| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 10/07/1997 | US5674646 Providing transparent layer, forming opaque layer, etching, forming resist layer, exposing, developing resist pattern, removing resist to uncover phase shift region adapted for transmitting exposure light impinging thereon |
| 10/07/1997 | US5674566 Process and device for processing plate-like workpieces |
| 10/07/1997 | US5674410 Chemical agent producing device and method thereof |
| 10/07/1997 | US5674409 Maskless etching the patterned photoresist layer which having at least one non-volatile material distributed within |
| 10/07/1997 | US5674406 Stopper manufacturing method of a silicon micromachining structure |
| 10/07/1997 | US5674366 Method and apparatus for fabrication of dielectric thin film |
| 10/07/1997 | US5674357 Oxygen plasma oxidation of particulate residue remaining after reactive ion etching, rinsing residue away with deionized water while patterned layer remains |
| 10/07/1997 | US5674356 Method for forming a semiconductor device in which an anti reflective layer is formed by varying the composition thereof |
| 10/07/1997 | US5674355 Diamond-like carbon for use in VLSI and ULSI interconnect systems |
| 10/07/1997 | US5674354 Precise control of conductive path width by masking, then anisotropic etching |
| 10/07/1997 | US5674352 Process related to a modified polishing pad for polishing |
| 10/07/1997 | US5674343 Method for manufacturing a semiconductor |
| 10/07/1997 | US5674321 Method and apparatus for producing plasma uniformity in a magnetic field-enhanced plasma reactor |
| 10/07/1997 | US5674304 Method of heat-treating a glass substrate |
| 10/07/1997 | US5674123 Docking and environmental purging system for integrated circuit wafer transport assemblies |
| 10/07/1997 | US5674039 System for transferring articles between controlled environments |
| 10/07/1997 | US5673922 Apparatus for centering substrates on support members |
| 10/07/1997 | US5673846 Solder anchor decal and method |
| 10/07/1997 | US5673845 For connecting a bond pad and a lead finger |
| 10/07/1997 | US5673804 Hoist system having triangular tension members |
| 10/07/1997 | US5673795 Discrete packaging system for electronic device |
| 10/07/1997 | US5673750 Vacuum processing method and apparatus |
| 10/07/1997 | US5673730 Form tooling and method of forming semiconductor package leads |
| 10/07/1997 | US5673713 Apparatus for cleansing semiconductor wafer |
| 10/07/1997 | US5673562 Bulk delivery of ultra-high purity gases at high flow rates |
| 10/07/1997 | US5673476 Anode bonding method for selected regions |
| 10/02/1997 | WO1997036334A1 Laminated structure which is stable with respect to climate and corrosion |
| 10/02/1997 | WO1997036333A1 Tunnelling device and method of producing a tunnelling device |
| 10/02/1997 | WO1997036332A1 Floating gate non-volatile memory device, and a method of manufacturing the device |
| 10/02/1997 | WO1997036331A1 REDUCING REVERSE SHORT-CHANNEL EFFECT WITH LIGHT DOSE OF P WITH HIGH DOSE OF As IN N-CHANNEL LDD |
| 10/02/1997 | WO1997036330A1 Memory cell design with vertically stacked crossovers |
| 10/02/1997 | WO1997036329A1 Insulated gate bipolar transistor having a trench and a method for production thereof |
| 10/02/1997 | WO1997036328A1 Bipolar transistor with high-energy-implanted collector, and production process thereof |
| 10/02/1997 | WO1997036327A1 A semiconductor processing method for forming a contact pedestal for a storage node of a capacitor in integrated circuitry |
| 10/02/1997 | WO1997036324A1 Active matrix displays and method of making |
| 10/02/1997 | WO1997036323A1 Method of doping trench sidewalls before trench etching |
| 10/02/1997 | WO1997036322A1 Methods and apparatus for minimizing etch rate loading |
| 10/02/1997 | WO1997036321A1 Process to separate the doping of polygate and source drain regions |
| 10/02/1997 | WO1997036318A2 A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR LAYER OF SiC AND SUCH A DEVICE |
| 10/02/1997 | WO1997036317A2 A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR LAYERS OF SiC BY THE USE OF AN IMPLANTING STEP AND A DEVICE PRODUCED THEREBY |
| 10/02/1997 | WO1997036316A2 A FIELD CONTROLLED SEMICONDUCTOR DEVICE OF SiC AND A METHOD FOR PRODUCTION THEREOF |
| 10/02/1997 | WO1997036315A2 A transistor having a vertical channel and a method for production thereof |
| 10/02/1997 | WO1997036314A2 A FIELD EFFECT TRANSISTOR OF SiC AND A METHOD FOR PRODUCTION THEREOF |
| 10/02/1997 | WO1997036313A2 A FIELD CONTROLLED SEMICONDUCTOR DEVICE OF SiC AND A METHOD FOR PRODUCTION THEREOF |
| 10/02/1997 | WO1997036209A1 Solutions and processes for removal of sidewall residue after dry-etching________________________________________________________ |
| 10/02/1997 | WO1997036025A1 Process for producing silicon single crystal |
| 10/02/1997 | WO1997036022A1 Plasma producing method and apparatus including an inductively-coupled plasma source |
| 10/02/1997 | WO1997035939A1 Coating fluid for low-permittivity silica coating and substrate provided with low-permittivity coating |
| 10/02/1997 | WO1997035701A1 Press for encapsulating electronic components and methods for use of the press |
| 10/02/1997 | WO1997030418A3 Method and device for bonding a wire conductor |
| 10/02/1997 | WO1997026678A3 A semiconductor device with a low resistance ohmic contact between a metal layer and a sic-layer |
| 10/02/1997 | DE19709761A1 Electron beam exposure apparatus for semiconductor circuit manufacture |
| 10/02/1997 | DE19708702A1 Apparatus for producing semiconductors |
| 10/02/1997 | DE19651247A1 Input=output protection circuit for SOI with field effect transistor |
| 10/02/1997 | DE19651122A1 Semiconductor mounting chip device e.g. ball grid array |
| 10/02/1997 | DE19650296A1 Semiconductor device, e.g. ball grid array, production method |
| 10/02/1997 | DE19642538A1 Semiconducting device |
| 10/02/1997 | DE19638684A1 Semiconductor device, e.g. field effect transistor, with contact hole for DRAM cell |
| 10/02/1997 | DE19612939A1 Semiconductor surface structure quality measuring method for integrated circuit manufacture |
| 10/02/1997 | DE19612671A1 Programmable micro-electronic memory cell esp. for CD memory application |
| 10/02/1997 | DE19612114A1 Receiver element, e.g. semiconductor integrated circuit, adjusting device for clean room |
| 10/02/1997 | DE19611692A1 Bipolartransistor mit Hochenergie-implantiertem Kollektor und Herstellverfahren Bipolar high-energy implanted collector and manufacturing |
| 10/01/1997 | EP0798955A1 Method of and apparatus for peeling off chips |
| 10/01/1997 | EP0798860A2 High voltage level shift circuit including cmos transistor having thin gate insulating film |
| 10/01/1997 | EP0798785A1 High-voltage-resistant MOS transistor, and corresponding manufacturing process |
| 10/01/1997 | EP0798784A2 LED display packaging with substrate removal and method of fabrication |
| 10/01/1997 | EP0798780A2 Semiconductor device, manufacturing method thereof and aggregate type semiconductor device |
| 10/01/1997 | EP0798778A2 Method of manufacturing a semiconductor device of multilayer wire structure |
| 10/01/1997 | EP0798777A2 Method of metallizing submicronie (e.g. micronie) contact holes in semiconductor body |
| 10/01/1997 | EP0798776A2 Semiconductor device and method of producing same |
| 10/01/1997 | EP0798775A2 Semiconductor wafer chucking device and method for removing semiconductor wafer |
| 10/01/1997 | EP0798774A2 An automated non-visual method of locating periodicalliy arranged sub-micron objects |
| 10/01/1997 | EP0798773A2 Method of evaluating and method and apparatus for thermally processing semiconductor wafer |
| 10/01/1997 | EP0798772A1 Process for realizing a deposition on a detachable support, and realized deposition on a support |
| 10/01/1997 | EP0798771A2 Silicon wafer comprising an amorphous silicon layer and method of manufacturing the same by plasma enhanced chemical vapor deposition (PECVD) |
| 10/01/1997 | EP0798770A2 Silicon wafer with superimposed polycrystalline silicon films on one main surface and its fabrication method |
| 10/01/1997 | EP0798769A2 Dielectric layers for semiconductors |
| 10/01/1997 | EP0798768A1 Method of fabrication of an optical component on a cristalline silicon substrate |
| 10/01/1997 | EP0798767A2 Removal of carbon from substrate surface |
| 10/01/1997 | EP0798766A1 Method of manufacturing a monocrystalline semiconductor wafer with mirror-finished surface including a gas phase etching and a heating step, and wafers manufactured by said method |
| 10/01/1997 | EP0798765A2 Method of manufacturing a semiconductor wafer comprising a dopant evaporation preventive film on one main surface and an epitaxial layer on the other main surface |
| 10/01/1997 | EP0798764A2 Hollow package manufacturing method and apparatus |
| 10/01/1997 | EP0798763A2 Method and apparatus of transferring wafers |
| 10/01/1997 | EP0798762A2 Automated semiconductor processing systems |
| 10/01/1997 | EP0798667A2 A mesh generation device and its method for generating meshes having a boundary protective layer |
| 10/01/1997 | EP0798598A2 Method of processing resist onto substrate and resist processing apparatus |
| 10/01/1997 | EP0798597A1 Negative working photoresist composition based on polyimide primers |
| 10/01/1997 | EP0798547A2 A method and apparatus for infrared pyrometer calibration in a thermal processing system |
| 10/01/1997 | EP0798405A2 Method of manufacturing semiconductor wafers |
| 10/01/1997 | EP0798404A2 Apparatus for manufacturing single crystal of silicon |
| 10/01/1997 | EP0798403A1 Continuously charged czochralski method of manufacturing silicon monocrystal, and dopant feeding apparatus |
| 10/01/1997 | EP0798355A2 Base material for adhesive tape |
| 10/01/1997 | EP0798278A2 Aluminium nitride sintered body, metal embedded article, electronic functional material and electrostatic chuck |
| 10/01/1997 | EP0798276A1 Alumina sintered bodies and method for producing the same |
| 10/01/1997 | EP0798079A2 Polishing apparatus and polishing method for silicon wafers |
| 10/01/1997 | EP0798078A2 Method for manufacturing backing pad and apparatus used therefor |
| 10/01/1997 | EP0797863A1 Magnetic transmission couplings |
| 10/01/1997 | EP0797844A2 Electronic device manufacture |
| 10/01/1997 | EP0797842A1 A method of fabricating ldd mos transistors utilizing high energy ion implant through an oxide layer |
| 10/01/1997 | EP0797841A1 Method for fabricating asymmetrical ldd mos devices |