Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/1999
03/30/1999US5888676 Miniatuization using multiple reticle-subfield exposures per die
03/30/1999US5888675 Obtaining the lens error in terms of image displacement data, and structurally modifying a reticle using the image displacement data so that the reticle compensates for the lense error
03/30/1999US5888674 Method of manufacturing a halftone phase shift mask
03/30/1999US5888633 Micro-structures having structural members capable of withstanding permanent bend
03/30/1999US5888630 Metal layers with equal coefficients of thermal expansion
03/30/1999US5888606 Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
03/30/1999US5888591 Chemical vapor deposition of fluorocarbon polymer thin films
03/30/1999US5888588 Process for forming a semiconductor device
03/30/1999US5888585 Applying a liquid precursor containing barium, strontium, and niobium, treating by baking, annealing, or exposing to vacuum to form the non-ferroelectric oxide; memory cell capacitors
03/30/1999US5888583 Misted deposition method of fabricating integrated circuits
03/30/1999US5888414 Plasma reactor and processes using RF inductive coupling and scavenger temperature control
03/30/1999US5888410 Dry etching method and manufacturing method of manufacturing EL element using same
03/30/1999US5888344 Controlled temperature of processing and supplementary liquids so that sudden boiling of supplementary liquid does not occur
03/30/1999US5888338 Magnetron plasma processing apparatus and processing method
03/30/1999US5888337 Endpoint detector for plasma etching
03/30/1999US5888327 Pellicle pasting system and method
03/30/1999US5888309 Lateral etch inhibited multiple for forming a via through a microelectronics layer susceptible to etching within a fluorine containing plasma followed by an oxygen containing plasma
03/30/1999US5888304 Heater with shadow ring and purge above wafer surface
03/30/1999US5888298 Member-handling mechanism, and member-handling jig for a crystal pulling apparatus
03/30/1999US5888297 Method of fabricating SOI substrate
03/30/1999US5888296 Method for making a ferroelectric semiconductor device and a layered structure
03/30/1999US5888295 Method of forming a silicon film
03/30/1999US5888294 Epitaxial growth rate varying method for side surface of semiconductor pattern
03/30/1999US5888293 Material supplied for fabricating single-crystal semiconductor
03/30/1999US5888127 Apparatus to hold and remove an integrated circuit chip on a cutting chuck
03/30/1999US5888126 Polishing apparatus including turntable with polishing surface of different heights
03/30/1999US5888124 Apparatus for polishing and cleaning a wafer
03/30/1999US5888120 Method and apparatus for chemical mechanical polishing
03/30/1999US5888048 Automatic wafer boat loading
03/30/1999US5888042 Semiconductor wafer transporter
03/30/1999US5887974 Slurry mixing apparatus and method
03/30/1999US5887721 Wafer carrier box
03/30/1999US5887607 Wafer processing apparatus
03/30/1999US5887605 Apparatus for cleaning semiconductor wafers
03/30/1999US5887604 Washing apparatus, and washing method
03/30/1999US5887602 Cleaning machine and method of controlling the same
03/30/1999US5887343 Direct chip attachment method
03/30/1999CA2181846C Inp/ingaas monolithic integrated demultiplexer, photodetector, and heterojunction bipolar transistor
03/30/1999CA2134019C Solder ball connections and assembly process
03/30/1999CA2132332C Removal of surface contaminants by irradiation
03/30/1999CA2115596C Capacitive proximity monitoring device for corrosive atmosphere environment
03/30/1999CA2106750C Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins
03/26/1999CA2248385A1 Protective layer for integrated circuits and method for the manufacturing thereof
03/25/1999WO1999014855A1 Electrical impedance matching system and method
03/25/1999WO1999014808A1 Memory location arrangement and method for producing the same
03/25/1999WO1999014804A1 CO-PLANAR Si AND Ge COMPOSITE SUBSTRATE AND METHOD OF PRODUCING SAME
03/25/1999WO1999014803A1 Microelectronics structure comprising a low voltage part provided with protection against a high voltage part and method for obtaining said protection
03/25/1999WO1999014802A1 Method for producing insulation areas between transistors
03/25/1999WO1999014801A1 Method of washing semiconductor substrate and method of producing semiconductor devices using the same method
03/25/1999WO1999014800A1 Method and apparatus for high-performance integrated circuit interconnect fabrication
03/25/1999WO1999014799A1 Methods for forming shallow junctions in semiconductor wafers
03/25/1999WO1999014798A1 A fluorometric method for increasing the efficiency of the rinsing and water recovery process in the manufacture of semiconductor chips
03/25/1999WO1999014797A1 Compliant universal substrates for epitaxial growth
03/25/1999WO1999014796A1 Plasma chamber support having an electrically coupled collar ring
03/25/1999WO1999014795A1 Semiconductor wafer carrier
03/25/1999WO1999014792A1 Adjustment of deposition uniformity in an inductively coupled plasma source
03/25/1999WO1999014790A1 Resistive heating of power coil to reduce transient heating/start up effects
03/25/1999WO1999014789A1 Vacuum plasma processor having coil with intermediate portion coupling lower magnetic flux density to plasma than center and peripheral portions of the coil
03/25/1999WO1999014788A1 Shield or ring surrounding semiconductor workpiece in plasma chamber
03/25/1999WO1999014787A2 Method for producing plasma by microwave irradiation
03/25/1999WO1999014786A1 Apparatus and method for improved scanning efficiency in an ion implanter
03/25/1999WO1999014784A2 Vacuum plasma processor having coil with added conducting segments to its peripheral part
03/25/1999WO1999014761A1 Ferroelectric memory cell with shunted ferroelectric capacitor and method of making same
03/25/1999WO1999014760A1 Memory location arrangement and its use as a magnetic ram and as an associative memory
03/25/1999WO1999014754A1 Optical disc, recording apparatus, and computer-readable recording medium
03/25/1999WO1999014706A2 Visual inspection and verification system
03/25/1999WO1999014699A1 System and method for monitoring and controlling gas plasma processes
03/25/1999WO1999014638A1 Design rule checking system and method
03/25/1999WO1999014575A1 Improved sample inspection system
03/25/1999WO1999014565A1 Temperature probe
03/25/1999WO1999014555A1 Lever arm for a scanning microscope
03/25/1999WO1999014404A1 Method of making a structure with improved material properties by moderate heat treatment of a metal deposit
03/25/1999WO1999014395A1 Process tube with in situ gas preheating
03/25/1999WO1999014394A1 Device and method for detecting and preventing arcing in rf plasma systems
03/25/1999WO1999013974A1 Ampule with integral filter
03/25/1999WO1999009585B1 Semiconductor substrate and semiconductor device
03/25/1999WO1999001586A3 Device for transferring structures
03/25/1999WO1998059374A3 Insulated gate power semiconductor device having a semi-insulating semiconductor substrate
03/25/1999WO1998051819A9 Methods for electronic fluorescent perturbation for analysis and electronic perturbation catalysis for synthesis
03/25/1999DE19842668A1 Treatment mechanism with liquid reservoir for cleaning semiconductor wafers, or LCD substrates
03/25/1999DE19836031A1 Vias are produced in inter-metal dielectrics of semiconductor components
03/25/1999DE19803487C1 Heating apparatus for wafer CVD coating unit
03/25/1999DE19758488A1 Material and process for manufacturing composite plastic components, especially electrical components
03/25/1999DE19755134C1 High voltage (HV) semiconductor MOSFET switch
03/25/1999DE19741725A1 Silicon carbide is p-doped with a low resistivity, high hole mobility layer
03/25/1999DE19740763A1 Cantilever arm manufacturing method for atomic force microscope (AFM)
03/25/1999DE19733062A1 Integrated circuit feeder for integrated circuit automatic handling apparatus
03/25/1999CA2302758A1 Co-planar si and ge composite substrate and method of producing same
03/25/1999CA2302739A1 Lever arm for a scanning microscope
03/25/1999CA2248524A1 Semiconductor device manufacturing apparatus
03/24/1999EP0903828A1 Improved device for the protection of an integrated circuit against electrostatic discharges
03/24/1999EP0903792A2 Method of manufacturing a plurality of semiconductor bodies
03/24/1999EP0903789A2 Nonvolatile semiconductor storage apparatus and production method of the same
03/24/1999EP0903788A2 Non volatile memory cell with high coupling capacity
03/24/1999EP0903787A2 Device for reducing noise in microwave transistors and method for its fabrication
03/24/1999EP0903784A2 Improved techniques for forming electrically blowable fuses on an integrated circuit
03/24/1999EP0903783A1 Realization of an intermetallic capacitor
03/24/1999EP0903782A2 DRAM trench capacitor with enlarged surface
03/24/1999EP0903781A2 Method of forming embedded copper interconnections and embedded copper interconnection structure
03/24/1999EP0903780A2 Method and apparatus for a wire bonded package for integrated circuits
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