Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1984
06/05/1984US4453175 Semiconductor device
06/05/1984US4451973 Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
06/05/1984US4451972 Vapor deposition of multilayers of metals
06/05/1984CA1168764A1 Encapsulation for semiconductor integrated circuit chip
05/1984
05/30/1984EP0109899A1 Pre-adapted module for a hyperfrequency diode with a high thermal dissipation
05/30/1984EP0109887A1 Hyperfrequency diode structure having its external connections attached to two metallic beam leads
05/30/1984EP0109834A1 Immersion cooled high density electronic assembly
05/30/1984EP0109766A1 Semiconductor device with a passivated junction
05/29/1984US4451904 Semiconductor memory device
05/29/1984US4451845 Lead frame device including ceramic encapsulated capacitor and IC chip
05/29/1984US4451841 Semiconductor device with multi-layered electrodes
05/29/1984US4451738 Microcircuit fabrication
05/29/1984US4451540 Brazing, prevention of flashing
05/24/1984WO1984002036A1 Semiconductor device
05/23/1984EP0108910A2 Method of forming a passivated compound semiconductor substrate
05/23/1984EP0108897A1 Method for removing extraneous metal from ceramic substrates
05/23/1984EP0108893A2 A method for recognizing a pellet pattern
05/22/1984US4450505 Apparatus for cooling integrated circuit chips
05/22/1984US4450472 Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
05/22/1984US4450471 Semi-conductor power device assembly and method of manufacture thereof
05/22/1984US4450208 Composite article for a semiconductor device
05/22/1984US4449580 Vertical wall elevated pressure heat dissipation system
05/22/1984US4449578 Device for releasing heat
05/22/1984US4449292 Method of clamping a circuit package to enhance heat transfer
05/22/1984CA1167908A1 High powered over-voltage protection
05/16/1984EP0108646A2 Plastic encapsulated semiconductor power device means and method
05/16/1984EP0108502A2 A plastics moulded semiconductor device and a method of producing it
05/16/1984EP0108494A2 Selective plating
05/16/1984EP0108251A2 A semiconductor device comprising an electrode and/or an interconnection
05/16/1984EP0108189A2 A method for etching polyimides
05/16/1984EP0108098A1 Device for the protection of an electronic device against voltages generated by an electromagnetic field
05/15/1984US4448400 Highly scalable dynamic RAM cell with self-signal amplification
05/15/1984US4448306 Integrated circuit chip carrier
05/15/1984US4448240 Telescoping thermal conduction element for cooling semiconductor devices
05/15/1984CA1167571A1 Integrated circuit package
05/09/1984EP0107931A2 Selective plating
05/09/1984EP0107906A1 Socket for integrated circuit
05/09/1984EP0107821A1 Method of producing a silicon carbide body
05/09/1984EP0107701A1 Improved bonding means and methods for polymer coated devices
05/08/1984US4447857 Substrate with multiple type connections
05/08/1984US4447842 Finned heat exchangers for electronic chips and cooling assembly
05/08/1984US4447824 Planar multi-level metal process with built-in etch stop
05/08/1984US4447716 Information card
05/08/1984US4446916 Heat-absorbing heat sink
05/08/1984US4446613 Integrated circuit resistor and method of fabrication
05/02/1984EP0107417A2 Selective plating
05/02/1984EP0107363A2 Method of producing anisotropically-conducting layers
05/02/1984EP0107259A2 Method of fabricating a semiconductor device in which a layer is evaporatively deposited on a semiconductor body
05/02/1984EP0107071A2 Method of manufacturing semiconductor chip film carriers
05/02/1984EP0107061A2 Information card and method for its manufacture
05/01/1984US4446504 Mounting means with solderable studs
05/01/1984US4446478 Assembly in a single case of a main power-switching semiconductor component and a destorage diode
05/01/1984US4446477 Multichip thin film module
05/01/1984US4446476 Refractory metal silicide layer beneath field isolation region and in contact with doped electroconductivity layer
05/01/1984US4446475 Means and method for disabling access to a memory
05/01/1984US4446194 Plasma assisted vapor deposition
05/01/1984US4445992 Plating apparatus
05/01/1984US4445968 Removal of silicaceous binder
05/01/1984US4445274 Method of manufacturing a ceramic structural body
05/01/1984US4445271 Ceramic chip carrier with removable lead frame support and preforated ground pad
05/01/1984CA1166763A1 Method for forming a planarized integrated circuit
05/01/1984CA1166759A1 High speed machine for the physical design of very large scale integrated circuits
04/1984
04/27/1984EP0034166A4 Semiconductor embedded layer technology.
04/26/1984WO1984001666A1 Microcircuit package and sealing method
04/25/1984EP0106660A2 Master slice semiconductor device
04/25/1984EP0105999A1 Capacitor and method for its fabrication
04/25/1984EP0105915A1 Semiconductor integrated circuit structures having insulated conductors
04/24/1984US4444309 Carrier for a leadless integrated circuit chip
04/24/1984CA1166327A1 Hybrid circuit connector
04/18/1984EP0105628A1 Electrical connector for an electronic package
04/18/1984EP0105451A2 Laser printable polyarylene sulfide compositions
04/18/1984EP0105384A1 Conductive thermoplastic resin foam and process for its production
04/18/1984EP0105324A1 OHMIC CONTACT FOR N-TYPE GaAs
04/17/1984US4443812 High-breakdown-voltage semiconductor device
04/17/1984US4443704 Method of electron beam exposure
04/17/1984US4443571 Pigment mixed with polyarylene sulfide
04/17/1984US4442967 Method of providing raised electrical contacts on electronic microcircuits
04/17/1984US4442966 Semiconductors, metals, contactors, pads, pastes, compression, polymerization
04/12/1984WO1984001471A1 An aluminum-metal silicide interconnect structure for integrated circuits and method of manufacture thereof
04/12/1984WO1984001470A1 Leadless chip carrier for logic components
04/11/1984EP0105189A1 Method of producing metal electrodes of diversing thiekness for semiconductor devices, especially for power semiconductor devices such as thyristors
04/11/1984EP0105060A1 Electronic assembly with forced convection cooling
04/10/1984US4442450 Cooling element for solder bonded semiconductor devices
04/10/1984US4442449 Binary germanium-silicon interconnect and electrode structure for integrated circuits
04/10/1984US4442137 Maskless coating of metallurgical features of a dielectric substrate
04/10/1984US4441247 Metal-oxide-semiconductor integrated corcuits
04/10/1984CA1165468A1 Solder mound formation on substrates
04/10/1984CA1165465A1 Over/under dual in-line chip package
04/10/1984CA1165459A1 Ceramic substrate for fine-line electrical circuitry and method of manufacture
04/10/1984CA1165072A1 Encapsulation of electronic components with a thermosetting moldable prepolymer
04/04/1984EP0105003A1 Method of screening resin-sealed semiconductor devices
04/04/1984EP0104615A2 Semiconductor memory cell
04/04/1984EP0104231A1 A self-positioning heat spreader
04/03/1984US4441167 Reprogrammable read only memory
04/03/1984US4441150 High-voltage rectifier unit
04/03/1984US4441118 Coating with tin alloys
04/03/1984US4441075 Circuit arrangement which permits the testing of each individual chip and interchip connection in a high density packaging structure having a plurality of interconnected chips, without any physical disconnection
04/03/1984US4440883 Electrically insulating encapsulation composition for semiconductor arrangements
04/03/1984US4440828 Substrate for a microwave electronic circuit and a method for the making of said substrate
04/03/1984US4439918 Methods of packaging an electronic device
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