Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1983
11/23/1983EP0094891A2 Method of fabricating a vertical power MOSFET structure
11/23/1983EP0094869A1 Encapsulating housing for a microelectronic circuit with high heat dissipation, and its manufacturing method
11/23/1983EP0094559A1 Method of manufacturing integrated MOS field effect transistors with an additional interconnection level consisting of metal silicides
11/23/1983EP0019003B1 Method of manufacturing semiconductor laser devices
11/22/1983US4417325 Highly scaleable dynamic ram cell with self-signal amplification
11/22/1983US4417323 Bubble memory conductor pattern with heat sink
11/22/1983US4417267 Aluminum or aluminum alloy plate
11/22/1983US4417266 Power and ground plane structure for chip carrier
11/22/1983US4416054 Method of batch-fabricating flip-chip bonded dual integrated circuit arrays
11/16/1983EP0094200A1 Low-stress-inducing omnidirectional heat sink
11/16/1983EP0094199A2 Heat exchanger for integrated circuit packages
11/16/1983EP0094073A2 Semiconductor device capable of structural selection
11/16/1983EP0093971A2 Semiconductor device having an interstitial transition element layer and method of manufacturing the same
11/15/1983US4415917 Lead frame for integrated circuit devices
11/15/1983US4415113 Impact pinner apparatus
11/15/1983US4415025 Thermal conduction element for semiconductor devices
11/10/1983WO1983003943A1 Improved bonding means and methods for polymer coated devices
11/10/1983WO1983003924A1 Low-stress-inducing omnidirectional heat sink
11/10/1983WO1983003923A1 Semiconductor integrated circuit structures having insulated conductors
11/10/1983WO1983003922A1 Semiconductor device
11/09/1983EP0093659A1 Mounting for integrated circuit devices
11/09/1983EP0093633A1 Substrate for an electric circuit, and method for its production
11/08/1983US4414562 Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases
11/08/1983US4414264 Chip carrier substrates of hybrid woven glass cloths
11/08/1983US4413404 Process for manufacturing a tear strip planarization ring for gang bonded semiconductor device interconnect tape
11/08/1983CA1156771A1 Integrated circuit device and sub-assembly
11/08/1983CA1156768A1 Printed wiring board substrates for ceramic chip carriers
11/02/1983EP0093029A1 Electronic regulator for alternators of motor-cars
11/02/1983EP0092971A1 Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby
11/02/1983EP0092944A1 Method for packaging electronic parts
11/02/1983EP0092930A1 Lead frame with fusible links
11/02/1983EP0092871A2 Semiconductor integrated circuits and method of manufacturing
11/02/1983EP0092720A1 Clamping device for disc-type semiconductur devices
11/01/1983US4413272 Semiconductor devices having fuses
11/01/1983US4413061 Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
11/01/1983US4412642 Cast solder leads for leadless semiconductor circuits
11/01/1983US4412377 Method for manufacturing a hybrid integrated circuit device
11/01/1983CA1156227A1 Encapsulated electronic devices and encapsulating compositions
10/1983
10/27/1983WO1983003713A1 OHMIC CONTACT FOR N-TYPE GaAs
10/27/1983WO1983003712A1 A self-positioning heat spreader
10/27/1983WO1983003610A1 Conductive thermoplastic resin foam and process for its production
10/26/1983EP0092086A1 Connection assembly for a plate-like electrical device
10/26/1983EP0092019A2 Improved semiconductor package
10/25/1983US4412242 Planar structure for high voltage semiconductor devices with gaps in glassy layer over high field regions
10/25/1983US4412241 Multiple trim structure
10/25/1983US4412239 Polysilicon interconnects with pin poly diodes
10/25/1983US4412093 Microcircuit flat pack with integral shell
10/25/1983US4411719 Apparatus and method for tape bonding and testing of integrated circuit chips
10/25/1983US4411149 Machine for bending conductors of a semiconductor chip device
10/25/1983CA1155943A1 Carrier socket for leadless integrated circuit devices
10/19/1983EP0091870A1 Method of positioning interconnecting lines at an electrical contact hole of an integrated circuit
10/19/1983EP0091847A1 Connector for a substrate, and electrical connection and convection cooling system utilizing such a connector
10/19/1983EP0091775A2 A method of manufacturing a semiconductor device comprising an interconnection layer
10/19/1983EP0091624A2 Method of manufacturing vertical semiconductor devices
10/18/1983US4410927 Casing for an electrical component having improved strength and heat transfer characteristics
10/18/1983US4410906 Very high speed large system integration chip package and structure
10/18/1983US4410905 Power, ground and decoupling structure for chip carriers
10/18/1983US4410904 Notched cell ROM
10/18/1983US4410647 Polyanhydride, 2-acetoxytrimethylenebis/anhydrotrimellitate/
10/18/1983US4410622 Forming interconnections for multilevel interconnection metallurgy systems
10/18/1983US4410598 Process for preparation of insulating coatings upon steel
10/18/1983US4410562 Method for forming a cured resin coating having a desired pattern on the surface of a substrate
10/18/1983US4410457 Conductive paste
10/18/1983US4410223 Module mounting assembly
10/18/1983US4410127 Method of soldering pins to printed circuit boards, and soldering bath for this method
10/18/1983CA1155535A1 Power semiconductor assembly with transformers and power on/protection circuits
10/12/1983EP0091376A1 Lead format for tape automated bonding
10/12/1983EP0091072A1 Process for encapsulating semi-conductor components and encapsulated components so obtained
10/11/1983US4409686 Method of serialization of dice
10/11/1983US4409609 Semiconductor device and method of manufacturing the same
10/11/1983US4409471 Information card
10/11/1983US4409292 Vitreous material and semiconductor component incorporating same
10/11/1983US4409259 Semiconductors, dopes
10/11/1983US4409135 Paste containing electrically conducting powder to form conducting solid filler in cavity in ceramic substrate
10/11/1983US4408385 Semiconductor integrated circuit with implanted resistor element in polycrystalline silicon layer
10/11/1983CA1155239A1 Diode and rom or eeprom device using same
10/05/1983EP0090738A2 Semiconductor device
10/05/1983EP0090651A2 Semiconductor chip assembly including a thermal radiator plate
10/05/1983EP0090633A2 Semiconductor device having radiator
10/05/1983EP0090608A2 Semiconductor device with moulded package
10/05/1983EP0090566A2 Semiconductor device package
10/05/1983EP0090565A2 Process for selectively cutting an electrical conductive layer by irradiation with an energy beam
10/05/1983EP0090503A2 Apparatus and method of packaging a semiconductor device
10/05/1983EP0090439A2 Electrically isolated semiconductor power device
10/05/1983EP0090286A1 A holding apparatus for use in cleaner or dryer for dual pin type electronic parts
10/04/1983US4408256 Microbox for electronic circuit and hybrid circuit having such a microbox
10/04/1983US4408220 Heat dissipator for a dual in line integrated circuit package
10/04/1983US4408219 Device for connecting in parallel power transistors in very high frequency
10/04/1983US4408218 Ceramic chip carrier with lead frame having removable rim
10/04/1983US4407933 Alignment marks for electron beam lithography
10/04/1983CA1154815A1 Alternator assembly having a rectifier device
09/1983
09/29/1983WO1983003216A1 Cast solder leads for leadless semiconductor circuits
09/29/1983WO1983003210A1 Liquids with reduced spreading tendency
09/28/1983EP0089898A2 Pre-adapted module for a high-frequency diode, and method of making the polarisation connection of the diode
09/28/1983EP0089891A2 Identification of repaired integrated circuits
09/28/1983EP0089814A2 Method of forming fusible links in a semiconductor device
09/28/1983EP0089636A1 Apparatus for clamping dual pin type electronic parts
09/28/1983EP0089559A2 Method for forming metal coatings for metallurgy patterns on dielectric substrates
09/27/1983US4407007 Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate
09/27/1983US4407006 Spiral strip brushlike stress buffering power semiconductor contacts
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