| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/15/1999 | WO1999018601A1 Robot blade with dual offset wafer supports |
| 04/15/1999 | WO1999018600A1 Apparatus and method for cleaning semiconductor wafer |
| 04/15/1999 | WO1999018599A2 Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder |
| 04/15/1999 | WO1999018594A1 Apparatus for process monitoring of a semiconductor wafer and a method of fabricating same |
| 04/15/1999 | WO1999018578A1 Memory cell arrangement |
| 04/15/1999 | WO1999018478A1 Antireflection or light-absorbing coating composition and polymer therefor |
| 04/15/1999 | WO1999018447A1 Burn-in board with adaptable heat sink device |
| 04/15/1999 | WO1999018016A1 Slippable roller conveyor for a cleanroom |
| 04/15/1999 | WO1999009599A3 Vertical interconnect process for silicon segments with dielectric isolation |
| 04/15/1999 | WO1999009586A3 Method for forming titanium silicide and titanium by cvd |
| 04/15/1999 | WO1999005701A3 Composite electrical contact structure and method for manufacturing the same |
| 04/15/1999 | WO1999000706A9 Transferring a programmable pattern by photon lithography |
| 04/15/1999 | DE19839186A1 Semiconductor chip production process employs a protective layer |
| 04/15/1999 | DE19838063A1 New electrically insulating thin film system |
| 04/15/1999 | DE19824209A1 Semiconductor memory device with shunt connection for e.g. SRAM |
| 04/15/1999 | DE19824208A1 Fault analysis method for defect detection in semiconductor device |
| 04/15/1999 | DE19824207A1 Semiconductor device substrate has a thick oxide layer at its edge section |
| 04/15/1999 | DE19808327A1 Fuel injector has a piezoelectric or thermo-pneumatic micro-actuator |
| 04/15/1999 | DE19807460A1 Annular housing for rotary carrier in semiconductor wafer processing |
| 04/15/1999 | DE19744098A1 LCD screen TFT matrix is produced using only three lacquering steps |
| 04/15/1999 | DE19744095A1 Memory cell array has stacked layer magnetoresistive effect layer memory elements |
| 04/15/1999 | DE19743496A1 Insulating layer for an active diamond layer of a microelectronic component |
| 04/15/1999 | DE19743495A1 Insulating layer between an electrode and an active diamond layer of a microelectronic component |
| 04/15/1999 | DE19742327A1 Method for coating metal components and other rigid articles |
| 04/15/1999 | CA2485328A1 Quantum efficiency improvements in active pixel sensors |
| 04/14/1999 | EP0909119A2 Method for adhering a metallization to a substrate |
| 04/14/1999 | EP0909033A2 Rectifying transfer gate circuit |
| 04/14/1999 | EP0909021A2 Transimpedance pre-amplifier for optical communication |
| 04/14/1999 | EP0908987A2 Method for manufacturing semiconductor element |
| 04/14/1999 | EP0908954A2 Semiconductor memory device and manufacturing method thereof |
| 04/14/1999 | EP0908951A2 Improved air isolated crossovers |
| 04/14/1999 | EP0908950A2 Integrated circuit |
| 04/14/1999 | EP0908948A2 Shallow trench isolation for DRAM trench capacitor |
| 04/14/1999 | EP0908947A2 Method for fabricating semiconductor device with pMIS transistor |
| 04/14/1999 | EP0908946A2 Improved gapfill of semiconductor structure using doped silicate glasses |
| 04/14/1999 | EP0908945A2 Dual damascene with self aligned via interconnects |
| 04/14/1999 | EP0908944A1 Electrical characterisation of an insulating layer on a conductive or semiconductive substrate |
| 04/14/1999 | EP0908942A2 Improved nitride etch stop layer |
| 04/14/1999 | EP0908941A2 Deposition of carbon into nitride layer for improved selectivity of oxide to nitride etchrate for self aligned contact etching |
| 04/14/1999 | EP0908940A2 Anisotropic and selective nitride etch process |
| 04/14/1999 | EP0908939A2 Method of mechanical polishing |
| 04/14/1999 | EP0908938A2 Buffer layer for improving control of layer thickness |
| 04/14/1999 | EP0908937A2 Hard etch mask |
| 04/14/1999 | EP0908936A2 Formation of a bottle shaped trench |
| 04/14/1999 | EP0908935A2 Fabrication method of semiconductor device equipped with silicide layer |
| 04/14/1999 | EP0908934A2 Method of manufacturing a gate electrode |
| 04/14/1999 | EP0908933A1 Process for bonding crystalline substrates with different crystal lattices |
| 04/14/1999 | EP0908932A2 Semiconductor wafer holder with cvd silicon carbide film coating |
| 04/14/1999 | EP0908931A2 Conveying apparatus |
| 04/14/1999 | EP0908929A2 Method of fixing a plurality of lower members each having reference bore for installing upper member, and fixing jigs |
| 04/14/1999 | EP0908928A2 Baking furnace and control method therefor |
| 04/14/1999 | EP0908927A2 Semiconductor wafer transfer apparatus |
| 04/14/1999 | EP0908923A2 Method and apparatus to produce large inductive plasma for plasma processing |
| 04/14/1999 | EP0908896A2 A virtual ground type semiconductor storage device |
| 04/14/1999 | EP0908786A2 Process for reducing shrinkage of features formed in a photoresist by treatment with an amine, an amide or an aldehyde |
| 04/14/1999 | EP0908782A1 Photolithographic processing method |
| 04/14/1999 | EP0908781A2 Photolithographic processing method and apparatus |
| 04/14/1999 | EP0908664A2 Methods and systems for delivering an ultra-pure gas to a point of use |
| 04/14/1999 | EP0908499A1 Curable silicone composition and electronic components |
| 04/14/1999 | EP0908425A1 Zirconia sintered body, process for production thereof, and application thereof |
| 04/14/1999 | EP0908076A1 Grid array assembly and method of making |
| 04/14/1999 | EP0907968A1 Integrated circuit device and method of making the same |
| 04/14/1999 | EP0907967A2 Soi-transistor circuitry employing soi-transistors and method of manufacture thereof |
| 04/14/1999 | EP0907964A1 Methods and apparatuses for clamping and declamping a semiconductor wafer in a wafer processing system |
| 04/14/1999 | EP0907963A1 Solder bump apparatus, electronic component and method for forming a solder bump |
| 04/14/1999 | EP0907962A1 Method and apparatus for reducing warpage in semiconductor packages |
| 04/14/1999 | EP0907906A1 Lithography exposure device and lithography procedures |
| 04/14/1999 | EP0907905A1 Process for modulating interferometric lithography patterns to record selected discrete patterns in photoresist |
| 04/14/1999 | EP0907489A1 Improvement in injection molding apparatus |
| 04/14/1999 | EP0907481A1 Injection molding apparatus and method |
| 04/14/1999 | EP0907461A1 Grinding machine spindle flexibly attached to platform |
| 04/14/1999 | EP0907460A1 Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers |
| 04/14/1999 | EP0857150A4 300mm MICROENVIRONMENT POD WITH DOOR ON SIDE |
| 04/14/1999 | EP0854829A4 300 mm SHIPPING CONTAINER |
| 04/14/1999 | EP0829097A4 Method of transfer molding electronic packages and packages produced thereby |
| 04/14/1999 | EP0784517B1 Process and device for thoroughly cleaning surfaces |
| 04/14/1999 | EP0620931B1 Mask for photolithography |
| 04/14/1999 | EP0494184B1 Mos device with integral esd protection |
| 04/14/1999 | CN2314365Y Vacuum low temperature making apparatus for optic measure of semiconductor |
| 04/14/1999 | CN1214150A Semiconductor device |
| 04/14/1999 | CN1213879A Protective circuit and electric circuit using protective circuit |
| 04/14/1999 | CN1213863A Nitrided gallium III-V group compound semiconductor device and its mfg.method |
| 04/14/1999 | CN1213860A Field-effect transistor with trench isolation structure and method for manufacturing the same |
| 04/14/1999 | CN1213858A 半导体装置 Semiconductor device |
| 04/14/1999 | CN1213857A Reducing oxidation stress in fabrication of devices |
| 04/14/1999 | CN1213856A Method of linear arrange of metallic fuse section used on crystal chips |
| 04/14/1999 | CN1213855A 半导体器件 Semiconductor devices |
| 04/14/1999 | CN1213854A Semiconductor package incorporating heat dispersion plate inside resin molding and fabrication method for the same |
| 04/14/1999 | CN1213852A Semiconductor device and method of manufacturing the same |
| 04/14/1999 | CN1213851A Copper stud structure with refractory metal liner |
| 04/14/1999 | CN1213850A Semiconductor device manufacturing method press die and guide rail |
| 04/14/1999 | CN1213849A Making method of transistor |
| 04/14/1999 | CN1213848A Spatially uniform gas supply and pump configuration for large wafer diameters |
| 04/14/1999 | CN1213847A Substrate cleaning method and apparatus |
| 04/14/1999 | CN1213846A Method of manufacturing semiconductor device using phase transition |
| 04/14/1999 | CN1213845A Method and apparatus for minimizing dopant outdiffusion in gate structure |
| 04/14/1999 | CN1213844A Electronic device and its mfg. method |
| 04/14/1999 | CN1213843A Processing method of semiconductor substrate and semiconductor substrate |
| 04/14/1999 | CN1213837A Method of sealing electronic parts with resin |
| 04/14/1999 | CN1213834A High density semiconductor memory having diagonal bit lines and dual word lines |