Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1998
10/20/1998US5824576 Method of forming complementary type conductive regions on a substrate
10/20/1998US5824575 Semiconductor device and method of manufacturing the same
10/20/1998US5824574 Single crystal silicon, thin film transistor
10/20/1998US5824573 Method of manufacturing a semiconductor device
10/20/1998US5824572 Method of manufacturing thin film transistor
10/20/1998US5824571 Multi-layered contacting for securing integrated circuits
10/20/1998US5824570 Method for designing a semiconductor integrated circuit
10/20/1998US5824569 Semiconductor device having ball-bonded pads
10/20/1998US5824568 Process of making an integrated circuit chip composite
10/20/1998US5824567 Methods for wavelength discrimination of monochromatic light beams
10/20/1998US5824564 Method of manufacturing thin-film transistor array substrate
10/20/1998US5824563 Method for forming lower electrode of capacitor
10/20/1998US5824562 Manufacturing method for filling a trench or contact hole in a semiconductor device
10/20/1998US5824560 Method of manufacturing a semiconductor device with BICMOS circuit
10/20/1998US5824457 Sealing the edge of wafers by exposing ultra violet light on a rotatable chuck
10/20/1998US5824455 Processing method and apparatus
10/20/1998US5824454 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material
10/20/1998US5824453 Gallium arsenide with silicon nitride layer, forming a pattern using photolithography, masking, wet etching and forming grooves
10/20/1998US5824452 Excimer laser lithography; crosslinkable copolymer consisting of vinyl monomer, (meth)acrylic ester, (meth)acrylamide, (meth)acrylic acid, adamantyl (meth)acrylate
10/20/1998US5824440 Method of fabricating X-ray mask
10/20/1998US5824439 Phase shifiting mask and method of manufacturing the same
10/20/1998US5824438 Structure of phase shifting mask and method of manufacturing the same comprising an adhesive layer between a phase shift layer and a light blocking layer
10/20/1998US5824389 Micromachined microscopic particle selecting apparatus
10/20/1998US5824360 Forming a step film containing silicon covering with second glass film containing phosphorous, polishig the later
10/20/1998US5824252 Method of resin molding and resin molding machine for the same
10/20/1998US5824235 Method of manufacturing semiconductor device
10/20/1998US5824234 Method for forming low contact resistance bonding pad
10/20/1998US5824233 Micromechanical component with a dielectric movable structure, microsystem, and production process
10/20/1998US5824206 P-doped indium phosphides, wafers, cleaning the wafers and wires, placing in optical cells with counter electrodes, placing in nitric acid solution and applying negative voltage and treatment with lasers
10/20/1998US5824200 Generation of electrolytically active water and wet process of a semiconductor substrate
10/20/1998US5824186 Method and apparatus for fabricating self-assembling microstructures
10/20/1998US5824185 Wafer ring supply and return device
10/20/1998US5824177 Method for manufacturing a semiconductor device
10/20/1998US5824153 Apparatus with movable arms for holding a single-crystal semiconductor ingot
10/20/1998US5824151 N dopant, group iii and v semiconductor laser or diode, crystallization
10/20/1998US5824150 Process for forming deposited film by use of alkyl aluminum hydride
10/20/1998US5824119 Process for immersing a substrate in a plurality of processing baths
10/20/1998US5823855 Polishing pad and a method for making a polishing pad with covalently bonded particles
10/20/1998US5823853 Apparatus for the in-process detection of workpieces with a monochromatic light source
10/20/1998US5823763 Combustion device and method for use in a thermal oxidation furnace
10/20/1998US5823736 Substrate processing device and method for substrate from the substrate processing device
10/20/1998US5823593 Device for lifting wafer cassettes from a spraying tool
10/20/1998US5823419 Bonding tool
10/20/1998US5823418 Die transporting device
10/20/1998US5823361 Substrate support apparatus for a substrate housing
10/20/1998US5823351 Semiconductor crystal packaging device
10/20/1998US5822851 Method of producing a ceramic package main body
10/16/1998CA2231742A1 Composite transport carrier
10/15/1998WO1998045883A1 A bipolar transistor structure
10/15/1998WO1998045881A1 Substrate with conductor formed of low-resistance aluminum alloy
10/15/1998WO1998045880A1 Low dielectric constant material for use as an insulation element in an electronic device
10/15/1998WO1998045879A1 Silicon wafer carrier
10/15/1998WO1998045878A1 Method and covering element for encapsulating electronic components
10/15/1998WO1998045877A1 Method of manufacturing a semiconductor device having 'shallow trench isolation'
10/15/1998WO1998045876A1 Semiconductor integrated circuit device and method for manufacturing the same
10/15/1998WO1998045875A1 Temperature control device
10/15/1998WO1998045874A1 Vacuum processing apparatus with low particle generating vacuum seal
10/15/1998WO1998045846A1 High-efficiency miniature magnetic integrated circuit structures
10/15/1998WO1998045716A1 Method for making cards with multiple contact tips for testing semiconductor chips
10/15/1998WO1998045674A2 Probe tile and platform for large area wafer probing
10/15/1998WO1998045510A1 Low defect density, self-interstitial dominated silicon
10/15/1998WO1998045509A1 Low defect density silicon
10/15/1998WO1998045508A1 Low defect density, vacancy dominated silicon
10/15/1998WO1998045507A1 Low defect density, ideal oxygen precipitating silicon
10/15/1998WO1998045504A1 Article, method, and apparatus for electrochemical fabrication
10/15/1998WO1998045501A1 Method of manufacturing a semiconductor device and a device for applying such a method
10/15/1998WO1998045399A1 Ethylenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process
10/15/1998WO1998045130A1 Three dimensional structure memory
10/15/1998WO1998045095A1 Method for controlling handling robot
10/15/1998WO1998045089A1 Manufacturing method, polishing method and polishing device for semiconductor devices
10/15/1998WO1998045087A1 Improved polishing pads and methods relating thereto
10/15/1998DE19814142A1 Material for forming fine pattern in semiconductor manufacture
10/15/1998DE19750378A1 Semiconductor device with trench-type element isolation structure
10/15/1998DE19748501A1 Trench isolation structure production
10/15/1998DE19715151A1 Loading and unloading an evacuable treatment chamber
10/15/1998CA2572786A1 Method for electrochemical fabrication including etching to remove flash
10/15/1998CA2572503A1 Method for electrochemical fabrication including enhanced data manipulation
10/15/1998CA2572499A1 Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials
10/15/1998CA2285432A1 A bipolar transistor structure
10/15/1998CA2256378A1 Substrate with conductor formed of low-resistance aluminum alloy
10/14/1998EP0871284A2 X-Y Table to move loads with high precision and very high dynamic
10/14/1998EP0871227A2 Thin film transistor, manufacturing method therefor and liquid crystal display unit using the same
10/14/1998EP0871226A2 Method of manufacturing light-receiving/emitting diode array chip
10/14/1998EP0871224A2 Semiconductor device having device supplying voltage higher than power supply voltage
10/14/1998EP0871223A1 Process for the prototyping of mixed signal applications and field programmable system on a chip for applying said process
10/14/1998EP0871218A2 Intergrated CVD/PVD Al planarization using ultra-thin nucleation layers
10/14/1998EP0871217A2 Nitrogen-treated titanium or silicon layer to prevent interaction of titanium or silicon and aluminum
10/14/1998EP0871216A1 Process for fabricating SOI substrate with high-efficiency recovery from damage due to ion implantation
10/14/1998EP0871215A1 Method of fabricating a semiconductor integrated circuit device
10/14/1998EP0871214A2 Process for polishing dissimilar conductive layers in a semiconductor device
10/14/1998EP0871213A2 Method for producing vias having variable sidewall profile
10/14/1998EP0871212A1 Heat treatment apparatus
10/14/1998EP0871211A2 Plasma treatment method and manufacturing method of semiconductor device
10/14/1998EP0871210A2 Method for reducing metal contamination of silicon wafers during semiconductor manufacturing
10/14/1998EP0871209A1 Wafer-cleaning solution and process for the production thereof
10/14/1998EP0871208A2 Reduction threading dislocations by amorphization and recrystalization
10/14/1998EP0871207A1 Method and apparatus for single-side processing of disk-shaped articles
10/14/1998EP0871206A2 Temperature control system for semiconductor processing facilities
10/14/1998EP0871200A2 Low temperature etch process utilizing power splitting between electrodes in an RF plasma reactor
10/14/1998EP0871199A2 Processes depending on plasma generation