Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1997
11/06/1997WO1997041597A1 Semiconductor isolation region bounded by a trench and covered with an oxide to improve planarization
11/06/1997WO1997041596A1 Nitrogenated trench liner for improved shallow trench isolation
11/06/1997WO1997041595A1 Method and apparatus for attaching balls to a substrate
11/06/1997WO1997041594A1 Multilayer solder/barrier attach for semiconductor chip
11/06/1997WO1997041593A1 Reduced bird's beak field oxidation process using nitrogen implanted into active region
11/06/1997WO1997041592A1 A fluorinated oxide low permittivity dielectric stack for reduced capacitive coupling
11/06/1997WO1997041591A1 Photoelectrochemical wet etching of group iii nitrides
11/06/1997WO1997041590A1 Method for joining silicon semiconductor substrate
11/06/1997WO1997041587A1 Sputtering installation with two longitudinally placed magnetrons
11/06/1997WO1997041488A2 Processes for cleaning and stripping photoresist from surfaces of semiconductor wafers
11/06/1997WO1997041479A1 Anti-vibration stabilizer for a portable emission microscope
11/06/1997WO1997041081A1 Pin layer sequence on a perovskite
11/06/1997WO1997040958A1 Microelectronic connections with liquid conductive elements
11/06/1997DE19718401A1 Removing metal impurities from silicon metalloid surface
11/06/1997DE19717565A1 CVD apparatus for efficient production of compound semiconductor thin film
11/06/1997DE19714510A1 Herstellungsverfahren für eine Flüssigkristallanzeige Manufacturing method for a liquid crystal display
11/06/1997DE19713090A1 Rapid gas etching of semiconductor silicon material
11/06/1997DE19712777A1 Heater electrode melting prevention e.g. in Czochralski apparatus
11/06/1997DE19712556A1 Semiconductor wafer heat treatment appliance
11/06/1997DE19709764A1 Semiconductor component e.g. power MOSFET
11/06/1997DE19706763A1 Dry etching method for metal film
11/06/1997DE19649876A1 Semiconductor memory e.g. DRAM/SOI-DRAM
11/06/1997DE19648075A1 Phase-shift mask
11/06/1997DE19642539A1 Semiconductor on insulator arrangement
11/06/1997DE19637875A1 Anlage zur Naßbehandlung von Substraten Plant for wet treatment of substrates
11/06/1997DE19617057A1 Sputteranlage mit zwei längserstreckten Magnetrons Sputtering system with two elongated magnetron
11/06/1997DE19616402A1 Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter Device for treating substrates in a fluid container
11/06/1997DE19616400A1 Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter Device for treating substrates in a fluid container
11/06/1997CA2225446A1 Apparatus and method for improved deposition of conformal liner films and plugs in high aspect ratio contacts
11/05/1997EP0805614A1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar
11/05/1997EP0805551A1 Semiconductor circuit
11/05/1997EP0805499A2 High withstand voltage M I S field effect transistor and semiconductor integrated circuit
11/05/1997EP0805498A1 High electron mobility transistor and method of manufacturing same
11/05/1997EP0805497A1 Bipolar transistor and method of fabrication
11/05/1997EP0805493A2 Electrical connecting member and manufacturing method therefor
11/05/1997EP0805491A2 Interconnect structure and method of manufacturing using two different low dielectric constant insulators
11/05/1997EP0805490A1 Process for overcoming selectivity loss
11/05/1997EP0805489A2 Selective via fill using a sacrificial layer
11/05/1997EP0805488A2 Prevention of abnormal WSix oxidation by in-situ amorphous silicon deposition
11/05/1997EP0805487A2 Multielectrode electrostatic chuck with fuses
11/05/1997EP0805486A1 Integrated circuit bonding method and apparatus
11/05/1997EP0805485A2 Method for plasma etching dielectric layers with high selectivity and low microloading effect
11/05/1997EP0805484A1 Method of cleaning substrates
11/05/1997EP0805483A1 Semiconductor treatment apparatus
11/05/1997EP0805482A1 Semiconductor processing
11/05/1997EP0805481A2 Vacuum processing apparatus and operating method therefor
11/05/1997EP0805480A2 SMIF device for introduction of substrates into clean transfer rooms
11/05/1997EP0805479A1 Process for manufacturing an integrated transistor with thick oxide
11/05/1997EP0805476A2 Plasma enhanced chemical vapour deposition processes and apparatus
11/05/1997EP0805356A2 Integrated or intrapackage capability for testing electrical continuity between an integrated circuit and other circuitry
11/05/1997EP0805342A1 Method and apparatus for measuring substrate temperatures
11/05/1997EP0805000A1 Semiconductor wafer post-polish clean and dry method and apparatus
11/05/1997EP0804991A1 Bonding of silicon carbide components
11/05/1997EP0804808A1 Contoured nonvolatile memory cell
11/05/1997EP0804806A1 Device for superheating steam
11/05/1997EP0804805A1 Method of forming transistors in a peripheral circuit
11/05/1997EP0804804A2 Method of etching a polysilicon pattern
11/05/1997EP0804803A1 Barrier enhancement at the sialicide layer
11/05/1997EP0804802A1 A method of producing an ohmic contact and a semiconductor device provided with such ohmic contact
11/05/1997EP0804801A1 Storage box for an object to be protected from physical/chemical contamination
11/05/1997EP0804722A1 Surface inspection system
11/05/1997EP0804713A1 Optical wafer positioning system
11/05/1997EP0804313A1 Method and cutting insert for threading
11/05/1997EP0722629A4 Field effect transistor with switchable body to source connection
11/05/1997CN1164295A Polycrystalline ferroelectric capacitor heterostructure employing hybrid electrodes
11/05/1997CN1164145A Method for turn-on regulation of IGBT and apparatus for carrying out the same
11/05/1997CN1164129A Semiconductor memory devices
11/05/1997CN1164128A Electrode structure of semiconductor integrated circuit and method for forming package therefor
11/05/1997CN1164127A Lead frame and semiconductor device using the lead frame and method of manufacturing the same
11/05/1997CN1164126A Method for welding semiconductor shell on supporting board
11/05/1997CN1164125A Plasma processing method and apparatus
11/05/1997CN1164124A Apparatus for cleansing semiconductor wafer
11/05/1997CN1164122A Plasma processor and its treating method
11/05/1997CN1164049A Method for fabricating light exposure mask
11/05/1997CN1163945A Method for manufacturing thin film, and deposition apparatus
11/05/1997CN1163944A Deposit film forming apparatus and method
11/05/1997CN1163803A Bump forming method and its forming apparatus
11/05/1997CN1163802A Cleaning method and apparatus for the same
11/04/1997US5684823 Method of fabricating a diffraction grating and a distributed feedback semiconductor laser incorporating the diffraction grating
11/04/1997US5684819 Monolithically integrated circuits having dielectrically isolated, electrically controlled optical devices
11/04/1997US5684748 Circuit for testing reliability of chip and semiconductor memory device having the circuit
11/04/1997US5684746 Semiconductor memory device in which a failed memory cell is placed with another memory cell
11/04/1997US5684739 Apparatus and method for determining current or voltage of a semiconductor device
11/04/1997US5684675 Semiconductor device unit having holder
11/04/1997US5684669 Method for dechucking a workpiece from an electrostatic chuck
11/04/1997US5684599 Wafer notch dimension measuring apparatus
11/04/1997US5684595 Alignment apparatus and exposure apparatus equipped therewith
11/04/1997US5684569 Position detecting apparatus and projection exposure apparatus
11/04/1997US5684567 Exposure apparatus and device manufacturing method for projecting light from a secondary light source onto a mask or pattern
11/04/1997US5684566 Illumination system and method employing a deformable mirror and diffractive optical elements
11/04/1997US5684565 Pattern detecting method, pattern detecting apparatus, projection exposing apparatus using the same and exposure system
11/04/1997US5684412 Cell forming part of a customizable logic array
11/04/1997US5684333 Wafer structure in a semiconductor device manufacturing process
11/04/1997US5684332 Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom
11/04/1997US5684331 Multilayered interconnection of semiconductor device
11/04/1997US5684328 Semiconductor chip package using improved tape mounting
11/04/1997US5684327 Lead frame for use in a resin-sealed type semiconductor device
11/04/1997US5684326 Formed on a semiconductor die
11/04/1997US5684323 Protection circuit for semiconductor device
11/04/1997US5684321 Semiconductor device having an input protection circuit