| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/08/1984 | EP0115035A2 Semiconductor structure tolerant to ionizing radiation |
| 08/08/1984 | EP0115000A2 Power chip package |
| 08/08/1984 | EP0114952A1 Controlled braze joining of electronic packaging elements |
| 08/08/1984 | EP0114917A2 Semiconductor packages |
| 08/08/1984 | EP0020477B1 Dynamic random access memory |
| 08/07/1984 | US4464734 Semiconductor dynamic memory cell array with word lines extending into windows of capacitor plate |
| 08/07/1984 | US4463971 Identification card having an IC module |
| 08/01/1984 | EP0114802A2 Layered packaging material with an electric conductive layer and process for its manufacture |
| 08/01/1984 | EP0114760A1 Highly thermal dissipation housing, especially for microelectronics |
| 08/01/1984 | EP0114531A1 Package for a semiconductor chip with lead terminals |
| 08/01/1984 | EP0114474A1 Methods of encapsulating electronic circuits |
| 08/01/1984 | EP0114382A2 MOS semiconductor device having a FET and a metal wiring layer |
| 08/01/1984 | EP0114380A2 Encapsulated electronic components and encapsulation compositions |
| 08/01/1984 | EP0114338A1 Lead frame and method for manufacturing the same |
| 08/01/1984 | EP0114258A1 Resin encapsulation type photo-semiconductor devices |
| 08/01/1984 | EP0114211A2 Multi-layer flexible film module |
| 08/01/1984 | EP0114193A1 Ceramic substrate |
| 07/31/1984 | US4463217 Plastic surface mounted high pinout integrated circuit package |
| 07/31/1984 | US4463059 Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding |
| 07/31/1984 | US4462534 Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate |
| 07/31/1984 | US4462462 Thermal conduction piston for semiconductor packages |
| 07/31/1984 | US4462150 Method of forming energy beam activated conductive regions between circuit elements |
| 07/31/1984 | US4462149 Of molybdenum, tungsten, tantalum or titanium |
| 07/31/1984 | CA1171977A1 Electrode and semiconductor device provided with the electrode |
| 07/25/1984 | EP0114106A2 Method for manufacturing a semiconductor memory device having a high radiation resistance |
| 07/25/1984 | EP0113828A2 Master slice semiconductor chip having a new multi-function FET cell |
| 07/25/1984 | EP0113763A1 Lead frame and method. |
| 07/24/1984 | US4461925 Hermetic refrigeration terminal |
| 07/24/1984 | US4461924 Refractory oxide and epoxy layers for sealing and bonding connectors |
| 07/24/1984 | US4461525 Integrated circuit test socket |
| 07/24/1984 | US4461524 Frame type electrical connector for leadless integrated circuit packages |
| 07/24/1984 | US4461077 Method for preparing ceramic articles having raised, selectively metallized electrical contact points |
| 07/18/1984 | EP0113522A2 The manufacture of semiconductor devices |
| 07/18/1984 | EP0075588A4 Process for fabricating a self-aligned buried channel and the product thereof. |
| 07/17/1984 | US4460956 Rectifying device |
| 07/17/1984 | US4460917 Molded-in isolation bushing for semiconductor devices |
| 07/17/1984 | US4460916 Ceramic substrate with integrated circuit bonded thereon |
| 07/17/1984 | US4460914 Programmable semiconductor device and method of manufacturing same |
| 07/17/1984 | US4460880 Circuit matching elements |
| 07/17/1984 | US4460825 Carrier element for an IC module |
| 07/17/1984 | US4460618 Aluminum deposition on semiconductor bodies |
| 07/17/1984 | US4460224 Foldable circuit assembly |
| 07/11/1984 | EP0113292A1 Integrated circuit base |
| 07/11/1984 | EP0113282A1 Housing for an electronic component having a humidity fixing element |
| 07/11/1984 | EP0113273A1 Encapsulating housing for a power semiconductor with input-output insulation |
| 07/11/1984 | EP0113088A2 Substrate for mounting semiconductor element |
| 07/11/1984 | EP0113073A1 Electric commutating apparatus for a motor vehicle |
| 07/11/1984 | EP0112998A1 System of electrically testing integrated circuit yield detractors |
| 07/11/1984 | EP0112894A1 Power bus routing for gate arrays. |
| 07/10/1984 | US4459687 Integrated circuit having a multi-layer interconnection structure |
| 07/10/1984 | US4459654 High-voltage rectifier |
| 07/10/1984 | US4459638 Assembly of an externally ventilated semiconductor arrangement |
| 07/10/1984 | US4458406 Making LSI devices with double level polysilicon structures |
| 07/05/1984 | WO1984002631A1 Semiconductor chip package |
| 07/05/1984 | WO1984002613A1 Integrated circuit carrier and assembly |
| 07/05/1984 | WO1984002612A1 Microwave packages |
| 07/05/1984 | WO1984002529A1 Polyimide composition and method for protecting photoreactive cells |
| 07/04/1984 | EP0112774A2 Deskew circuit for automatic test equipment |
| 07/04/1984 | EP0112760A1 Electronic component encapsulating micro-housing having a plurality of bent connections |
| 07/04/1984 | EP0112693A1 Method of blowing fuses in an IC, for example for writing information into a fuse-type ROM |
| 07/04/1984 | EP0112675A1 A link structure selectively activable to create a conducting link in an integrated circuit |
| 07/04/1984 | EP0112662A1 Stacked MOS devices with polysilicon interconnects |
| 07/03/1984 | US4458291 Package for enclosing semiconductor elements |
| 07/03/1984 | CA1170343A1 Electrooptical display/lead subassembly and timepiece module including same |
| 06/27/1984 | EP0112168A2 Silicone-type coating resin solution and its preparation |
| 06/27/1984 | EP0112034A2 A MIS integrated circuit device protected from static charge |
| 06/27/1984 | EP0111932A2 Resin-molded semiconductor devices and a process for manufacturing the same |
| 06/27/1984 | EP0111890A2 Monolithic multicomponents ceramic substrate with at least one dielectric layer of a composition having a Perovskite structure |
| 06/27/1984 | EP0111823A2 Compressively stressed titanium metallurgy for contacting passivated semiconductor devices |
| 06/27/1984 | EP0111709A2 Telescoping thermal conduction element for cooling semiconductor devices |
| 06/27/1984 | EP0111690A1 Cooling system with counter flow of coolant |
| 06/26/1984 | US4456641 Ceramic substrate for semiconductor package |
| 06/26/1984 | US4456318 IC Socket |
| 06/26/1984 | US4455739 Process protection for individual device gates on large area MIS devices |
| 06/21/1984 | WO1984002444A1 Flat bag filled with heat-conducting liquid or paste |
| 06/20/1984 | EP0111181A2 Semiconductor component with a contact hole |
| 06/20/1984 | EP0111153A1 IC socket |
| 06/20/1984 | EP0110997A1 Semiconductor device package |
| 06/19/1984 | US4455565 Vertical MOSFET with an aligned gate electrode and aligned drain shield electrode |
| 06/19/1984 | US4455495 Programmable semiconductor integrated circuitry including a programming semiconductor element |
| 06/19/1984 | US4455194 Fusion, etching, multilayer |
| 06/19/1984 | US4454647 Isolation for high density integrated circuits |
| 06/19/1984 | CA1169585A1 Self-aligned metal process for field effect transistor integrated circuits |
| 06/19/1984 | CA1169582A1 Pinned substrate apparatus |
| 06/13/1984 | EP0110518A2 Method and apparatus for lead frame and semiconductor device encapsulation |
| 06/13/1984 | EP0110512A2 A modular semiconductor device |
| 06/13/1984 | EP0110452A1 Integrated alternator bridge heat sink |
| 06/13/1984 | EP0110401A2 Integrated semiconductor circuit having an interconnection layer consisting of an aluminium/silicon alloy |
| 06/13/1984 | EP0110307A2 Semiconductor die-attach technique and composition therefor |
| 06/13/1984 | EP0110285A2 Interconnection of integrated circuits |
| 06/13/1984 | EP0070861A4 Wafer and method of testing networks thereon. |
| 06/12/1984 | US4454529 Integrated circuit device having internal dampening for a plurality of power supplies |
| 06/12/1984 | US4454002 Controlled thermal-oxidation thinning of polycrystalline silicon |
| 06/12/1984 | CA1169022A1 Integrated circuit planarizing process |
| 06/12/1984 | CA1168916A1 Method for forming dense multilevel interconnection metallurgy for semiconductor devices |
| 06/12/1984 | CA1168840A1 Circuit package handling apparatus |
| 06/07/1984 | WO1984002195A1 Integrated circuit mounting apparatus |
| 06/07/1984 | WO1984002097A1 An improved semiconductor die-attach technique and composition therefor |
| 06/05/1984 | US4453233 Semiconductor memory device and method of manufacturing the same |
| 06/05/1984 | US4453176 LSI Chip carrier with buried repairable capacitor with low inductance leads |