H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/1997
12/10/1997	CN1167340A Air-bridge structure of integrated circuit and making method thereof
12/10/1997	CN1167339A Semiconductor device, making method and composition type semiconductor device
12/10/1997	CN1167338A Method for making semiconductor device
12/10/1997	CN1167337A Trough for chemical corrosion
12/10/1997	CN1167336A Method for making multi-layer amorphous silicon
12/10/1997	CN1167335A Semiconductor checking device
12/10/1997	CA2207154A1 Inductively coupled source for deriving substantially uniform plasma flux
12/09/1997	US5696953 Method and apparatus for power management of an integrated circuit
12/09/1997	US5696835 Apparatus and method for aligning and measuring misregistration
12/09/1997	US5696727 Semiconductor memory device provided with sense amplifier capable of high speed operation with low power consumption
12/09/1997	US5696718 Device having an electrically erasable non-volatile memory and process for producing such a device
12/09/1997	US5696665 Integrated circuit package with diamond heat sink
12/09/1997	US5696581 Lens evaluating device
12/09/1997	US5696406 Semiconductor device and method for fabricating the same
12/09/1997	US5696404 Semiconductor wafers with device protection means and with interconnect lines on scribing lines
12/09/1997	US5696402 Integrated circuit device
12/09/1997	US5696400 MOS-type semiconductor integrated circuit device
12/09/1997	US5696399 Process for manufacturing MOS-type integrated circuits
12/09/1997	US5696397 Input protection circuit and method of fabricating semiconductor integrated circuit
12/09/1997	US5696395 Dynamic random access memory with fin-type stacked capacitor
12/09/1997	US5696394 Capacitor having a metal-oxide dielectric
12/09/1997	US5696393 Method and apparatus for reducing blooming in output of a CCD image sensor
12/09/1997	US5696391 Overload protection circuit
12/09/1997	US5696388 Thin film transistors for the peripheral circuit portion and the pixel portion
12/09/1997	US5696387 Thin film transistor in a liquid crystal display having a microcrystalline and amorphous active layers with an intrinsic semiconductor layer attached to same
12/09/1997	US5696386 Aluminum nitride film on substrate, silicon oxide layer, silicon layer, wiring material of a metal or semiconductor with insulator between wiring layer and third layer
12/09/1997	US5696384 Composition for formation of electrode pattern
12/09/1997	US5696383 Method and apparatus for measuring the curvature of wafers with beams of different wavelengths
12/09/1997	US5696377 Hybrid infrared ray detector with an improved bonding structure between an Si-substrate having integrated circuits and an HgCdTe layer having two-dimensional photodiode arrays and method for fabricating the same
12/09/1997	US5696329 Die bond touch down detector
12/09/1997	US5696036 High speed spinning, spraying deionized water to dissolve and remove ammonium chloride defects
12/09/1997	US5696035 Etchant, etching method, and method of fabricating semiconductor device
12/09/1997	US5696034 Method for producing semiconductor substrate
12/09/1997	US5696033 Method for packaging a semiconductor die
12/09/1997	US5696032 Tape application platform and processes therefor
12/09/1997	US5696031 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
12/09/1997	US5696030 Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor
12/09/1997	US5696028 Forming emitter tip on substrate, disposing insulators adjacent tip, disposing conductive layer, planarizing, selectively removing portions of insulator to expose tip
12/09/1997	US5696025 Method of forming guard ringed schottky diode
12/09/1997	US5696023 Wet thermal oxidation
12/09/1997	US5696022 Method for forming field oxide isolation film
12/09/1997	US5696021 Method of making a field oxide isolation structure
12/09/1997	US5696020 Method for fabricating semiconductor device isolation region using a trench mask
12/09/1997	US5696019 Self-aligned trench isolation for memory array using sidewall spacers
12/09/1997	US5696018 Method of forming conductive noble-metal-insulator-alloy barrier layer for high-dielectric-constant material electrodes
12/09/1997	US5696017 Vapor depositing a metal electrode to switching transistor, covering with a dielectric layer
12/09/1997	US5696016 Forming n and p wells on silicon substrate, depositing gate oxide layer, forming gates, doped drains, dielectric sidewall spacers, depositing and patterning phosphosilicate glass, forming metallization layer
12/09/1997	US5696015 Method of fabricating capacitor structures for inclusion within semiconductor devices
12/09/1997	US5696014 Method for increasing capacitance of an HSG rugged capacitor using a phosphine rich oxidation and subsequent wet etch
12/09/1997	US5696013 Method of manufacturing semiconductor device having unit circuit-blocks
12/09/1997	US5696012 Fabrication method of semiconductor memory device containing CMOS transistors
12/09/1997	US5696011 Method for forming an insulated gate field effect transistor
12/09/1997	US5696010 Method of forming a semiconductor device including a trench
12/09/1997	US5696009 Filling the trenches with electroconductive material, forming source/drain regions and increasing current flow, preventing current leakage
12/09/1997	US5696008 Semiconductor device and method of manufacturing the same
12/09/1997	US5696007 Method for manufacturing a super self-aligned bipolar transistor
12/09/1997	US5696006 Method of manufacturing Bi-MOS device
12/09/1997	US5696004 Method of producing semiconductor device with a buried layer
12/09/1997	US5696003 Heat treatment of a patterned amorphous silicon film, crystallizing to confining the areas into which catalyst has been introduced in
12/09/1997	US5695894 Method and apparatus for changing the scale of a pattern printed from a total internal reflection hologram
12/09/1997	US5695872 Thermally conductive, electrically insulating glued connection, method for the production thereof and employment thereof
12/09/1997	US5695831 CVD method for forming a metallic film on a wafer
12/09/1997	US5695815 Metal carboxylate complexes for formation of metal-containing films on semiconductor devices
12/09/1997	US5695810 Use of cobalt tungsten phosphide as a barrier material for copper metallization
12/09/1997	US5695667 Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
12/09/1997	US5695661 For semiconductors; pretreatment with surfactant; buffered oxide etchant
12/09/1997	US5695660 Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
12/09/1997	US5695658 Non-photolithographic etch mask for submicron features
12/09/1997	US5695602 Process of etching silicon nitride layer by using etching gas containing sulfur hexafluoride, hydrogen bromide and oxygen
12/09/1997	US5695601 Method for planarizing a semiconductor body by CMP method and an apparatus for manufacturing a semiconductor device using the method
12/09/1997	US5695593 Method of centering a high pressure lid seal
12/09/1997	US5695572 Cleaning agent and method for cleaning semiconductor wafers
12/09/1997	US5695570 Purification by covering with water, radiating with ultraviolet light, drainage, drying with nitrogen
12/09/1997	US5695569 Removal of metal contamination
12/09/1997	US5695568 Chemical vapor deposition chamber
12/09/1997	US5695566 Apparatus and method for plasma-processing
12/09/1997	US5695564 Multichamber system wherein transfer units and desired number of process units each with separate inert gas supply and exhaust systems are connected via interconnection units
12/09/1997	US5695562 Processing apparatus
12/09/1997	US5695557 Anodizing, epitaxial vapor depositing, grinding, etching with only one heating step
12/09/1997	US5695556 Obtaining relationship between film thickness of compound semiconductor layer and photoluminescence intensity, designating as said critical film thickness the thickness where photoluminescence exhibits a peak
12/09/1997	US5695386 Cleaning method using abrasive tape
12/09/1997	CA2120804C Apparatus and method for assembling and checking microwave monolithic integrated circuit (mmic) module
12/09/1997	CA2089435C Semiconductor device
12/09/1997	CA2077406C Process for flip chip connecting semiconductor chip
12/07/1997	CA2206232A1 Method and apparatus for depositing diamond film
12/04/1997	WO1997046062A1 Method of forming raised metallic contacts on electrical circuits for permanent bonding
12/04/1997	WO1997046061A1 Method of forming raised metallic contacts on electrical circuits
12/04/1997	WO1997046057A1 Plasma treatment apparatus and plasma treatment method
12/04/1997	WO1997045955A1 Electronic component, in particular a component using acoustical surface acoustic waves
12/04/1997	WO1997045880A1 METHOD FOR FORMING CdTe FILM AND SOLAR BATTERY USING THE FILM
12/04/1997	WO1997045877A1 Semiconductor device and its manufacture
12/04/1997	WO1997045873A1 Conductors for integrated circuits
12/04/1997	WO1997045871A1 Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof
12/04/1997	WO1997045868A1 Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them
12/04/1997	WO1997045867A1 Tool chip, bonding tool with the tool chip, and method for controlling the bonding tool
12/04/1997	WO1997045866A1 Mechanism for uniform etching by minimizing effects of etch rate loading
12/04/1997	WO1997045865A2 A thin-film electronic device and a method of manufacturing such a device
12/04/1997	WO1997045864A1 Improved method of polycrystalline silicon hydrogenation
12/04/1997	WO1997045863A1 Radial multiple chamber microelectronics processing apparatus and process of making and using the apparatus
12/04/1997	WO1997045862A1 Non-contact holder for wafer-like articles

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