Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1999
05/11/1999US5902117 PN-diode of SiC and a method for production thereof
05/11/1999US5902103 Vertical furnace of a semiconductor manufacturing apparatus and a boat cover thereof
05/11/1999US5902102 Diffusion furnace used for semiconductor device manufacturing process
05/11/1999US5902088 Single loadlock chamber with wafer cooling function
05/11/1999US5901901 Semiconductor assembly with solder material layer and method for soldering the semiconductor assemly
05/11/1999US5901896 Balanced low mass miniature wire clamp
05/11/1999US5901829 Method of positioning an I.C. and IC handler utilizing said method
05/11/1999US5901751 Restrictor shield having a variable effective throughout area
05/11/1999US5901716 Wafer cleaning apparatus with rotating cleaning solution injection nozzles
05/11/1999US5901436 Method of manufacturing lead frame
05/11/1999US5901403 Scrubber brush
05/11/1999US5901399 Flexible-leaf substrate edge cleaning apparatus
05/11/1999CA2131044C Waterborne photoresists having associate thickeners
05/11/1999CA2079696C Semiconductor integrated circuit device with fault detecting function
05/06/1999WO1999022409A2 Semiconductor device comprising a half-bridge circuit
05/06/1999WO1999022408A1 Vertical mos transistor and method for the production thereof
05/06/1999WO1999022407A1 Lateral silicon carbide semiconductor device having a drift region with a varying doping level
05/06/1999WO1999022406A1 Trench ic and method of making
05/06/1999WO1999022403A1 Process and apparatus for preparation of epitaxial silicon layers free of grown-in defects
05/06/1999WO1999022402A2 Rapid thermal processing (rtp) system with rotating substrate
05/06/1999WO1999022401A1 Device for applying a viscous fluid
05/06/1999WO1999022396A2 Enhanced macroparticle filter and cathode arc source
05/06/1999WO1999022320A1 Method for calculating propagation delay time of logic circuit
05/06/1999WO1999022311A1 Software system and method for graphically building customized recipe flowcharts
05/06/1999WO1999022310A1 Software system and method for extending classifications and attributes in production analysis
05/06/1999WO1999022279A2 Process for determining possible configurations of machining plants
05/06/1999WO1999022272A1 Lithographic pneumatic support device with controlled gas supply
05/06/1999WO1999022212A1 Structure equipped with electric contacts formed through said structure substrate and method for obtaining said structure
05/06/1999WO1999022165A1 Gas panel
05/06/1999WO1999022043A1 New deposition systems and processes for transport polymerization and chemical vapor deposition
05/06/1999WO1999021924A1 Precursors for making low dielectric constant materials with improved thermal stability
05/06/1999WO1999021706A1 Low dielectric constant materials prepared from photon or plasma assisted cvd
05/06/1999WO1999021652A2 Nanostructures
05/06/1999WO1999014787A3 Method for producing plasma by microwave irradiation
05/06/1999WO1999014706A3 Visual inspection and verification system
05/06/1999WO1999013499A3 In-situ acceptor activation in group iii-v nitride compound semiconductors
05/06/1999WO1999013495A3 Sealed cabinet for storage of semiconductor wafers
05/06/1999WO1999013489A3 Apparatus for improving etch uniformity and methods therefor
05/06/1999WO1999012189A3 Method of making two-component nanospheres and their use as a low dielectric constant material for semiconductor devices
05/06/1999WO1999012170A3 A ferroelectric data processing device
05/06/1999WO1999010566A3 Process chamber and method for depositing and/or removing material on a substrate
05/06/1999WO1999008328A9 Integrated electric circuit with capacitor
05/06/1999WO1998038701A9 Connecting structure, liquid crystal device, electronic equipment, anisotropic conductive adhesive, and method for manufacturing the adhesive
05/06/1999EP0914027A1 Film-like adhesive for connecting circuit and circuit board
05/06/1999EP0913871A1 Nonvolatile memory point
05/06/1999EP0913864A1 Mounting structure of semiconductor bare chip
05/06/1999EP0913863A2 Method of manufacturing semiconductor device with copper wiring film
05/06/1999EP0913862A1 Floating gate memory with high and low voltage transistors
05/06/1999EP0913860A2 Method of manufacturing a thin film transistor
05/06/1999EP0913859A1 Semiconductor device and method for manufacturing the same
05/06/1999EP0913858A1 Method for thinning a semoiconductor wafer
05/06/1999EP0913857A1 Method and device for positioning the bonding head of a bonder, in particular a die bonder
05/06/1999EP0913850A1 Narrow titanium-containing wire, process for producing narrow titanium-containing wire, structure, and electron-emitting device
05/06/1999EP0913833A2 Non-volatile semiconductor memory device
05/06/1999EP0913831A2 Space-efficient master data line (MDQ) switch placement
05/06/1999EP0913755A2 Voltage converter
05/06/1999EP0913719A2 Connection terminal structure for liquid crystal display and semiconductor device, and method of producing the same
05/06/1999EP0913508A2 Carbon nanotube device, manufacturing method of carbon nanotube device, and electron emitting device
05/06/1999EP0913442A2 Polishing method
05/06/1999EP0913429A2 Siloxane-modified polyamideimide resin composition adhesive film, adhesive sheet and semiconductor device
05/06/1999EP0913372A1 Aluminum nitride substrate and process for producing the same
05/06/1999EP0913237A1 Robot for handling
05/06/1999EP0913236A2 Articulated robot
05/06/1999EP0913233A2 Polishing solution supply system
05/06/1999EP0913074A1 Plasma etch reactor and method for emerging films
05/06/1999EP0913001A1 Multi-layer film capacitor structures and method
05/06/1999EP0912999A2 SiC SEMICONDUCTOR DEVICE COMPRISING A pn JUNCTION WITH A VOLTAGE ABSORBING EDGE
05/06/1999EP0912998A1 Method for cmos latch-up improvement by mev billi (buried implanted layer for lateral isolation) plus buried layer implantation
05/06/1999EP0912996A1 Integrated circuit which uses an etch stop for producing staggered interconnect lines
05/06/1999EP0912995A1 Semiconductor component with low contact resistance to highly doped regions
05/06/1999EP0912994A1 Modular semiconductor workpiece processing tool
05/06/1999EP0912649A1 Heat-setting single-component lva (low-viscosity adhesive) system for bonding in the micro-range
05/06/1999EP0912351A1 Rigid thin windows for vacuum applications
05/06/1999EP0912259A1 Wet processing methods for the manufacture of electronic components using sequential chemical processing
05/06/1999EP0815595A4 UNCOOLED YBaCuO THIN FILM INFRARED DETECTOR
05/06/1999EP0745235B1 Photomask blanks
05/06/1999EP0674798B1 Memory device
05/06/1999EP0462209B1 Electron cyclotron resonance plasma source and method of operation
05/06/1999DE19844710A1 Integrated semiconductor circuit with lateral bipolar transistor
05/06/1999DE19837016A1 Integrated semiconductor device with multi-bank memory for e.g. microprocessor
05/06/1999DE19835429A1 CMOS SRAM cell has a symmetrical arrangement of active regions and gate lines
05/06/1999DE19829863A1 Dry etching reaction products are removed in a semiconductor device production process
05/06/1999DE19829472A1 Semiconductor device has a fusible link portion which can be severed by low energy laser light
05/06/1999DE19824242A1 Semiconductor manufacture process
05/06/1999DE19822763A1 Power semiconductor device has a doped, oxygen-containing semiconductor substrate
05/06/1999DE19810003A1 Semiconductor device production process involves etching a doped polysilicon layer in the presence of carbon-containing and oxygen-containing gases
05/06/1999DE19755051C1 Method of applying quantum points to surfaces for manufacturing semiconductors
05/06/1999DE19749962A1 Misfit dislocation density is quantitatively determined in silicon-germanium HBT layer stacks
05/06/1999DE19748709A1 Semiconductor chip mounting frame for chip encapsulation
05/06/1999DE19748666A1 Semiconductor component is produced with high circuit complexity to hinder piracy and manipulation
05/06/1999DE19747846A1 Bauelement und Verfahren zum Herstellen des Bauelements Device and method for manufacturing the component
05/06/1999DE19747816A1 Production of surface-structured substrates used in the manufacture of electronic components
05/06/1999DE19747815A1 Production of surface-structured substrates used in the manufacture of electronic components
05/06/1999DE19747574A1 Verfahren zur Ermittlung realisierbarer Konfigurationen von Bearbeitungsanlagen Procedure for the determination of feasible configurations of processing plants
05/06/1999DE19747559A1 Multilevel interconnect structure for high density integrated circuit devices, integrated circuit memories
05/06/1999DE19747376A1 Capacitively measuring the distance from a semiconducting surface, e.g. for measuring the flatness and thickness of semiconducting surfaces
05/06/1999DE19747164A1 Substrate disc processing apparatus for simulation of silicon micro process
05/06/1999DE19746901A1 Vertical MOS transistor manufacture method for nano-electronics
05/06/1999DE19746900A1 Vertikaler MOS-Transistor und Verfahren zu dessen Herstellung Vertical MOS transistor and method of producing the
05/06/1999CA2308302A1 Nanometric structures
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