-emitting element head, light-emitting element chip, image forming apparatus and signal supply method
06/16/2010CN101740556A Hybrid microwave integrated circuit
06/16/2010CN101740553A cooling channels in 3dic stacks
06/16/2010CN101740552A Multi-chip packaging structure and manufacturing method thereof
06/16/2010CN101740551A Laminated die package structure for semiconductor element and method thereof
06/16/2010CN101740550A Shielded electronic components and method of manufacturing the same
06/16/2010CN101740549A Test structure and test method for precisely evaluating reliability performance of gate oxide
06/16/2010CN101740548A A semiconductor device and method for manufacturing thesame
06/16/2010CN101740547A Semiconductor device and method of manufacturing semiconductor device
06/16/2010CN101740546A Deposition structure of metallic layer for improving electric migration performance of aluminum and copper and method for manufacturing same
06/16/2010CN101740545A Wiring structure of semiconductor device and method of forming a wiring structure
06/16/2010CN101740544A Semiconductor test pad structures
06/16/2010CN101740543A Fuse structure for intergrated circuit devices
06/16/2010CN101740542A Welded structure of surface mount technology for ball grid array
06/16/2010CN101740541A Lead frame
06/16/2010CN101740540A Interconnecting structure of lead frame and interconnecting method thereof
06/16/2010CN101740539A Square planar pin-free encapsulating unit and manufacturing method and lead frame thereof
06/16/2010CN101740538A Printed circuit board having flow preventing dam and manufacturing method thereof
06/16/2010CN101740537A Semiconductor device and method of modifying an integrated circuit
06/16/2010CN101740536A 半导体封装 The semiconductor package
06/16/2010CN101740535A Open type ball grid array substrate and packaging structure thereof
06/16/2010CN101740534A Pin and substrate combined semiconductor package and manufacturing method thereof
06/16/2010CN101740533A 集成电路 IC
06/16/2010CN101740532A Double solid metal pad with reduced area
06/16/2010CN101740531A Power semiconductor module with prestressed auxiliary contact spring
06/16/2010CN101740530A 集成电路基底 IC substrate
06/16/2010CN101740529A Heat radiation material, electronic device and method of manufacturing electronic device
06/16/2010CN101740528A Radiating-enhanced outer pin-free semiconductor packaging structure and combination thereof
06/16/2010CN101740527A Chip packaging structure and manufacture method thereof
06/16/2010CN101740526A Moisture-proof semiconductor module with centering device
06/16/2010CN101740525A Encapsulation structure for wafer backside
06/16/2010CN101740504A Display and manufacturing method thereof
06/16/2010CN101740498A Semiconductor device with contact etching stop layer and forming method thereof
06/16/2010CN101740496A Method for improving CIS imaging quality by air ring
06/16/2010CN101740490A Semiconductor apparatus manufacturing method and semiconductor apparatus
06/16/2010CN101740489A A metal line of semiconductor device and method of forming the same
06/16/2010CN101740475A Semiconductor device with dual-mosaic structure and forming method thereof
06/16/2010CN101740474A Method for manufacturing semiconductor device and dual-damascene structure
06/16/2010CN101740473A Interlayer dielectric layer, interconnection structure and manufacturing method thereof
06/16/2010CN101740472A Method for manufacturing semiconductor device with copper wiring and semiconductor device
06/16/2010CN101740470A Method for forming contact hole and semiconductor device
06/16/2010CN101740468A Secondarily etched deep groove contact hole and etching method
06/16/2010CN101740424A Manufacturing process for a chip package structure
06/16/2010CN101740423A Soldering-pad and forming method thereof
06/16/2010CN101740421A Wafer and manufacturing method, system-level package structure and package method thereof
06/16/2010CN101740417A Method for producing stackable dies
06/16/2010CN101740416A Quad flat no-lead encapsulation structure and encapsulation method thereof
06/16/2010CN101740415A Integrated circuit structure and method of forming the same
06/16/2010CN101740409A Method for welding lead of diode and diode
06/16/2010CN101740408A Windowing-type semiconductor packaging member and manufacture method thereof
06/16/2010CN101740404A Structure of semiconductor packaging piece and manufacture method thereof
06/16/2010CN101740323A Method for manufacturing alignment mark of semiconductor silicon wafer and semiconductor silicon wafer thereby
06/16/2010CN101738807A Thin film transistor array substrate and liquid crystal display device thereof
06/16/2010CN101738806A Array backboard, probe used for testing array backboard and liquid crystal display panel
06/16/2010CN101738805A Pixel structure
06/16/2010CN101738804A Pixel structure
06/16/2010CN101737758A Sealed internal-circulation-forced LED (light-emitting diode) lamp
06/16/2010CN101737755A Cooling device for lighting emitting device package of vibration generating machine and head lamp for vibration generating machine
06/16/2010CN101737754A Light source module and projector using same
06/16/2010CN101737753A Electronic assembly and backlight module
06/16/2010CN101737752A Light-emitting diode light source module and optical engine thereof
06/16/2010CN101737751A High-efficiency radiating LED street lamp
06/16/2010CN101737750A Composite heat sink of electrical circuit
06/16/2010CN101737738A Light-emitting diode lamp
06/16/2010CN101737640A Low-power illuminating system
06/16/2010CN101733222A Temperature control method of glue dispenser
06/16/2010CN101483209B Conductive wire rack
06/16/2010CN101459089B Transistor encapsulation method and construction, jumper wire board for tester table
06/16/2010CN101452934B On-die terminators formed of coarse and fine resistors
06/16/2010CN101447462B 半导体装置 Semiconductor device
06/16/2010CN101409284B Semiconductor device
06/16/2010CN101383330B Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads
06/16/2010CN101383294B Method for making a direct chip attach device and structure
06/16/2010CN101359669B TFT LCD array substrate construction and manufacturing method thereof
06/16/2010CN101330077B Stacked semiconductor package and method for manufacturing the same
06/16/2010CN101330076B Through silicon channel chip stack package
06/16/2010CN101320720B 半导体装置 Semiconductor device
06/16/2010CN101312196B Semiconductor device and its manufacture method
06/16/2010CN101308832B Lead frame for leadless encapsulation, encapsulation construction and manufacture method thereof
06/16/2010CN101304031B Ciucuit structure and manufacturing method thereof
06/16/2010CN101281904B Semiconductor module for inverter circuit
06/16/2010CN101281893B Semiconductor device
06/16/2010CN101266965B Overlapping structure for semiconductor encapsulation body and its making method
06/16/2010CN101261982B LED encapsulation structure and its making method
06/16/2010CN101257008B Semiconductor device
06/16/2010CN101257001B Semiconductor device and method for fabricating the same
06/16/2010CN101256998B Semiconductor device using anisotropic conductive adhesive layer and manufacturing method thereof
06/16/2010CN101256978B Method for making electronic fuses and semiconductor structure
06/16/2010CN101246892B Active matrix substrate and display device
06/16/2010CN101241903B Semiconductor device having wiring board
06/16/2010CN101238575B Heat radiator and its making method
06/16/2010CN101232003B Chip safety wire and method for making the same
06/16/2010CN101217152B Pixel structure and its making method
06/16/2010CN101211859B Method of fabricating flash memory device
06/16/2010CN101207099B Structure of dielectric layers in built-up layers of wafer level package
06/16/2010CN101203089B Multilayer printed circuit board
06/16/2010CN101197381B Display apparatus and electronic apparatus
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