Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/1999
04/20/1999US5895946 MOS random access memory having array of trench type one-capacitor/one-transistor memory cells
04/20/1999US5895945 Single polysilicon neuron MOSFET
04/20/1999US5895944 Charge coupled device image sensor and method of driving the same
04/20/1999US5895942 Fuse selectable modules
04/20/1999US5895941 Etchant that can etch wsi selectively with respect to inalas or ingaas. aqueous solution that contains citric acid, ammonium citrate, and hydrogen peroxide
04/20/1999US5895940 Integrated circuit buffer devices having built-in electrostatic discharge protection thyristors
04/20/1999US5895939 Silicon carbide field effect transistor with increased avalanche withstand capability
04/20/1999US5895938 Semiconductor device using semiconductor BCN compounds
04/20/1999US5895937 Tapered dielectric etch in semiconductor devices
04/20/1999US5895935 Display device having a switch with floating regions in the active layer
04/20/1999US5895933 Semiconductor device and method for its preparation
04/20/1999US5895925 Mask used in charged particle beam projecting apparatus and method for dividing pattern
04/20/1999US5895924 Charged particle beam exposure method and apparatus
04/20/1999US5895923 Ion beam shield for implantation systems
04/20/1999US5895887 Semiconductor device
04/20/1999US5895766 Method of forming a field effect transistor
04/20/1999US5895740 Method of forming contact holes of reduced dimensions by using in-situ formed polymeric sidewall spacers
04/20/1999US5895737 Method for adjusting an illumination field based on selected reticle feature
04/20/1999US5895736 Radiating beam uniform in current density through aperture plate to electron resist layer
04/20/1999US5895735 Phase shift masks including first and second radiation blocking layer patterns, and methods of fabricating and using the same
04/20/1999US5895706 Epitaxial structure for GaP light-emitting diode
04/20/1999US5895620 Process for encapsulating an electronic component
04/20/1999US5895596 Model based temperature controller for semiconductor thermal processors
04/20/1999US5895583 Reduces polishing time to a matter of hours.
04/20/1999US5895562 Gas shielding during plating
04/20/1999US5895551 Plasma etching apparatus
04/20/1999US5895550 To enhance the planarization of semiconductor substrate wafer surfaces.
04/20/1999US5895549 Method and apparatus for etching film layers on large substrates
04/20/1999US5895548 High power microwave plasma applicator
04/20/1999US5895530 Method and apparatus for directing fluid through a semiconductor processing chamber
04/20/1999US5895527 Single crystal pulling apparatus
04/20/1999US5895509 Abrasive composition
04/20/1999US5895460 Apparatus for simulating a biological neuron
04/20/1999US5895312 Apparatus for removing surface irregularities from a flat workpiece
04/20/1999US5895274 High-pressure anneal process for integrated circuits
04/20/1999US5895273 Silicon sidewall etching
04/20/1999US5895272 Ion-implanted resist removal method
04/20/1999US5895271 Metal film forming method
04/20/1999US5895269 Methods for preventing deleterious punch-through during local interconnect formation
04/20/1999US5895268 High pressure nitridation of tungsten
04/20/1999US5895267 Method to obtain a low resistivity and conformity chemical vapor deposition titanium film
04/20/1999US5895266 Sputter depositing titanium layer,oxygenating, sputter depisiting titanium nitride layer oxygenating
04/20/1999US5895264 Method for forming stacked polysilicon
04/20/1999US5895263 Process for manufacture of integrated circuit device
04/20/1999US5895262 Methods for etching fuse openings in a semiconductor device
04/20/1999US5895261 Process for making integrated circuit structure comprising local area interconnects formed over semiconductor substrate by selective deposition on seed layer in patterned trench
04/20/1999US5895260 Method of fabricating semiconductor devices and the devices
04/20/1999US5895259 Polysilicon diffusion doping method employing a deposited doped oxide layer with a highly uniform thickness
04/20/1999US5895258 Semiconductor device fabrication method
04/20/1999US5895257 LOCOS field oxide and field oxide process using silicon nitride spacers
04/20/1999US5895256 Method for manufacturing LOCOS structure
04/20/1999US5895255 Shallow trench isolation formation with deep trench cap
04/20/1999US5895254 Method of manufacturing shallow trench isolation structure
04/20/1999US5895253 Trench isolation for CMOS devices
04/20/1999US5895252 Field oxidation by implanted oxygen (FIMOX)
04/20/1999US5895251 Method for forming a triple-well in a semiconductor device
04/20/1999US5895250 Method of forming semicrown-shaped stacked capacitors for dynamic random access memory
04/20/1999US5895249 Integrated edge structure for high voltage semiconductor devices and related manufacturing process
04/20/1999US5895248 Silicon deposited from a vapor comprising chlorine and silicon at reduced pressure
04/20/1999US5895247 Method of forming a high performance, high voltage non-epi bipolar transistor
04/20/1999US5895246 Method of making semiconductor device with air gap between the gate electrode and substrate during processing
04/20/1999US5895245 Plasma ash for silicon surface preparation
04/20/1999US5895244 Process to fabricate ultra-short channel nMOSFETs with self-aligned silicide contact
04/20/1999US5895243 Semiconductor processing method of providing electrical isolation between adjacent semiconductor diffusion regions of different field effect transistors and integrated circuitry having adjacent electrically isolated field effect transistors
04/20/1999US5895242 Read-only memories and method for manufacturing the same
04/20/1999US5895241 Method for fabricating a cell structure for mask ROM
04/20/1999US5895240 Method of making stepped edge structure of an EEPROM tunneling window
04/20/1999US5895239 Method for fabricating dynamic random access memory (DRAM) by simultaneous formation of tungsten bit lines and tungsten landing plug contacts
04/20/1999US5895238 Doping technique for MOS devices
04/20/1999US5895237 Narrow isolation oxide process
04/20/1999US5895236 Efficient removal of a pollution heavy metal in a silicon substrate
04/20/1999US5895234 Semiconductor device and method for producing the same
04/20/1999US5895231 External terminal fabrication method for semiconductor device package
04/20/1999US5895229 Enhanced reliability solder bump interconnections;dispensing polymeric precursor into mold, curing to encapsulate integrated circuit die
04/20/1999US5895226 Method of manufacturing semiconductor device
04/20/1999US5895223 Dipping nitride chip and electrode in electrolysis liquid and irradiating; connecting first electrode to a second electrode by a galvanometer to monitor etching current and depth
04/20/1999US5895222 Encapsulant dam standoff for shell-enclosed die assemblies
04/20/1999US5895191 Sealable, transportable container adapted for horizontal loading and unloading
04/20/1999US5894983 High frequency, low temperature thermosonic ribbon bonding process for system-level applications
04/20/1999US5894982 Connecting apparatus
04/20/1999US5894853 Mixing waste cleaning liquids from first and second stages,recycling, cleaning the treated body at a higher flow rate in first stage than the second stage
04/20/1999US5894852 Removal and scrubbing of loose particles and titanium accumulations
04/20/1999US5894760 Substrate transport drive system
04/20/1999US5894742 Methods and systems for delivering an ultra-pure gas to a point of use
04/20/1999US5894711 Box handling apparatus and method
04/20/1999US5894659 Method for inspecting lead frames in a tape lead bonding system
04/20/1999US5894657 Mounting apparatus for electronic component
04/20/1999US5894651 Actuator/sensor package, graphite-epoxy laminate structures, bonding lead wire, non-conductive fiber, cured, aerospace applications
04/20/1999US5894622 Brush conditioner wing
04/20/1999CA2092333C Built-in self-test control network
04/20/1999CA2077463C System and method for precision cleaning by jet spray
04/15/1999WO1999018766A1 Method for mounting semiconductor element to circuit board, and semiconductor device
04/15/1999WO1999018617A1 Group iii nitride photonic devices on silicon carbide substrates with conductive buffer interlayer structure
04/15/1999WO1999018616A1 Nonvolatile semiconductor memory device and method of producing the same
04/15/1999WO1999018609A1 Chip scale ball grid array for integrated circuit package
04/15/1999WO1999018608A1 METHOD FOR PRODUCING A MATRIX FROM THIN-FILM TRANSISTORS, INCLUDING WITH a:Si-H AS SEMICONDUCTOR, INTENDED FOR LIQUID CRYSTAL DISPLAYS
04/15/1999WO1999018606A1 Diamond-based microactuator
04/15/1999WO1999018605A1 Method for mechanochemical post-polish cleaning of an oxide or nitride layer deposited on a substrate
04/15/1999WO1999018603A1 Modular substrate processing system
04/15/1999WO1999018602A1 Foam-based heat exchanger with heating element