| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/02/1984 | WO1984000444A1 Lead frame and method |
| 02/01/1984 | EP0099570A2 Coated ceramic substrates for mounting integrated circuits and methods of coating such substrates |
| 02/01/1984 | EP0099544A1 Method for forming conductive lines and via studs on LSI carrier substrates |
| 01/31/1984 | US4428633 Dual-in-line socket assembly |
| 01/31/1984 | CA1161558A1 Portable, identifying element constructed as a lamination of sheets |
| 01/25/1984 | EP0099258A2 Substrates for electronic devices |
| 01/25/1984 | EP0099092A1 Series-parallel flow cooling apparatus |
| 01/25/1984 | EP0098932A2 Repairable multi-level system for semiconductor device |
| 01/24/1984 | USRE31506 Method of manufacturing oxide isolated semiconductor device utilizing selective etching technique |
| 01/24/1984 | US4428066 Semiconductor read only memory |
| 01/24/1984 | US4427993 Thermal stress relieving bimetallic plate |
| 01/24/1984 | US4427992 Method for incorporating a desiccant in a semiconductor package |
| 01/24/1984 | US4427991 High frequency semiconductor device |
| 01/24/1984 | US4427715 Method of forming expanded pad structure |
| 01/24/1984 | US4427612 Method for sealing an electrical component, particularly a relay |
| 01/24/1984 | US4426773 Array of electronic packaging substrates |
| 01/24/1984 | US4426769 Moisture getter for integrated circuit packages |
| 01/19/1984 | WO1984000252A1 Power bus routing for gate arrays |
| 01/18/1984 | EP0098737A2 Semiconductor device |
| 01/18/1984 | EP0098294A1 Holding device for an integrated circuit chip |
| 01/17/1984 | US4426689 Vertical semiconductor integrated circuit chip packaging |
| 01/17/1984 | US4426659 Housing for high-power semiconductor components with large diameter intermediate contact disks of differing thicknesses |
| 01/17/1984 | US4426658 IC With protection against reversed power supply |
| 01/17/1984 | US4426657 Semiconductor device and method for producing same |
| 01/17/1984 | US4426656 GaAs FETs Having long-term stability |
| 01/17/1984 | US4426636 Method for preventing waveform distortion of a signal passing through an insulated conductor and circuit element embodying the method |
| 01/17/1984 | US4426548 Multilayer wiring structure |
| 01/17/1984 | US4425700 Patterning single crystal silicon layers, forming metal film, annealing to form silicides |
| 01/11/1984 | EP0098176A2 The packaging of semiconductor chips |
| 01/11/1984 | EP0098175A2 Pressure contact type semiconductor device |
| 01/11/1984 | EP0098167A2 A field-effect semiconductor device |
| 01/11/1984 | EP0098165A2 Semiconductor memory device |
| 01/11/1984 | EP0098114A2 Leadless chip carrier semiconductor integrated circuit device |
| 01/11/1984 | EP0098067A2 Method for producing multilayered glass-ceramic structure with copper-based conductors therein |
| 01/11/1984 | EP0098051A2 A plastics-encapsulated circuit element |
| 01/11/1984 | EP0098028A2 Hermetically sealable package for hybrid solid-state electronic devices and the like |
| 01/11/1984 | EP0097944A2 Method for directly bonding ceramic and metal members and laminated body of the same |
| 01/11/1984 | EP0097918A1 Semiconductor device and method of making the same |
| 01/11/1984 | EP0097833A2 Substrate for integrated circuit packages |
| 01/11/1984 | EP0097782A2 Thermal conduction bridge element for semiconductor device packages |
| 01/10/1984 | US4425575 Base for encapsulating components with coplanar electrodes |
| 01/10/1984 | US4425379 Metal, silicide strips |
| 01/10/1984 | US4425213 Discrete length strip plater |
| 01/10/1984 | US4425195 Coating with metal layers |
| 01/10/1984 | US4424900 Anti-static packages and packaging material |
| 01/10/1984 | US4424621 Oxidation, semiconductors, dielectrics |
| 01/10/1984 | CA1160363A1 Method for achieving ideal impurity base profile in a transistor |
| 01/04/1984 | EP0097611A2 Hermetical sealing between a gallium arsenide component and a glass body |
| 01/04/1984 | EP0097595A2 Static RAM cell |
| 01/04/1984 | EP0097157A1 Cooling means for integrated circuit chip device. |
| 01/03/1984 | US4424578 Bipolar prom |
| 01/03/1984 | US4424560 Component of an electric or electronic circuit, in particular a diode as well as a bridge rectifier and alternator of motor vehicles comprising it |
| 01/03/1984 | US4424527 Bonding pad metallization for semiconductor devices |
| 01/03/1984 | US4424526 Structure for collection of ionization-induced excess minority carriers in a semiconductor substrate and method for the fabrication thereof |
| 01/03/1984 | US4423547 Method for forming dense multilevel interconnection metallurgy for semiconductor devices |
| 12/28/1983 | EP0097087A1 Housing with plastic cap for semiconductor components |
| 12/28/1983 | EP0097058A2 SiC sintered body having metallized layer and production method therefor |
| 12/28/1983 | EP0096734A1 Stacked complementary metal oxide semiconductor inverter |
| 12/27/1983 | US4423468 Dual electronic component assembly |
| 12/27/1983 | US4423435 Assembly of an electronic device on an insulative substrate |
| 12/27/1983 | US4423434 Semiconductor device having two or more semiconductor elements with paired characteristics regularly arranged in a semiconductor substrate |
| 12/27/1983 | US4423127 Relative alighment of three or more superimposed patterns |
| 12/27/1983 | US4422708 Support device for integrated circuit |
| 12/27/1983 | CA1159576A1 Method of mounting interrelated components |
| 12/21/1983 | EP0096455A2 Multilayer interconnection structure for semiconductor device |
| 12/21/1983 | EP0096266A2 Disc-shaped semiconductor cell for pressure-contact power semiconductor components |
| 12/20/1983 | US4421233 Anti-static tray for semi-conductor devices and components |
| 12/20/1983 | US4421161 Heat exchanger for integrated circuit packages |
| 12/20/1983 | US4420869 Method of manufacturing a thyrister housing |
| 12/13/1983 | US4420767 Thermally balanced leadless microelectronic circuit chip carrier |
| 12/13/1983 | US4420765 Multi-layer passivant system |
| 12/13/1983 | US4420739 Liquid-cooled electrical assembly |
| 12/13/1983 | US4420652 Hermetically sealed package |
| 12/13/1983 | US4420504 Programmable read only memory |
| 12/13/1983 | US4420364 High-insulation multi-layer device formed on a metal substrate |
| 12/13/1983 | US4420207 Socket having means of no-load engaging with and releasing from electronic unit |
| 12/13/1983 | US4420203 Semiconductor module circuit interconnection system |
| 12/13/1983 | US4419818 Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure |
| 12/13/1983 | CA1158486A1 Electrically conductive foam and method of preparation and use |
| 12/08/1983 | WO1983004346A1 Flex-pack interconnection apparatus |
| 12/07/1983 | EP0095918A2 Resin sealed semiconductor devices |
| 12/06/1983 | US4419684 Semiconductor integrated circuit |
| 12/06/1983 | US4419682 Three level poly dynamic ram with poly bit lines |
| 12/06/1983 | US4419597 Alternator assembly having a rectifier device in thermal contact with case and cover |
| 12/06/1983 | US4418467 Semiconductor wafer with alignment marks and method for manufacturing semiconductor device |
| 11/30/1983 | EP0095411A2 Bipolar memory cell |
| 11/30/1983 | EP0095391A2 Mounting leadless chip-carriers |
| 11/30/1983 | EP0095306A2 Flex-pack interconnection carrier |
| 11/30/1983 | EP0095283A2 Memory device |
| 11/30/1983 | EP0095223A2 A lead frame |
| 11/30/1983 | EP0095048A2 Oligomer coated electronic circuit component and method of coating |
| 11/29/1983 | US4417913 Lead-free |
| 11/29/1983 | US4417777 Integrated circuit carrier assembly |
| 11/29/1983 | US4417413 Identification card with IC chip and a method for manufacturing the same |
| 11/29/1983 | US4417392 Process of making multi-layer ceramic package |
| 11/29/1983 | US4417387 Gold metallization in semiconductor devices |
| 11/29/1983 | US4417386 Method for mounting a semiconductor device in a housing |
| 11/24/1983 | WO1983004157A1 Device for the protection of an electronic device against voltages generated by an electromagnetic field |
| 11/24/1983 | WO1983004141A1 Three dimensional integrated circuit structure |
| 11/24/1983 | WO1983004091A1 Heat exchanger for integrated circuit packages |