H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1997
11/18/1997	US5687901 Process and apparatus for forming ball bumps
11/18/1997	US5687475 Process for determining the position and/or checking the separation and/or checking the coplanarity of the leads of components
11/18/1997	CA2109240C Wafer holding apparatus for holding a wafer
11/18/1997	CA2050781C Process for preparing semiconductor device
11/13/1997	WO1997042727A1 Process for producing a multilayered composite structure with electroconductive connections
11/13/1997	WO1997042663A1 Fabrication of high-density trench dmos using sidewall spacers
11/13/1997	WO1997042660A1 Storage cell arrangement in which vertical mos transistors have at least three different threshold voltages depending on stored data, and method of producing said arrangement
11/13/1997	WO1997042657A1 Electric component in integrated circuit form for hot insertion in a substrate and methods for manufacturing same
11/13/1997	WO1997042654A2 A method of making a monolithic microwave circuit with thick conductors
11/13/1997	WO1997042653A1 Device for precise location of a microchip
11/13/1997	WO1997042652A1 Control of junction depth and channel length using generated interstitial gradients to oppose dopant diffusion
11/13/1997	WO1997042648A1 Recessed coil for generating a plasma
11/13/1997	WO1997042548A1 Lithographical process for production of nanostructures on surfaces
11/13/1997	WO1997042356A1 Chemical vapor deposition of fluorocarbon polymer thin films
11/13/1997	WO1997041975A1 Method for cleaning electronic hardware components
11/13/1997	WO1997035231A3 Thermal treatment process of positive photoresist composition
11/13/1997	WO1997032335A3 Control mechanisms for dosimetry control in ion implantation systems
11/13/1997	DE19719272A1 Field insulation region in silicon substrate formation method for MOSFET formation
11/13/1997	DE19718870A1 Test unit for multiple unencapsulated semiconductor chips in MCM
11/13/1997	DE19718370A1 Method for producing sensitive pressure sensor or acoustic transducer
11/13/1997	DE19717123A1 Magnetic state recognition method for magnetic memory cell, e.g. MRAM,
11/13/1997	DE19654903A1 Substrate wafer wet treatment device
11/13/1997	DE19618974A1 Semiconductor material treatment in cavitating liquid bath
11/13/1997	DE19618533A1 Vorrichtung zur ortsgenauen Fixierung von Mikrochips Apparatus for spatially accurate fixation of microchips
11/13/1997	DE19618100A1 Verfahren zur Herstellung einer Mehrlagen-Verbundstruktur mit elektrisch leitenden Verbindungen A process for producing a multi-layer composite structure with electrically conductive connections
11/13/1997	DE19617646A1 Speicherzellenanordnung und Verfahren zu deren Herstellung Memory cell arrangement, and processes for their preparation
11/13/1997	DE19614876C1 Simple mass production of integrated semiconductor device
11/13/1997	CA2253882A1 Lithographical process for production of nanostructures on surfaces
11/12/1997	EP0806836A2 Architecture and interconnect scheme for programmable logic circuits
11/12/1997	EP0806834A2 Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
11/12/1997	EP0806800A1 Condensator with carbide or boride barrier layer
11/12/1997	EP0806799A1 Method of forming interconnections in an integrated circuit
11/12/1997	EP0806798A2 Substrate support chuck having a contaminant containment layer and method of fabricating same
11/12/1997	EP0806797A2 Monopolar electrostatic chuck having an electrode in contact with a workpiece
11/12/1997	EP0806796A2 Method of manufacturing a gate oxide
11/12/1997	EP0806795A2 Crack stop formation in integrated circuit chip manufacture
11/12/1997	EP0806794A2 Method of forming shallow doped regions in a semiconductor substrate, using preamorphization and ion implantation
11/12/1997	EP0806793A2 Insulated wafer spacing mask for a substrate support chuck and method of fabricating same
11/12/1997	EP0806736A1 Method for creating and using design shells for integrated circuit designs
11/12/1997	EP0806707A1 Microlithographic imaging system
11/12/1997	EP0806702A1 Liquid crystal device
11/12/1997	EP0806701A1 Liquid crystal device
11/12/1997	EP0806700A1 Liquid crystal device
11/12/1997	EP0806678A2 Laser voltage probe methods and apparatus
11/12/1997	EP0806573A2 Fluid control device
11/12/1997	EP0806499A1 Method and apparatus for fabricating semiconductor
11/12/1997	EP0806496A1 Method and apparatus for aiming a barrel reactor nozzle
11/12/1997	EP0806495A2 Metal-organic chemical vapor-phase deposition process
11/12/1997	EP0806374A1 Container for storing and transporting fragile objects
11/12/1997	EP0806267A1 Cross-hatched polishing pad for polishing substrates in a chemical mechanical polishing system
11/12/1997	EP0806266A2 Polishing method and polishing apparatus using the same
11/12/1997	EP0806126A1 Methods and apparatus for generating plasma
11/12/1997	EP0806056A1 Glass bonding layer for a ceramic circuit board support substrate
11/12/1997	EP0806055A1 Manufacture of electric devices comprising thin-film circuitry on an organic substrate
11/12/1997	EP0806013A1 Timing shell generation through netlist reduction
11/12/1997	EP0795200A4 Mounting electronic components to a circuit board
11/12/1997	EP0701684A4 Apparatus and method of film thickness measurement
11/12/1997	EP0689621B1 Device for electrolytic oxidation of silicon wafers
11/12/1997	EP0550770B1 Method of producing vertical mosfets
11/12/1997	EP0520996B1 Loading mechanisms
11/12/1997	CN1164932A N-sided polygonal cell lay-out for multiple cell transistor
11/12/1997	CN1164894A Automated molecular biological diagnostic system
11/12/1997	CN1164812A Ultra high purity gas distribution component with integral valved coupling and methods for its use
11/12/1997	CN1164766A Power semiconductor device and method of fabricating the same
11/12/1997	CN1164765A 半导体封装件 The semiconductor package
11/12/1997	CN1164764A Multi-layer bottom lead package
11/12/1997	CN1164763A Method for making inter-connecting polycrystalline silicon to polycrystalline silicon low resistance contact on integrated circuit
11/12/1997	CN1164762A Integrated circuit tester for semiconductor
11/12/1997	CN1164761A Method for plasma etching in process for fabrication of semiconductor device
11/12/1997	CN1164760A T shape grid making method for semiconductor device
11/12/1997	CN1164759A Process for vapor phase epitaxy of compound semiconductor
11/12/1997	CN1164757A Semiconductor modular making unit system
11/12/1997	CN1164673A Pattern structure of photomask
11/11/1997	US5687345 Microcomputer having CPU and built-in flash memory that is rewritable under control of the CPU analyzing a command supplied from an external device
11/11/1997	US5687130 Monolithic device
11/11/1997	US5687123 Semiconductor memory device
11/11/1997	US5687120 Low voltage one transistor flash eeprom cell using fowler-nordheim programming and erase
11/11/1997	US5687119 Semiconductor memory device with floating gate electrode
11/11/1997	US5687118 PMOS memory cell with hot electron injection programming and tunnelling erasing
11/11/1997	US5687113 Electrically programmable memory cell
11/11/1997	US5687111 Static type semiconductor memory device capable of operating at a low voltage and reducing a memory cell area
11/11/1997	US5687078 Fine pitch bonding
11/11/1997	US5686997 Scanning projection exposure method and projection exposure apparatus
11/11/1997	US5686991 Positioning apparatus having the interferometer and accelerometer positioned such that there signals are in phase
11/11/1997	US5686984 Projection exposure method and apparatus to determine optical performance of reticle
11/11/1997	US5686868 Semiconductor integrated circuit having VCO coupled through capacitance and buffer circuits
11/11/1997	US5686858 Temperature detector on an integrated circuit
11/11/1997	US5686843 Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
11/11/1997	US5686834 Handling system
11/11/1997	US5686764 Flip chip package with reduced number of package layers
11/11/1997	US5686763 Device module comprising a substrate having grooves fixed to circuit chips with improved sealing characteristics
11/11/1997	US5686761 Titanium nitride
11/11/1997	US5686760 Film preventing diffusion
11/11/1997	US5686757 Film carrier tape for use in tape automated bonding
11/11/1997	US5686755 LDMOS resurf high voltage transistor
11/11/1997	US5686754 Polysilicon field ring structure for power IC
11/11/1997	US5686752 Semiconductor device having a CMOS element as a buffer
11/11/1997	US5686749 Non-volatile semiconductor memory device with thin film transistor formed on a separation insulating film adjacent to a memory cell, and method of making thereof
11/11/1997	US5686748 Dielectric material and process to create same
11/11/1997	US5686747 Integrated circuits comprising interconnecting plugs

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