H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1997
10/30/1997	DE19710237A1 Fine wet etching of especially silicon substrate
10/30/1997	DE19706076A1 Observation apparatus with charge couple device two=dimensional sensor that uses time delay integration system
10/30/1997	DE19704659A1 Galvanically deposited contact bump manufacturing method for integrated circuit bonding
10/30/1997	DE19651982A1 Thin film semiconductor component, e.g. SOI or MOSFET DRAM
10/30/1997	CA2252564A1 Injection molding apparatus and method
10/30/1997	CA2252562A1 Improvement in injection molding apparatus
10/30/1997	CA2252379A1 Grid array assembly and method of making
10/29/1997	EP0803947A2 Circuit in cmos technology for high speed driving of optical sources
10/29/1997	EP0803913A1 Schottky diode device and method for its fabrication
10/29/1997	EP0803912A1 Field effect transistor
10/29/1997	EP0803911A2 Channel structure of field effect transistor and CMOS element
10/29/1997	EP0803909A1 Semiconductor integrated circuit device having an interrupting circuit connected between a substrate potential detecting circuit and a common conductive line for reducing damage due to static electric charges
10/29/1997	EP0803908A2 Semiconductor device including protection means
10/29/1997	EP0803907A2 Ribbon, bonding wire and microwave circuit package
10/29/1997	EP0803906A2 Tape carrier package and liquid crystal display device
10/29/1997	EP0803905A2 Method of making semiconductor devices by patterning a wafer having a non-planar surface
10/29/1997	EP0803904A2 Substrate support
10/29/1997	EP0803903A2 Automatic visual inspection and failure categorization system
10/29/1997	EP0803902A2 Semiconductor device with on-board memory areas for test purposes
10/29/1997	EP0803901A2 Method of mounting a plurality of semiconductor devices in corresponding supporters
10/29/1997	EP0803900A2 Surface preparation to enhance the adhesion of a dielectric layer
10/29/1997	EP0803897A2 Electrode for plasma etching
10/29/1997	EP0803896A2 Plasma processing system and protective member used for the same
10/29/1997	EP0803895A2 Electrode for plasma etching
10/29/1997	EP0803894A1 Combined ion beam and microwave irradiation means and method
10/29/1997	EP0803874A2 Semiconductor memory device
10/29/1997	EP0803777A1 Undercoating composition for photolithographic resist
10/29/1997	EP0803776A2 Composition for anti-reflection coating
10/29/1997	EP0803660A1 Feed screw and method of forming film of lubricant
10/29/1997	EP0803594A1 Crystal growing substrate
10/29/1997	EP0803588A1 Vapor phase growth method and growth apparatus
10/29/1997	EP0803542A2 Electrically conductive silicone elastomer compositions and use for manufacturing semiconductor devices
10/29/1997	EP0803471A2 Mixture of metalloid oxide/metal-cerium oxide
10/29/1997	EP0803329A2 Polishing machine
10/29/1997	EP0803327A2 Apparatus and method for shaping polishing pads
10/29/1997	EP0803132A1 Flip chip bonding with non-conductive adhesive
10/29/1997	EP0803131A1 Novel transistor with ultra shallow tip and method of fabrication
10/29/1997	EP0802988A1 Method of forming diamond-like carbon film (dlc), dlc film formed thereby, use of the same, field emitter array and field emitter cathodes
10/29/1997	EP0802835A1 Surface modification processing of flat panel device substrates
10/29/1997	EP0763259A4 Punch-through field effect transistor
10/29/1997	EP0724775A4 RECRYSTALLIZATION METHOD TO SELENIZATION OF THIN-FILM Cu(In,Ga)Se2 FOR SEMICONDUCTOR DEVICE APPLICATIONS
10/29/1997	EP0721660A4 Method for assembling an electronic package
10/29/1997	EP0694209A4 ENHANCED QUALITY THIN FILM Cu(In,Ga)Se 2 FOR SEMICONDUCTOR DEVICE APPLICATIONS BY VAPOR-PHASE RECRYSTALLIZATION
10/29/1997	EP0662990B1 Novolak resin mixtures
10/29/1997	CN1163683A Substrate housing and docking system
10/29/1997	CN1163675A Wafer cushions for wafer shipper
10/29/1997	CN1163637A Method for directly depositing metal containing patterned films
10/29/1997	CN1163543A Protective parts for telephone line interface
10/29/1997	CN1163490A Semiconductor device and its producing method
10/29/1997	CN1163489A Semiconductor device and its producing method
10/29/1997	CN1163487A Semiconductor and its producing method
10/29/1997	CN1163479A Semiconductor device and its producing technology
10/29/1997	CN1163478A Electronic module and its producing method and its used lead wire frame and metal mould
10/29/1997	CN1163476A Processing device for fine nanometer-level plane structure
10/29/1997	CN1163475A Mixed packing semiconductor integrate circuit device of controller mass storage and measuring method
10/29/1997	CN1163474A Method for producing semiconductor device
10/29/1997	CN1163462A Semiconductor integrate circuit device for internal power circuit with overcoming load fluctuation and keeping stable output level
10/29/1997	CN1163227A Conveyer
10/29/1997	CN1036257C Apparatus for packaging semi-conductor device and its method
10/28/1997	US5682589 Multilayer; overcoated with tungsten, molybdenum alloy
10/28/1997	US5682343 Hierarchical bit line arrangement in a semiconductor memory
10/28/1997	US5682323 Computer implemented method
10/28/1997	US5682243 Method of aligning a substrate
10/28/1997	US5682242 Method and apparatus for determining a location on a surface of an object
10/28/1997	US5682211 Integrated dark matrix for an active matrix liquid crystal display with pixel electrodes overlapping gate data lines
10/28/1997	US5682120 Differential amplifier circuit using lateral-type bipolar transistors with back gates
10/28/1997	US5682118 Circuit for controlling the voltages between well and sources of the transistors of and MOS logic circuit, and system for slaving the power supply to the latter including the application thereof
10/28/1997	US5682105 Bonding option circuit having no pass-through current
10/28/1997	US5682104 Electron beam tester and testing method using the same
10/28/1997	US5682066 Microelectronic assembly including a transparent encapsulant
10/28/1997	US5682065 Semiconductor wafer
10/28/1997	US5682064 Repairable wafer scale integration system
10/28/1997	US5682062 System for interconnecting stacked integrated circuits
10/28/1997	US5682061 Component for connecting a semiconductor chip to a substrate
10/28/1997	US5682060 Process for manufacturing integrated circuit capacitors and resistors and the capacitors and resistors
10/28/1997	US5682059 Semiconductor device including anti-fuse element and method of manufacturing the device
10/28/1997	US5682057 Semiconductor device incorporating a temperature fuse
10/28/1997	US5682056 Phase shifting mask and method of manufacturing same
10/28/1997	US5682055 Method of forming planarized structures in an integrated circuit
10/28/1997	US5682054 Rectifying transfer gate device
10/28/1997	US5682053 Silicon wafer having substrate and monocrystalline silicon layer separated by buried silicon dioxide layer
10/28/1997	US5682052 Method for forming isolated intra-polycrystalline silicon structure
10/28/1997	US5682051 CMOS integrated circuit with reduced susceptibility to PMOS punchthrough
10/28/1997	US5682049 Method and apparatus for trimming an electrical value of a component of an integrated circuit
10/28/1997	US5682048 Groove-type semiconductor device
10/28/1997	US5682046 Multilayer; support, current collector, emitter and electrodes
10/28/1997	US5682045 Doping the electron supply layer indium-aluminum-arsenic, heating to infiltrate fluorine, reheating to remove fluorine
10/28/1997	US5682040 Compound semiconductor device having a reduced resistance
10/28/1997	US5682018 Interface regions between metal and ceramic in a metal/ceramic substrate
10/28/1997	US5681888 Blend with liquid crystal polyester; holder with grooves; stiffness; dimensional stability; antistatic properties
10/28/1997	US5681780 Heating at high temperature then low temperature
10/28/1997	US5681779 Method of doping metal layers for electromigration resistance
10/28/1997	US5681778 Semiconductor processing method of forming a buried contact and conductive line
10/28/1997	US5681777 Process for manufacturing a multi-layer tab tape semiconductor device
10/28/1997	US5681776 Planar selective field oxide isolation process using SEG/ELO
10/28/1997	US5681775 Soi fabrication process
10/28/1997	US5681774 Method of fabricating a toothed-shape capacitor node using a thin oxide as a mask
10/28/1997	US5681773 Method for forming a DRAM capacitor
10/28/1997	US5681772 Through glass ROM code implant to reduce product delivering time
10/28/1997	US5681771 Method of manufacturing a LDD transistor in a semiconductor device

1 ... 5856 5857 5858 5859 5860 5861 5862 5863 5864 5865 5866 5867 5868 5869 5870 5871 5872 5873 5874 5875 5876 ... 6590