Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1999
05/04/1999US5899748 Tetraethoxysilane
05/04/1999US5899747 Method for forming a tapered spacer
05/04/1999US5899746 Method of forming pattern
05/04/1999US5899745 Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor
05/04/1999US5899744 Method of manufacturing semiconductor wafers
05/04/1999US5899743 Method for fabricating semiconductor wafers
05/04/1999US5899742 Manufacturing method for self-aligned local interconnects and contacts simultaneously
05/04/1999US5899741 Method of manufacturing low resistance and low junction leakage contact
05/04/1999US5899740 Methods of fabricating copper interconnects for integrated circuits
05/04/1999US5899739 Semiconductor device and method of manufacturing the same
05/04/1999US5899738 Method for making metal plugs in stacked vias for multilevel interconnections and contact openings while retaining the alignment marks without requiring extra masking steps
05/04/1999US5899737 Method of attaching solder balls to a substrate
05/04/1999US5899736 On a semiconductor substrate
05/04/1999US5899735 Method for making low-resistance contacts between polysilicon and metal silicide on semiconductor integrated circuits
05/04/1999US5899734 Method of fabricating semiconductor device
05/04/1999US5899733 Method for the implantation of dopant
05/04/1999US5899732 Method of implanting silicon through a polysilicon gate for punchthrough control of a semiconductor device
05/04/1999US5899731 Method of fabricating a semiconductor wafer
05/04/1999US5899730 Method of handling semiconductor wafers, bars and chips
05/04/1999US5899729 Method and apparatus for the manufacture of a semiconductor integrated circuit device having discontinuous insulating regions
05/04/1999US5899728 Method of forming a lithographic mask
05/04/1999US5899727 Method for forming a field dielectric
05/04/1999US5899726 Method of forming oxide isolation in a semiconductor device
05/04/1999US5899725 Method of forming a hemispherical grained silicon on refractory metal nitride
05/04/1999US5899724 Method for fabricating a titanium resistor
05/04/1999US5899723 Oblique implantation in forming base of bipolar transistor
05/04/1999US5899722 Method of forming dual spacer for self aligned contact integration
05/04/1999US5899721 Method of based spacer formation for ultra-small sapcer geometries
05/04/1999US5899720 Process of fabricating salicide structure from high-purity reproducible cobalt layer without sacrifice of leakage current and breakdown voltage of P-N junction
05/04/1999US5899719 Sub-micron MOSFET
05/04/1999US5899718 Method for fabricating flash memory cells
05/04/1999US5899717 Method for fabricating semiconductor device
05/04/1999US5899716 Method of fabricating a dynamic random access memory device
05/04/1999US5899715 Method to form a capacitor for high density DRAM cell
05/04/1999US5899714 Fabrication of semiconductor structure having two levels of buried regions
05/04/1999US5899713 Method of making NVRAM cell with planar control gate
05/04/1999US5899712 Method for fabricating silicon-on-insulator device
05/04/1999US5899711 Method for enhancing hydrogenation of thin film transistors using a metal capping layer and method for batch hydrogenation
05/04/1999US5899710 Method for forming field effect transistor having multiple gate electrodes surrounding the channel region
05/04/1999US5899709 Method for forming a semiconductor device using anodic oxidation
05/04/1999US5899708 Method for forming a thin film transistor using an electrostatic shield
05/04/1999US5899706 Method of reducing loading variation during etch processing
05/04/1999US5899705 Stacked leads-over chip multi-chip module
05/04/1999US5899702 Methods for measuring surface area
05/04/1999US5899701 Method for making silica strain test structures
05/04/1999US5899690 Thermal processing apparatus for semiconductor wafer
05/04/1999US5899658 Substrate transfer device
05/04/1999US5899653 Apparatus for lifting an object in a chamber
05/04/1999US5899548 Liquid crystal display device and method for manufacturing same
05/04/1999US5899375 Bump bonder with a discard bonding area
05/04/1999US5899341 Method of and apparatus for transporting lead frame
05/04/1999US5899216 Apparatus for rinsing wafers in the context of a combined cleaning rinsing and drying system
05/04/1999US5899140 Bump levelling method and bump levelling apparatus
05/04/1999US5899001 Laminar flow system for drying critical parts
05/04/1999US5898982 Thin film capacitors
05/04/1999CA2102721C Differential gain stage for use in a standard bipolar ecl process
05/04/1999CA2075462C Bump structure and method for bonding to a semi-conductor device
04/1999
04/30/1999CA2239356A1 Electronic coatings having low dielectric constant
04/29/1999WO1999021274A2 Integrated electronic circuit comprising an oscillator with passive circuit elements
04/29/1999WO1999021233A1 Process for fabricating organic semiconductor devices using ink-jet printing technology and device and system employing same
04/29/1999WO1999021226A1 Chip scale package using large ductile solder balls
04/29/1999WO1999021223A1 Wafer transfer device
04/29/1999WO1999021222A1 Silicon and oxygen ion co-implantation for metallic gettering in epitaxial wafers
04/29/1999WO1999021221A1 Methods of forming conductive components and conductive lines
04/29/1999WO1999021220A1 Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
04/29/1999WO1999021219A1 Method of oxidation of semiconductor wafers in a rapid thermal processing (rtp) system
04/29/1999WO1999021218A1 Self-aligned contact etch using difluoromethane and trifluoromethane
04/29/1999WO1999021217A1 Anisotropic etching of organic-containing insulating layers
04/29/1999WO1999021216A1 Method for epitactical production of semi-insulating iii-v compound semiconductors
04/29/1999WO1999021215A2 Methods of forming power semiconductor devices having merged split-well body regions therein and devices formed thereby
04/29/1999WO1999021210A1 Monitor of plasma processes with multivariate statistical analysis of plasma emission spectra
04/29/1999WO1999021190A2 Rom and dram fabricated using a dram process
04/29/1999WO1999021060A1 Lens array photolithography
04/29/1999WO1999021021A2 Semiconductor material characterizing method and apparatus
04/29/1999WO1999020925A1 Throttle valve providing cleaning
04/29/1999WO1999020816A1 Method for producing a gallium nitride epitaxial layer
04/29/1999WO1999020812A1 Method for cleaning an etching chamber
04/29/1999WO1999020811A1 Lid assembly for a process chamber employing asymmetric flow geometries
04/29/1999WO1999020809A1 Deposition of coatings using an atmospheric pressure plasma jet
04/29/1999WO1999020552A1 Wafer transport device
04/29/1999WO1999020407A1 Apparatus for treating plate type part with fluid
04/29/1999WO1999002996A3 Multiple point position scanning system
04/29/1999WO1998059087A9 Method for bias sputtering
04/29/1999DE19829813A1 Integrated logic semiconductor circuit with embedded dynamic random access memory
04/29/1999DE19800460A1 Plastic material for electronic applications contains a negative thermal expansion coefficient filler
04/29/1999CA2306899A1 Lens array photolithography
04/29/1999CA2252113A1 Substrate and process for producing the same
04/28/1999EP0911978A1 Generation of temperature compensation low noise symmetrical reference voltages
04/28/1999EP0911975A2 Semiconductor integrated circuit
04/28/1999EP0911974A1 Improved output circuit for integrated circuits
04/28/1999EP0911885A2 Improved columnar-grained polycrystalline solar cell and process of manufacture
04/28/1999EP0911883A2 Bipolar transistor with a SiGe epitaxial base layer and method of fabrication the same
04/28/1999EP0911882A1 Article comprising an oxide layer on GaN, and method of making the article
04/28/1999EP0911879A1 Ferroelectric device for semiconductor integrated circuit and method for manufacturing the same
04/28/1999EP0911878A2 Metalization system
04/28/1999EP0911875A2 Integrated circuit dielectric and method of fabrication thereof
04/28/1999EP0911874A2 Management of a lateral deflection amount of a metal wire in a semiconductor device
04/28/1999EP0911873A2 A bumped tape and bump sheet used in connecting tab tape to semiconductor chip
04/28/1999EP0911872A2 Method of manufacturing thin film transistors
04/28/1999EP0911871A2 Semiconductor memory device with ferroelectric thin film
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