Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1983
09/27/1983US4406949 Method and apparatus for aligning an integrated circuit
09/27/1983US4406844 Fabrication of semiconductor modules with ceramic substrates and detection of residual glass
09/27/1983US4406508 Dual-in-line package assembly
09/27/1983US4406054 Method of mounting and packaging elongate silicon devices on a ceramic base
09/27/1983US4406051 Method for manufacturing a semiconductor device
09/27/1983US4406049 Nitriding, oxidation
09/27/1983CA1154541A1 Multi-layer ceramic package
09/21/1983EP0089248A2 Dense mounting of semiconductor chip packages
09/21/1983EP0089044A2 A semiconductor device having a container sealed with a solder of low melting point
09/21/1983EP0088924A2 Modular semiconductor component
09/21/1983EP0088923A2 Sandwich for pressure-contact semiconductor power components and method of producing it
09/21/1983EP0088922A2 A method of forming electrodes and wiring strips on a semiconductor device
09/20/1983US4405929 Thermal head device
09/20/1983US4405722 Sealing glass compositions
09/20/1983US4404745 Process for sealing VHF component in case
09/20/1983US4404739 Method for mounting, electrically isolating and maintaining constant pressure on a semiconductor element
09/20/1983US4404736 Method for manufacturing a semiconductor device of mesa type
09/15/1983WO1983003164A1 Intergrated circuit lead frame
09/15/1983WO1983003163A1 Pb alloy solder for semiconductor device
09/14/1983EP0088557A2 Resin encapsulated semiconductor device
09/14/1983EP0088246A2 Telescopic thermal conduction element for semiconductor devices
09/13/1983US4404658 Mesa bipolar memory cell and method of fabrication
09/13/1983US4404582 Mounting arrangement for disc mounted semiconductor devices
09/13/1983US4403394 Formation of bit lines for ram device
09/13/1983US4403392 Method of manufacturing a semiconductor device
09/13/1983CA1153829A1 Semiconductor device having a function of preventing a soft error due to alpha particles
09/07/1983EP0088045A1 Method of forming electroconductive domains in integrated monolithic semiconductor devices, and high package density semiconductor device manufactured by said method
09/07/1983EP0087979A2 A semiconductor memory device
09/07/1983EP0087897A2 Carrier for a leadless integrated circuit chip
09/07/1983EP0087796A2 Film carrier for an electrical conductor pattern
09/07/1983EP0087590A2 Electrochemical cell having solid electrodes and an intermediate ion-conductive ceramic solid electrolyte
09/06/1983US4403307 Semiconductor memory device
09/06/1983US4403243 Bonding with metal solder subjected to ultrasonic vibrations
09/06/1983US4403242 Semiconductor device having a metal-fiber composite material electrode
09/06/1983US4403240 Integrated circuit with at least three ground pads
09/06/1983US4403102 Heat sink mounting
09/06/1983US4402358 Heat pipe thermal switch
09/06/1983US4402185 Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing
09/06/1983CA1153480A1 Thin film transistor
09/06/1983CA1153256A1 Coating process mask
09/01/1983WO1983003030A1 A plurality of series connected resistors connected in a circuit with means for trimming said circuit
08/1983
08/31/1983EP0087112A1 Multi purpose chip
08/31/1983EP0086961A2 Multilayer board for the interconnection of high-speed circuits
08/31/1983EP0086915A2 Semiconductor device having conductor lines connecting the elements
08/31/1983EP0086812A1 Improved glass bonding means and method
08/30/1983US4402004 High current press pack semiconductor device having a mesa structure
08/30/1983US4401767 Pastes or inks for high strength bonding of silicon semiconductors to ceramic
08/30/1983US4401728 Composite material
08/30/1983US4400870 Method of hermetically encapsulating a semiconductor device by laser irradiation
08/24/1983EP0086724A2 Integrated circuit lead frame with improved power dissipation
08/24/1983EP0086483A2 Power rectifier arrangement
08/24/1983EP0086349A1 Display device
08/23/1983US4400797 Read only memory using static induction transistor
08/23/1983US4400715 Thin film semiconductor device and method for manufacture
08/23/1983US4400714 Lead frame for semiconductor chip
08/23/1983US4400713 Matrix array of semiconducting elements
08/23/1983US4399610 Assembling an electronic device
08/23/1983CA1152654A1 Explosion-proof semiconductor device
08/17/1983EP0085974A2 Method of forming a number of solder portions on a semiconductor wafer
08/17/1983EP0085777A2 Fabrication of devices including selective formation of titanium disilicide by direct reaction
08/16/1983US4399501 Set of power semiconductors equipped with firing transformers and with protection circuits
08/16/1983US4399452 Explosion-proof semiconductor device
08/16/1983US4399451 Semiconductor device and method for production thereof
08/16/1983US4399450 ROM With poly-Si to mono-Si diodes
08/16/1983US4399205 Relief images, patterns, etching
08/16/1983US4398457 Marking apparatus for plastic encapsulated semiconductor devices
08/16/1983US4398341 Depositing layers of metals and silicon, annealing to form silicides
08/16/1983US4398339 Fabrication method for high power MOS device
08/16/1983US4398335 Multilayer metal silicide interconnections for integrated circuits
08/16/1983CA1152228A1 Barrier-free, low-resistant electrical contact on iii- v semiconductor material
08/16/1983CA1152227A1 Process of reducing density of fast surface states in mos devices
08/10/1983EP0085622A2 Mounting support for integrated circuit-housing with external leads formed around the housing perimeter
08/10/1983EP0085607A2 Process for the simultaneous production of hyperfrequency diodes having an incorported encapsulation and diodes made by said process
08/09/1983US4398208 Integrated circuit chip package for logic circuits
08/09/1983US4397800 Ceramic body having a metallized layer
08/03/1983EP0084986A1 Alumina-based ceramic composition for the preparation of a substrate and process for the preparation of said substrate
08/03/1983EP0084937A1 Electrical contact materials
08/03/1983EP0084936A1 Glass composition for covering semiconductor elements
08/03/1983EP0084866A2 Semiconductor casing
08/03/1983EP0084859A2 Glass-molded semiconductor device
08/03/1983EP0020787B1 High frequency semiconductor unit
08/02/1983US4396971 LSI Chip package and method
08/02/1983US4396936 Integrated circuit chip package with improved cooling means
08/02/1983US4396935 VLSI Packaging system
08/02/1983US4396934 Corrosion resistant structure for conductor and PSG layered semiconductor device
08/02/1983US4396933 Dielectrically isolated semiconductor devices
08/02/1983US4396930 Compact MOSFET device with reduced plurality of wire contacts
08/02/1983US4396682 Glazed ceramic substrate
08/02/1983US4396467 Copper, gold, thin films
08/02/1983US4396458 Hafnium coated aluminum with magnesium oxide mask
08/02/1983US4396457 Method of making bumped-beam tape
08/02/1983CA1151318A1 Semiconductor component and casing
08/02/1983CA1151316A1 Metal support for an electronic component interconnection network and process for manufacturing this support
08/02/1983CA1151257A1 Edge termination for an electrical circuit device
08/01/1983EP0036867A4 Double cavity semiconductor chip carrier.
07/1983
07/27/1983EP0084464A2 Connector for electronic subassemblies
07/27/1983EP0084287A1 Device for limiting and controlling the temperature of a target situated on a holder inside a vacuum enclosure and receiving an energy beam, and its use in thermal measures
07/27/1983EP0084161A2 Lead frames for electronic and electric devices
07/26/1983US4395728 Temperature controlled apparatus
07/26/1983US4395727 Barrier-free, low-resistant electrical contact on III-V semiconductor material
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