Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/1998
10/14/1998EP0871179A1 Test method and circuit for semiconductor memory
10/14/1998EP0871166A1 Apparatus for machining, recording, or reproducing, using scanning probe microscope
10/14/1998EP0871072A2 Multiple detector alignment system for photolithography
10/14/1998EP0871071A2 Method and apparatus for charged particle beam exposure
10/14/1998EP0871052A1 Confocal microscope with movable scanning table
10/14/1998EP0870852A1 Method and apparatus for preventing condensation in an exhaust passage
10/14/1998EP0870851A2 Methods and apparatus for minimizing excess aluminum accumulation in CVD chambers
10/14/1998EP0870850A1 Method and apparatus for loading and unloading an evacuable treatment chamber
10/14/1998EP0870812A2 Base material and adhesive tape using the same
10/14/1998EP0870744A1 Gas-tight article and a producing process thereof
10/14/1998EP0870627A1 Semiconductor device
10/14/1998EP0870577A2 Method for dressing a polishing pad, polishing apparatus, and method for manufacturing a semiconductor apparatus
10/14/1998EP0870535A1 Ultra-pure chemical products dilution system for use in the microelectronic industry
10/14/1998EP0870352A1 Method of manufacturing an optoelectronic semiconductor device comprising a mesa
10/14/1998EP0870332A1 Off-state gate-oxide field reduction in cmos
10/14/1998EP0870331A1 Integrated resistor networks having reduced cross talk
10/14/1998EP0870329A1 Epoxy resin based solder paste
10/14/1998EP0870327A1 Methods and apparatus for filling trenches in a semiconductor wafer
10/14/1998EP0870326A1 Manufacturing process for thin-film circuits comprising integrated capacitors
10/14/1998EP0870325A1 Microelectronic mounting with multiple lead deformation
10/14/1998EP0870324A1 Semiconductor structure using modulation doped silicate glasses
10/14/1998EP0870323A1 A method for producing a semiconductor device comprising an implantation step
10/14/1998EP0870322A1 Trenched dmos transistor with buried layer for reduced on-resistance and ruggedness
10/14/1998EP0870321A1 Esd-protected thin film capacitor structures
10/14/1998EP0870320A1 Carrier matrix for integrated microanalysis systems, method for the production thereof and use of the same
10/14/1998EP0870319A1 A method for the manufacturing of micromachined structures and a micromachined structure manufactured using such method
10/14/1998EP0870254A1 Method and apparatus for point landmark design of integrated circuits
10/14/1998EP0870218A2 Method and system for assessing a measurement procedure and measurement-induced uncertainties on a batchwise manufacturing process of discrete products
10/14/1998EP0870188A1 Variable spot-size scanning apparatus
10/14/1998EP0870072A1 Gas injection system for semiconductor processing
10/14/1998EP0796507B1 Contoured-tub fermi-threshold field effect transistor and method of forming same
10/14/1998EP0792388B1 Method for directly depositing metal containing patterned films
10/14/1998EP0734586A4 Method for fabricating self-assembling microstructures
10/14/1998EP0664050B1 Device for transporting wafer magazines
10/14/1998EP0664049B1 Conveyor for magazines receiving disk-shaped objects
10/14/1998CN1196136A Polysilicon resistor and method of manufacturing it
10/14/1998CN1196134A Programmable non-volatile bidirectional switch for programmable logic
10/14/1998CN1195962A Assembly and method of assembly
10/14/1998CN1195893A 半导体器件 Semiconductor devices
10/14/1998CN1195892A Static semiconductor memory device capable of enhancing access speed
10/14/1998CN1195889A Method for making self-aligning silicide
10/14/1998CN1195888A Semiconductor device and manufacture method thereof
10/14/1998CN1195887A Flexible tape substrate for semiconductor chip package and method of manufacturing such package
10/14/1998CN1195886A Method for manufacturing semiconductor element
10/14/1998CN1195885A Method for fabricating semiconductor device
10/14/1998CN1195884A Method for manufacturing semiconductor device using planarization technique
10/14/1998CN1195883A 欧姆电极的形成方法及半导体装置 The method for forming an ohmic electrode and a semiconductor device
10/14/1998CN1195882A Method and apparatus for ion implantation
10/14/1998CN1195881A Ion implantation process simulation device and simulation method therefor
10/14/1998CN1195880A Thin film formation process
10/14/1998CN1195879A Method for manufacturing semiconductor
10/14/1998CN1195794A Nanometre needle hole probe in soft X-ray non-redundant hologram technique and its preparing method
10/14/1998CN1195763A Drying apparatus and method
10/14/1998CN1195602A Transfer device and method in handler system
10/14/1998CN1040267C Transistor and method for fabricating the same
10/13/1998US5822717 Method and apparatus for automated wafer level testing and reliability data analysis
10/13/1998US5822567 Method of and apparatus for simulating integrated circuit
10/13/1998US5822498 Teaching method for loading arm for objects to be processed
10/13/1998US5822389 Alignment apparatus and SOR X-ray exposure apparatus having same
10/13/1998US5822264 Dynamic semiconductor memory device with SOI structure and body refresh circuitry
10/13/1998US5822257 Semiconductor memory device capable of relieving fixed-failure memory cells and refresh-failure memory cells
10/13/1998US5822255 Semiconductor integrated circuit for supplying a control signal to a plurality of object circuits
10/13/1998US5822248 Non-volatile semiconductor memory device using folded bit line architecture
10/13/1998US5822243 Integrated circuit memory
10/13/1998US5822242 Asymmetric virtual ground p-channel flash cell with latid n-type pocket and method of fabrication therefor
10/13/1998US5822241 DRAM pass transistors
10/13/1998US5822239 Method of writing data to a single transistor type ferroelectric memory
10/13/1998US5822235 Rectifying transfer gate circuit
10/13/1998US5822213 Light detection system
10/13/1998US5822210 Manufacturing management system having SMT line
10/13/1998US5822191 Integrated circuit mounting tape
10/13/1998US5822190 Card type memory device and a method for manufacturing the same
10/13/1998US5822175 Encapsulated capacitor structure having a dielectric interlayer
10/13/1998US5822172 Apparatus and method for temperature control of workpieces in vacuum
10/13/1998US5822171 For holding a substrate on a base
10/13/1998US5822133 Optical structure and device manufacturing method using the same
10/13/1998US5822043 Exposure method and projection exposure apparatus using the same
10/13/1998US5822042 Three dimensional imaging system
10/13/1998US5821805 Charge pump circuit having different threshold biases of the transistors
10/13/1998US5821804 Integrated semiconductor circuit
10/13/1998US5821797 Protection circuit for semiconductor devices
10/13/1998US5821786 Semiconductor integrated circuit having function for evaluating AC performance
10/13/1998US5821766 Method and apparatus for measuring the metallurgical channel length of a semiconductor device
10/13/1998US5821764 Interface apparatus for automatic test equipment
10/13/1998US5821762 Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate
10/13/1998US5821750 CCD magnetic field detecting apparatus
10/13/1998US5821677 Ion source block filament with laybrinth conductive path
10/13/1998US5821629 Field isolation between active regions is not field oxide but doped silicon substrate; ultra-high density static random access memory cell
10/13/1998US5821628 Semiconductor device and two-layer lead frame for it
10/13/1998US5821626 Film carrier, semiconductor device using same and method for mounting semiconductor element
10/13/1998US5821625 Structure of chip on chip mounting preventing from crosstalk noise
10/13/1998US5821624 Semiconductor device assembly techniques using preformed planar structures
10/13/1998US5821623 First metal silicide layer selected from tungsten, tintanium, tantalum and molybdenum having first stoichiometry and second metal silicide layer having second stoichiometry
10/13/1998US5821620 Semiconductor interconnectors comprising a stable diffusion barrier titanium tungsten nitride layer; high temperature, high current, adhesion, corrosion resistance
10/13/1998US5821616 Power MOS device chip and package assembly
10/13/1998US5821613 Chips having the bottom leaned of organic contaminants with ultraviolet radiation to improve adhesion to resin mold; less likely to crack under heat stress
10/13/1998US5821610 Leadframe allowing easy removal of tie bars in a resin-sealed semiconductor device
10/13/1998US5821609 Semiconductor connection component with frangible lead sections
10/13/1998US5821607 Frame for manufacturing encapsulated semiconductor devices
10/13/1998US5821606 Semiconductor device