H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1997
10/28/1997	US5681770 Process for making and programming a flash memory array
10/28/1997	US5681769 Method of fabricating a high capacitance insulated-gate field effect transistor
10/28/1997	US5681768 Transistor having reduced hot carrier implantation
10/28/1997	US5681766 Method of making integrated circuit capable of low-noise and high-power microwave operation
10/28/1997	US5681765 Process for fabricating single polysilicon high performance BICMOS
10/28/1997	US5681764 Method for forming a bipolar integrated ink jet printhead driver
10/28/1997	US5681763 Method for making bipolar transistors having indium doped base
10/28/1997	US5681762 Methods of forming silicon carbide semiconductor devices having buried silicon carbide conduction barrier layers therein
10/28/1997	US5681761 Microwave power SOI-MOSFET with high conductivity metal gate
10/28/1997	US5681760 Method for manufacturing thin film transistor
10/28/1997	US5681759 Method of fabricating semiconductor device
10/28/1997	US5681757 Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process
10/28/1997	US5681671 Electrode comprising transparent substrate and electroconductive layer of mixed oxide containing indium, magnesium and/or zinc, aluminum and/or gallium
10/28/1997	US5681647 Nail-shaped conductive elements filled through holes of self-supporting polymeric layer; connectors
10/28/1997	US5681638 Substrate, and method and apparatus for holding the substrate
10/28/1997	US5681614 Hydrophobic treatment method involving delivery of a liquid process agent to a process space
10/28/1997	US5681613 Filtering technique for CVD chamber process gases
10/28/1997	US5681487 Method of removing photoresist film
10/28/1997	US5681444 Electroplating connector holes with nickel, then oxidizing it and covering with screen printed dielectric glass, firing to remove organic binders and solvents, applying conductive ink containing metal powder and glass, then more firing
10/28/1997	US5681442 Method of producing an organic device
10/28/1997	US5681439 Anodizing exposed segment of line while photoresist-covered segment has shape-elongated edge to prevent any unwanted anodization from converging along the complete distance beneath the photresist
10/28/1997	US5681425 Teos plasma protection technology
10/28/1997	US5681424 Plasma processing method
10/28/1997	US5681423 Support pillar positioned in cavity to support polishing pad during planarization
10/28/1997	US5681419 Reactive ion etching apparatus
10/28/1997	US5681418 Plasma processing with inductive coupling
10/28/1997	US5681398 Cleaning fluid comprising nitric acid, hydrofluoride, hydrochloride, a surfactant and water; purification, demetallization
10/28/1997	US5681397 Cleaning silicon wafer in aqueous hydrofluoric acid soluiton immersing the wafer in boiling aqueous hydrochloric acid, drawing and drying to minimize oxidation of silicon surface
10/28/1997	US5681396 Method and apparatus for utilizing acoustic coaxing induced microavitation for submicron particulate eviction
10/28/1997	US5681393 Plasma processing apparatus
10/28/1997	US5681356 Method and apparatus for producing a plastic molded chip card having reduced wall thickness
10/28/1997	US5681216 High precision polishing tool
10/28/1997	US5681215 Carrier head design for a chemical mechanical polishing apparatus
10/28/1997	US5681212 Polishing device and correcting method therefor
10/28/1997	US5681024 Microvalve
10/28/1997	US5680984 Apparatus and method for mounting soldering balls onto surfaces of electronic components
10/28/1997	US5680698 Method for precise alignment and placement of optoelectric components
10/28/1997	CA2075654C Wafer suspension box
10/23/1997	WO1997039607A1 Plasma treatment device
10/23/1997	WO1997039485A1 Silicon carbide cmos and method of fabrication
10/23/1997	WO1997039484A1 Method of fabricating an interconnect structure comprising lamination of a porous dielectric membrane
10/23/1997	WO1997039482A1 Methods for manufacturing a semiconductor package
10/23/1997	WO1997039481A1 An integrated complex-transition metal oxide device and a method of fabricating such a device
10/23/1997	WO1997039480A1 Two-step projecting bump for semiconductor chip and method for forming the same
10/23/1997	WO1997039479A1 Method for forming semiconductor field region dielectrics having globally planarized upper surfaces
10/23/1997	WO1997039478A1 Self-aligned via and contact interconnect manufacturing method
10/23/1997	WO1997039477A1 P-type silicon carbide formation by ion implantation and p-type silicon carbide
10/23/1997	WO1997039476A1 SiC ELEMENT AND PROCESS FOR ITS PRODUCTION
10/23/1997	WO1997039475A2 Installation for wet-treating substrates
10/23/1997	WO1997039182A1 Method for overall regulation of the headbox and/or the former of a paper machine or equivalent
10/23/1997	WO1997038810A1 Method of manufacturing a sintered structure on a substrate
10/23/1997	WO1997034321A3 Semiconductor body with a substrate glued to a support body
10/23/1997	WO1997027646A3 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
10/23/1997	WO1997027619A3 Method of manufacturing cooling devices made up of several metal shaped-section elements for mounting on semiconductor components, shaped-section elements for use in the manufacture of such cooling devices and cooling devices manufactured by the method
10/23/1997	WO1997020337A3 Read-only memory cell array and method for the fabrication thereof
10/23/1997	DE19703646A1 Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter Device and method for treating substrates in a fluid container
10/23/1997	DE19650149A1 Semiconductor integrated circuit unit for e.g. DRAM
10/23/1997	DE19620625C1 High packing density DRAM cell array
10/23/1997	DE19615787A1 Verfahren zur Herstellung eines keramischen Multilayer-Substrats A method for producing a ceramic multilayer substrate
10/23/1997	DE19615291A1 Selective epitaxial growth on structured silicon wafer
10/23/1997	CA2252102A1 Two-step projecting bump for semiconductor chip and method for forming the same
10/22/1997	EP0802604A2 Protection circuit
10/22/1997	EP0802570A2 Double heterojunction field-effect transistor
10/22/1997	EP0802569A1 FLASH-EPROM integrated with EEPROM
10/22/1997	EP0802567A2 Semiconductor device and manufacturing method thereof
10/22/1997	EP0802565A1 Method for forming stacked capacitor storage electrode
10/22/1997	EP0802564A2 Semiconductor device having high resistive element including high melting point metal
10/22/1997	EP0802563A2 Method of manufacturing a semi-conductor device having a low resistance metal silicide layer
10/22/1997	EP0802560A1 Process and electromagnetically coupled plasma apparatus for etching oxides
10/22/1997	EP0802493A2 Process flow design technique
10/22/1997	EP0802419A2 Probe card and method of forming the same
10/22/1997	EP0802418A2 Method for high-speed testing a semiconductor device
10/22/1997	EP0802416A2 Manufacturing method of semiconductor acceleration sensor
10/22/1997	EP0802363A2 Method and apparatus for baking out a gate valve in a semiconductor processing system
10/22/1997	EP0802234A2 Silicone die attach adhesive and method for fabrication of semiconductor devices
10/22/1997	EP0802029A2 Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method
10/22/1997	EP0802028A2 Device for detaching wafers from ingot support and stocking individualized wafers
10/22/1997	EP0802012A1 Device for making wire connections to semiconductor chips
10/22/1997	EP0801816A1 Semiconductor device having a passivation layer
10/22/1997	EP0801814A1 Wet chemical treatment installation
10/22/1997	EP0801606A1 Cleaning method
10/22/1997	EP0785917A4 Method of treating an anti-reflective coating on a substrate
10/22/1997	EP0766909A4 Vertical interconnect process for silicon segments
10/22/1997	EP0728224A4 Apparatus for a thin film manufacturing
10/22/1997	EP0700571A4 Memory material and method for its manufacture
10/22/1997	EP0686304A4 Method for the controlled formation of voids in doped glass dielectric films
10/22/1997	EP0647310B1 Method of an apparatus for interferometrically inspecting a surface of an object
10/22/1997	EP0632952B1 Process for determining the position of component leads and for checking their separation and/or coplanarity, and placing head for automatically planting components
10/22/1997	EP0584739B1 Semiconductor integrated circuit operative in different modes
10/22/1997	CN1163014A Method for producing high efficiency light-emitting diodes and resulting diode structures
10/22/1997	CN1162845A Semiconductor integrated circuit device and method for manufacturing the same
10/22/1997	CN1162844A Semiconductor memory and method of manufacturing the same
10/22/1997	CN1162843A Integrated circuit having integral decoupling capacitor
10/22/1997	CN1162841A Semiconductor device and manufacturing method thereof
10/22/1997	CN1162840A Semiconductor device
10/22/1997	CN1162839A Method for forming conductor and internal leadings of high compact integrated circuits
10/22/1997	CN1162838A Apparatus for use in cleaning wafers
10/22/1997	CN1162837A Metallic thin film and method of manufacturing the same, and surface acoustic wave device using metallic thin film and method thereof
10/22/1997	CN1162836A Method for fabricating silicon-on-insulator substrate
10/22/1997	CN1162835A Silicon-on-insulator substrate and method of fabricating the same

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