Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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04/03/1984 | CA1165013A1 Semiconductor passivation method |
04/03/1984 | CA1165011A1 Semiconductor embedded layer technology including permeable base transistor, fabrication method and integrated circuits |
04/03/1984 | CA1164961A1 Transistor protection circuit |
03/29/1984 | WO1984001240A1 Feedthrough structure for three dimensional microelectronic devices |
03/28/1984 | EP0104079A2 Integrated circuit contact structure |
03/28/1984 | EP0104051A2 Noise protection for a packaged semiconductor device |
03/28/1984 | EP0103888A2 Method and device to protect film-mounted integrated circuits (micropacks) against disturbance by electrostatic charges |
03/28/1984 | EP0103879A1 Method of manufacturing a monolithic integrated circuit |
03/28/1984 | EP0103855A2 Process for integrated circuit metallization with low via resistance |
03/28/1984 | EP0103748A2 Combined circuit with varistor |
03/28/1984 | EP0103690A1 Method of making an insulating layer between metallisation layers of integrated semiconductor circuits |
03/27/1984 | US4439841 Semiconductor memory devices |
03/27/1984 | US4439468 Platinum coated silver powder |
03/27/1984 | US4439247 Method for manufacture of high-strength high-electroconductivity copper alloy |
03/27/1984 | US4438847 Film carrier for an electrical conductive pattern |
03/27/1984 | EP0042417A4 Fabrication of circuit packages. |
03/21/1984 | EP0103362A2 Semiconductor device with power lines |
03/21/1984 | EP0103306A2 Semiconductor protective device |
03/21/1984 | EP0103300A2 Encapsulation of electronic components with calcium silicate-containing poly(arylene sulfide) compositions |
03/21/1984 | EP0103068A2 Cooling device for a plurality of integrated components assembled as a flat structure |
03/21/1984 | EP0103067A2 Cooling device for a plurality of integrated components assembled as a flat structure |
03/21/1984 | EP0103025A1 Pb ALLOY SOLDER FOR SEMICONDUCTOR DEVICE |
03/21/1984 | EP0102988A1 Integrated circuit lead frame. |
03/20/1984 | US4438450 Solid state device with conductors having chain-shaped grain structure |
03/20/1984 | US4438347 Device for changing the electrical circuit configuration of integrated semiconductor circuits |
03/20/1984 | US4438181 A metallic tape for thermocompression bonding to electronic compon |
03/20/1984 | US4437969 Offset-gate chemical-sensitive field-effect transistors (OG-CHEMFETS) with electrolytically-programmable selectivity |
03/20/1984 | US4437235 Integrated circuit package |
03/20/1984 | US4437229 Methods of marking and electrically identifying an article |
03/20/1984 | US4437228 Method of mounting a silicon pellet on a ceramic substrate |
03/14/1984 | EP0102795A1 A method of manufacturing a semiconductor device using the master slice technique |
03/14/1984 | EP0102644A2 Semiconductor integrated circuit device |
03/14/1984 | EP0102525A2 Alpha-particle protection in integrated circuit packages |
03/13/1984 | US4437141 High terminal count integrated circuit device package |
03/13/1984 | US4437109 Silicon-on-sapphire body with conductive paths therethrough |
03/13/1984 | US4437108 Double polysilicon contact structure |
03/13/1984 | US4437077 Semiconductor device usable at very high frequencies and its production process |
03/13/1984 | US4436951 Semiconductor power module |
03/13/1984 | US4436766 Photoresists, sputtering, etching |
03/13/1984 | US4436583 Selective etching method of polyimide type resin film |
03/13/1984 | US4436582 Multilevel metallization process for integrated circuits |
03/13/1984 | CA1163742A1 Precursor solutions of silicone copolymer materials made from a siloxane containing a bis-amino aryl ether of a bis-amino thio ether in dialkyl ethers of condensed polyethlene glycols |
03/13/1984 | CA1163714A1 One device field effect transistor (fet) ac stable random access memory (ram) array |
03/07/1984 | EP0102185A1 Transparent container for electrostatic sensitive electronic components |
03/07/1984 | EP0102075A2 Semiconductor device with a multilayer structure |
03/07/1984 | EP0102058A2 Semiconductor component with pressure contact |
03/07/1984 | EP0102041A2 Electrical component with at least one connection lead |
03/07/1984 | EP0101791A2 Multi-layer circuitry |
03/07/1984 | EP0101762A1 Process for the thermomigration of liquid phases, and apparatus for carrying out this process |
03/07/1984 | EP0015997B1 Device for cooling dissipation heat producing electric and/or electronic elements |
03/06/1984 | US4435740 Electric circuit packaging member |
03/06/1984 | US4435724 Single piece carrier for integrated circuit devices |
03/06/1984 | US4435480 Integrated circuits, cutting tools |
03/06/1984 | CA1188008A2 Thin film transistor |
03/06/1984 | CA1163378A1 Underpass in a semiconductor device |
03/06/1984 | CA1163377A2 Thin film transistor |
03/01/1984 | WO1984000851A1 Electrical circuit units |
02/29/1984 | EP0101592A2 Gold wire for semiconductor components |
02/28/1984 | US4434434 Solder mound formation on substrates |
02/28/1984 | US4434361 Transistor integrated circuit protected against the analysis, and a card comprising such a circuit |
02/28/1984 | US4434134 Pinned ceramic substrate |
02/28/1984 | US4433886 Connector mounting for integrated circuit chip packages |
02/28/1984 | CA1162797A1 Semiconductor device and method for producing same |
02/22/1984 | EP0101374A2 Semiconductor laser substrate and process for its production |
02/22/1984 | EP0101335A1 Encapsulating microhousing for very high frequency logic integrated circuits |
02/22/1984 | EP0101299A1 Corrosion resistant aluminum electronic material |
02/22/1984 | EP0100913A1 Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane |
02/22/1984 | EP0100897A2 Method for contacting a pn junction region |
02/22/1984 | EP0100837A2 Method of producing encapsulated semiconductor components |
02/22/1984 | EP0100817A2 A hermetically sealed casing of an electrical device and process of manufacturing |
02/21/1984 | US4433004 Semiconductor device and a method for manufacturing the same |
02/21/1984 | CA1162657A1 Method of fabricating a diode bridge rectifier in monolithic integrated circuit structure |
02/21/1984 | CA1162656A1 Monolithic integrated circuit structure incorporating diode bridge rectifier |
02/21/1984 | CA1162599A1 Four terminal pulse supressor |
02/21/1984 | CA1162392A1 I.c. chip mounting assembly and a method of manufacturing such assembly |
02/16/1984 | WO1984000641A1 Thyristor and method of fabrication thereof |
02/15/1984 | EP0100727A2 Semiconductor device comprising a ceramic base |
02/15/1984 | EP0100626A2 Semi-conductor assembly |
02/15/1984 | EP0100571A2 Low resistance buried power bus for integrated circuits |
02/15/1984 | EP0100454A1 Semiconductor device having a conductive layer consisting of a high-melting point metal silicide and a method for manufacturing such a semiconductor device |
02/14/1984 | US4432008 Gold-doped IC resistor region |
02/14/1984 | US4432006 Semiconductor memory device |
02/14/1984 | US4431764 Antistatic transparent coating composition |
02/14/1984 | US4430793 Method of manufacturing a semiconductor device utilizing selective introduction of a dopant thru a deposited semiconductor contact layer |
02/14/1984 | CA1162327A2 Diode and eeprom device using same |
02/09/1984 | EP0077813A4 Low resistivity composite metallization for semiconductor devices and method therefor. |
02/08/1984 | EP0100261A1 Natural convection cooling device for electronic or electrical and electronic components, and apparatus using it |
02/08/1984 | EP0100232A2 Substrate for semiconductor apparatus |
02/08/1984 | EP0100166A2 Semiconductor device including a connection structure |
02/08/1984 | EP0100100A2 Semiconductor device with an improved bonding section |
02/07/1984 | US4430664 Glass-moulded type semiconductor device |
02/07/1984 | US4430623 Monolithic amplifier comprising a power division and recombination system grouping a plurality of transistors |
02/07/1984 | US4430376 Glass-to-metal compression sealed lead-in structure |
02/07/1984 | US4430365 Ceramics, integrated circuits, semiconductors, masking, etching, dielectrics |
02/07/1984 | US4430298 Nickel, silicon, manganese, zinc, hot working, cooling, cold working, annealing |
02/07/1984 | US4429453 Process of manufacture of a high power semiconductor device |
02/07/1984 | CA1161970A2 Diode and rom device using same |
02/07/1984 | CA1161967A1 Process for the preparation of large area tft arrays |
02/07/1984 | CA1161958A1 Low resistance line |
02/07/1984 | CA1161911A1 High voltage, high frequency amplifier |