Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/1999
04/13/1999US5893623 Structure and method for mounting semiconductor devices, and liquid crystal display
04/13/1999US5893511 Pressure sintering method for fastening electronic components on a substrate
04/13/1999US5893509 Apparatus for making wire connections on semiconductor chips
04/13/1999US5893508 Circuit board having a terminal for detecting disconnection of a bonding wire and a wire bonding apparatus using such a board
04/13/1999US5893381 Method for scrubbing work in running wash liquid
04/13/1999US5893380 Method for cleaning molding compound tablets
04/13/1999CA2249901A1 Method of fixing a plurality of lower members each having reference bore for installing upper member, and fixing jigs
04/08/1999WO1999017595A1 Solder ball placement with flux, template and laser tag
04/08/1999WO1999017594A1 Laser reflow with template for solder balls of bga packaging
04/08/1999WO1999017593A1 Fluxless laser reflow with template for solder balls of bga packaging
04/08/1999WO1999017375A1 Method of anodizing silicon substrate and method of producing acceleration sensor
04/08/1999WO1999017372A1 Heterojunction bipolar transistor having wide bandgap, low interdiffusion base-emitter junction
04/08/1999WO1999017370A1 Field-effect transistor with high packing density and method for the production thereof
04/08/1999WO1999017369A1 Integrated circuit with semiconductor comprising a structure for protection against electrostatic discharges
04/08/1999WO1999017366A1 Semiconductor component and method for the production thereof
04/08/1999WO1999017360A1 Self-aligned drain contact pmos flash memory and process for making same
04/08/1999WO1999017359A1 Interconnect structure with a low permittivity dielectric layer
04/08/1999WO1999017358A1 Improved gapfill of semiconductor structure using doped silicate glasses with multi-step deposition/anneal process
04/08/1999WO1999017357A1 Product comprised of a silicon-containing functional layer and an insulating layer of silicon dioxide, and production
04/08/1999WO1999017356A1 Semiconductor processing apparatus having linear conveyor system
04/08/1999WO1999017355A1 Semiconductor processing workpiece support with sensory subsystem for detection of wafers or other semiconductor workpieces
04/08/1999WO1999017354A1 A system for identifying defective electronic devices
04/08/1999WO1999017352A1 Method and compositions for metallizing microvias and high density interconnects in photodefined dielectrics
04/08/1999WO1999017351A1 Reduction of gate-induced drain leakage in semiconductor devices
04/08/1999WO1999017350A1 Method for patterning integrated circuit conductors
04/08/1999WO1999017349A1 Method for producing an open three-dimensional microstructure
04/08/1999WO1999017347A1 Method for forming a low-impedance conductor path area on a semiconductor substrate
04/08/1999WO1999017346A1 Method for forming solid-state nano-structures
04/08/1999WO1999017345A1 Method for thermal curing of implantation-doped silicon carbide semiconductors
04/08/1999WO1999017344A1 Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components
04/08/1999WO1999017343A1 Integrated bake and chill plate
04/08/1999WO1999017342A1 Method and apparatus for polishing and cleaning semiconductor wafers
04/08/1999WO1999017336A1 Insulating ceramic coated metallic part in a plasma sputter reactor
04/08/1999WO1999017335A1 Dual face shower head electrode for a magnetron plasma generating apparatus
04/08/1999WO1999017294A1 Dual source side polysilicon select gate structure and programming method
04/08/1999WO1999017244A1 Substrate transport apparatus
04/08/1999WO1999017155A1 Display pixels driven by silicon thin film transistors and method of fabrication
04/08/1999WO1999017146A1 Microscope stand for a wafer inspection microscope
04/08/1999WO1999017125A1 Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die
04/08/1999WO1999017074A1 Apparatus for judging whether bump height is proper or not
04/08/1999WO1999016936A1 Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
04/08/1999WO1999016930A1 Method and apparatus for deposition of carbon
04/08/1999WO1999016928A1 Large area microwave plasma apparatus with adaptable applicator
04/08/1999WO1999016926A1 Two-stage sealing system for thermally conductive chuck
04/08/1999WO1999016843A1 Polishing agent, method for chemical and mechanical planishing and use of said polishing agent to planish a semiconductor substrate
04/08/1999WO1999016842A1 Polishing agent and use thereof to planish a semiconductor substrate
04/08/1999WO1999016689A1 Semiconductor processing apparatus having wafer re-orientation mechanism
04/08/1999WO1999016580A1 Wafer processing apparatus
04/08/1999WO1999016554A1 Spin coating method and coating apparatus
04/08/1999WO1999008133A3 Stepper or scanner having two energy monitors for a laser
04/08/1999WO1999007000A3 Two bit eeprom using asymmetrical charge trapping
04/08/1999WO1999005720A3 Cmos circuit and method for the production thereof
04/08/1999WO1999005718A3 Material tablet and method for the production of a plastic composite body
04/08/1999WO1999004434A3 Hemispherical grained polysilicon semiconductor capacitor structure and method
04/08/1999WO1999004054A3 Method of using hydrogen and oxygen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom
04/08/1999WO1998057379A9 Lateral diffused mos transistor with trench source contact
04/08/1999DE19835428A1 Long life semiconductor memory device especially a FeRAM
04/08/1999DE19832552A1 New metal-air-semiconductor field effect transistor (MASFET)
04/08/1999DE19830161A1 Induction coil integration process for a semiconductor device especially an ULSI chip
04/08/1999DE19823464A1 Semiconductor device with DRAM cell and peripheral circuit areas
04/08/1999DE19823069A1 Semiconductor component with high performance, output transistor chip on semiconductor substrate
04/08/1999DE19822764A1 Correcting alignment method for system for producing semiconductors
04/08/1999DE19820040A1 Semiconductor memory
04/08/1999DE19819039A1 Semiconductor memory
04/08/1999DE19805875C1 Photo mask carrier table for micro-chip manufacture
04/08/1999DE19745678A1 Manufacture of multi integrated circuit chip modules in COB (Chip On Board) form
04/08/1999DE19743886A1 Solder paste contains copper or nickel-plated aluminium balls
04/08/1999DE19743885A1 Wire bonding by compression welding
04/08/1999DE19743692A1 Thin film silicon solar cell structure incorporates a porous silicon layer
04/08/1999DE19743349A1 Small semiconductor chips are separated from a wafer
04/08/1999DE19743342A1 Feldeffekttransistor hoher Packungsdichte und Verfahren zu seiner Herstellung Field effect transistor a high packing density and process for its preparation
04/08/1999DE19743244A1 Integrated circuit compact layout forming method
04/08/1999DE19742972A1 Verfahren zur Ausbildung eines niederohmigen Leitbahnbereichs auf einem Halbleitersubstrat A method of forming a low-Leitbahnbereichs on a semiconductor substrate
04/08/1999DE19742680A1 Cleaner for disc-shaped material such as silicon wafer
04/08/1999DE19742403A1 Verfahren zur Herstellung einer Halbleiterstruktur A process for producing a semiconductor structure
04/08/1999DE19742397A1 Verfahren zur Herstellung einer Halbleiterstruktur A process for producing a semiconductor structure
04/08/1999DE19581457C1 Handling procedure and handling tool e.g. for equipping circuit boards with micro-sized components
04/08/1999CA2304224A1 Large area microwave plasma apparatus with adaptable applicator
04/07/1999EP0907311A1 Sucked material detector, sucked material detecting method using the same detector, shift detecting method using the same detector, and cleaning method using the same detector
04/07/1999EP0907208A1 Junction field effect transistor and method of fabricating the same
04/07/1999EP0907207A2 Semiconductor device having alternating long and short contact pads with a fine pitch
04/07/1999EP0907206A1 Substrate through-contact and its fabrication method
04/07/1999EP0907205A2 Semiconductor package and method for manufacturing the same
04/07/1999EP0907204A2 Chip size package semiconductor device and method of forming the same
04/07/1999EP0907203A2 Patterning method
04/07/1999EP0907202A1 Planarization method for integrated semiconductor electronic devices
04/07/1999EP0907201A1 Planarization method for integrated semiconductor electronic devices
04/07/1999EP0907200A2 Apparatus and method for improved washing and drying of semiconductor wafers
04/07/1999EP0907111A2 Exposure method and method of producing a photolithographic mask
04/07/1999EP0907109A1 Process for device fabrication using a radiation-sensitive resist material
04/07/1999EP0907105A2 Method for fabricating photomasks having a phase shift layer
04/07/1999EP0907092A1 Method of manufacturing and testing integrated optical components
04/07/1999EP0906965A2 Silicon nitride from bis (tertiarybutylamino) silane
04/07/1999EP0906944A2 Solventless laminating adhesive with barrier properties
04/07/1999EP0906637A1 Gas delivery systems for particle beam processing
04/07/1999EP0906590A1 Lithographic projection apparatus with off-axis alignment unit
04/07/1999EP0906174A1 Workpiece inspection and handling
04/07/1999EP0750789B1 Method for obtaining a semiconductor device in silicon carbide
04/07/1999EP0597745B1 Fusible circuit for integrated circuit
04/07/1999EP0590148B1 Method and apparatus for thin film formation, device, electro-magnetic apparatus, data recording/reproduction apparatus and signal processor