Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
11/25/1997 | US5691252 Method of making low profile shallow trench double polysilicon capacitor |
11/25/1997 | US5691250 Method of forming a metal contact to a novel polysilicon contact extension |
11/25/1997 | US5691249 Method for fabricating polycrystalline silicon having micro roughness on the surface |
11/25/1997 | US5691248 Methods for precise definition of integrated circuit chip edges |
11/25/1997 | US5691247 Method for depositing a flow fill layer on an integrated circuit wafer |
11/25/1997 | US5691246 In situ etch process for insulating and conductive materials |
11/25/1997 | US5691245 Methods of forming two-sided HDMI interconnect structures |
11/25/1997 | US5691243 Process for manufacturing composite semiconductor device |
11/25/1997 | US5691241 Method for making plurality of leadframes having grooves containing island and inner leads |
11/25/1997 | US5691240 Method for forming blanket planarization of the multilevel interconnection |
11/25/1997 | US5691239 Method for fabricating an electrical connect above an integrated circuit |
11/25/1997 | US5691238 Integrated circuits |
11/25/1997 | US5691237 Method for fabricating semiconductor device |
11/25/1997 | US5691236 Method and apparatus for performing chemical vapor deposition |
11/25/1997 | US5691235 Method of depositing tungsten nitride using a source gas comprising silicon |
11/25/1997 | US5691233 Process of forming channel stopper exactly nested in area assigned to thick field oxide layer |
11/25/1997 | US5691232 Planarized trench and field oxide isolation scheme |
11/25/1997 | US5691231 Method of manufacturing silicon on insulating substrate |
11/25/1997 | US5691230 Technique for producing small islands of silicon on insulator |
11/25/1997 | US5691229 Process of fabricating dynamic random access memory cell having inter-level insulating structure without silicon nitride layer between access transistor and storage node |
11/25/1997 | US5691228 Semiconductor processing method of making a hemispherical grain (HSG) polysilicon layer |
11/25/1997 | US5691227 Method for forming charge storage electrodes of semiconductor device |
11/25/1997 | US5691226 Method of manufacturing BICMOS integrated circuits |
11/25/1997 | US5691225 Method for fabricating semiconductor device having CMOS structure |
11/25/1997 | US5691224 Method of making BiCMOS circuit |
11/25/1997 | US5691223 Method of fabricating a capacitor over a bit line DRAM process |
11/25/1997 | US5691222 Method of manufacturing semiconductor integrated circuit device having a capacitor electrode |
11/25/1997 | US5691221 Method for manufacturing semiconductor memory device having a stacked capacitor |
11/25/1997 | US5691220 Process of fabricating semiconductor device having capacitor electrode implanted with boron difluoride |
11/25/1997 | US5691219 Method of manufacturing a semiconductor memory device |
11/25/1997 | US5691218 Method of fabricating a programmable polysilicon gate array base cell structure |
11/25/1997 | US5691217 Semiconductor processing method of forming a pair of field effect transistors having different thickness gate dielectric layers |
11/25/1997 | US5691216 Integrated circuit self-aligning process and apparatus |
11/25/1997 | US5691215 Method for fabricating a sub-half micron MOSFET device with insulator filled shallow trenches planarized via use of negative photoresist and de-focus exposure |
11/25/1997 | US5691214 Method of manufacturing semiconductor devices |
11/25/1997 | US5691212 Silicides |
11/25/1997 | US5691211 Method for gettering noble metals from mineral acid solution |
11/25/1997 | US5691210 Method for fabrication of probe structure and circuit substrate therefor |
11/25/1997 | US5691117 Using a hydrogen conveyor furnace |
11/25/1997 | US5691111 Sulfonium salt, acrylate ester polymer |
11/25/1997 | US5691110 Process for controlled deprotection of polymers and a process for fabricating a device utilizing partially deprotected resist polymers |
11/25/1997 | US5691090 Phase shift mask and manufacturing method thereof and exposure method using phase shift mask |
11/25/1997 | US5691088 Dustproofing; frame, transparent polymeric film, skicky adhesive film |
11/25/1997 | US5690877 Method of processing a semiconductor chip package |
11/25/1997 | US5690841 Method of producing cavity structures |
11/25/1997 | US5690795 Screwless shield assembly for vacuum processing chambers |
11/25/1997 | US5690785 Lithography control on uneven surface |
11/25/1997 | US5690781 Plasma processing apparatus for manufacture of semiconductor devices |
11/25/1997 | US5690766 Method and apparatus for decreasing the time needed to die bond microelectronic chips |
11/25/1997 | US5690749 Improving integrated circuit yield |
11/25/1997 | US5690744 Wafer orientation alignment system |
11/25/1997 | US5690743 Liquid material supply apparatus and method |
11/25/1997 | US5690742 Susceptor for an epitaxial growth apparatus |
11/25/1997 | US5690736 Method of forming crystal |
11/25/1997 | US5690727 Thin films of ABO3 with excess B-site modifiers and method of fabricating integrated circuits with same |
11/25/1997 | US5690544 Wafer polishing apparatus having physical cleaning means to remove particles from polishing pad |
11/25/1997 | US5690050 Plasma treating apparatus and plasma treating method |
11/25/1997 | CA2048339C Semiconductor member and process for preparing semiconductor member |
11/20/1997 | WO1997043823A1 Three-terminal power mosfet switch for use as synchronous rectifier or voltage clamp |
11/20/1997 | WO1997043787A1 Microelectronics package |
11/20/1997 | WO1997043786A1 High frequency microelectronics package |
11/20/1997 | WO1997043785A1 Wafer aligning method |
11/20/1997 | WO1997043784A1 Wafer cassette mounting device and wafer inspection device equipped with the same |
11/20/1997 | WO1997043783A1 A method and an apparatus for manufacturing heat-sink devices |
11/20/1997 | WO1997043782A1 Method of patterning a substrate using spin-on glass as a hard mask |
11/20/1997 | WO1997043740A1 Radio frequency data communications device |
11/20/1997 | WO1997043694A2 Method of producing a stencil mask |
11/20/1997 | WO1997043689A1 Thin film device having coating film, liquid crystal panel, electronic apparatus and method of manufacturing the thin film device |
11/20/1997 | WO1997043658A1 Reusable die carrier for burn-in and burn-in process |
11/20/1997 | WO1997043656A2 Wafer-level burn-in and test |
11/20/1997 | WO1997043654A1 Microelectronic spring contact elements |
11/20/1997 | WO1997043653A1 Contact tip structures for microelectronic interconnection elements and methods of making same |
11/20/1997 | WO1997043461A1 Method for making a thin film of solid material, and uses thereof |
11/20/1997 | WO1997043087A1 Chemical mechanical polishing slurry for metal layers and films |
11/20/1997 | WO1997036316A3 A field controlled semiconductor device of sic and a method for production thereof |
11/20/1997 | WO1997036314A3 A field effect transistor of sic and a method for production thereof |
11/20/1997 | WO1997036313A3 A field controlled semiconductor device of sic and a method for production thereof |
11/20/1997 | DE19720228A1 Electron beam exposure device with scanning electron microscope |
11/20/1997 | DE19719983A1 Ball grid array for semiconductor component |
11/20/1997 | DE19716668A1 Small outline, stacking J-lead package for semiconductor chip encapsulation |
11/20/1997 | DE19715684A1 CCD manufacturing method |
11/20/1997 | DE19713501A1 Conductive layer in Semiconductor component coupling method |
11/20/1997 | DE19704149A1 Metal wiring with self-aligned via corners |
11/20/1997 | DE19701003A1 DRAM cell with two FETs for computer |
11/20/1997 | DE19700868A1 Internal connection in semiconductor component formation method |
11/20/1997 | DE19645567A1 Integrated low pass filter and high pass filter circuits |
11/20/1997 | DE19644504A1 Semiconductor device, e.g. trench-formed IGBT, for high voltage inverter |
11/20/1997 | DE19620113A1 Verfahren und Vorrichtung zur Befestigung von Bonddrähten auf Bondlands einer Hybridschaltung Method and apparatus for attaching bond wires to bond lands of a hybrid circuit |
11/20/1997 | DE19619287A1 NANO-structure on substrate formation method for microelectronics |
11/20/1997 | DE19618447A1 Lithographisches Verfahren zur Erzeugung von Nanostrukturen auf Oberflächen A lithographic method for the generation of nanostructures on surfaces |
11/20/1997 | DE19612692C1 Two=stage dry and wet thermal oxidation of silicon carbide surface |
11/19/1997 | EP0807977A2 Semiconductor device including protection means |
11/19/1997 | EP0807974A1 Multilayer interconnections having a low lateral parasitic capacitance |
11/19/1997 | EP0807973A2 Plastic molded type semiconductor device and method of manufacturing the same |
11/19/1997 | EP0807971A2 Ultrahigh-frequency electronic component and method of manufacturing the same |
11/19/1997 | EP0807970A1 Method of manufacturing a thin semiconductor layer |
11/19/1997 | EP0807969A1 Semiconductor integrated circuit |
11/19/1997 | EP0807968A2 Etching a metal silicide with HC1 and chlorine |
11/19/1997 | EP0807967A2 Diffused titanium resistor and method for fabricating same |
11/19/1997 | EP0807966A1 Heat treatment method for semiconductor substrate |